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20 results about "Stress failure" patented technology

Multi-stress coupling environment reliability test method for power utilization information acquisition terminal

The invention relates to the technical field of electrical detection, in particular to a multi-stress coupling environment reliability testing method for an electricity consumption information acquisition terminal. Comprising the steps of applying a combined stress field to an electricity utilization information acquisition terminal through an environment test box; acquiring power utilization information acquisition terminal parameters; the method comprises the following steps of: capturing metering pulse response and carrier communication interaction signals of an electricity utilization information acquisition terminal under the excitation of a combined stress field by utilizing an electrical sensor, extracting carrier signal-to-noise ratio data and metering reference drift data, and generating a reference voltage compensation coefficient and an impedance matching threshold value; projecting the carrier signal-to-noise ratio data to an impedance matching threshold value, and constructing a stress failure envelope surface according to a hardware overload protection threshold value; and mapping the communication quality distortion residual vector to a stress failure envelope surface, and calculating a reliability life prediction value. According to the method, a uniform excitation environment is constructed, and performance degradation of different dimensions is uniformly quantified into accumulative stress damage integral, so that the comprehensive anti-interference capability of the terminal in a multi-stress coupling environment can be truly reflected.
Owner:NANJING SIYU ELECTRIC TECH CO LTD

A method for preparing an ultra-deep hole suitable for three-dimensional stacked chip direct bonding

ActiveCN121646344BSemiconductor chipStress failure
The application relates to a method for preparing an ultra-deep hole suitable for three-dimensional stacked chip direct bonding, which comprises the following steps: providing a semiconductor chip, wherein the chip is made of a functional structure and a first small hole; thinning the chip to a preset thickness or etching a barrier layer; coating the back surface of the chip with glue, aligning the functional structure and alignment structure on the front surface of the chip, exposing, developing; etching an ultra-deep hole on the back surface of the chip, and stopping etching at the first small hole; filling the ultra-deep hole with a second filling material, wherein the second filling material is a low-temperature expansion coefficient material or an equivalent low-temperature expansion coefficient material; and obtaining a thinned chip with an ultra-deep hole. The application has the advantages of reducing the area occupied by the ultra-deep hole with a larger size on the functional structure of the chip, preventing stress failure of the device and other functional structures caused by temperature changes, and improving the reliability and stability of the chip.
Owner:BEIJING ZHONGKE BIANAN INTEGRATED CIRCUIT TECHNOLOGY CO LTD

A method and apparatus for failure assessment of a power device

PendingCN122469126AFailure assessmentStress failure
The present disclosure relates to a power device failure evaluation method and device, the method comprising: obtaining an operating state parameter of the power device; determining whether a stress event occurs to the power device based on whether the operating state parameter meets a first preset condition, and recording a stress parameter corresponding to the stress event; determining whether a stress failure occurs to the power device based on whether a duration of the stress event exceeds a preset time; in the case that the stress failure does not occur to the power device, calculating an aging characteristic parameter of the power device based on the operating state parameter; and determining whether an aging failure occurs to the power device based on whether one of the aging characteristic parameter and the stress parameter meets a corresponding second preset condition. The present disclosure can evaluate the stress failure and the aging failure of the power device occurring in the actual operation process.
Owner:TSINGHUA UNIVERSITY

High-reliability HBM bonding process implementation method

PendingCN122288341ASolve the problem of difficult defect management and controlImprove defect detection rateMicron scaleBonding process
This invention belongs to the field of communication automation technology and discloses a method for implementing a high-reliability HBM bonding process. The invention covers the entire HBM bonding process from wafer pretreatment and precise bonding to post-processing stress control by constructing three core modules: precise pretreatment of the bonding surface, high-precision bonding of heterogeneous wafers, and dynamic stress control after bonding. Employing core technologies such as precise detection and repair of micro-defects on the bonding surface, sub-micron-level alignment of heterogeneous wafers, and dynamic calculation and compensation of bonding interface stress, it overcomes the industry bottlenecks of traditional HBM bonding processes, including "difficulty in controlling bonding surface defects, low alignment accuracy, and easy interface stress failure." It achieves high-cleanliness pretreatment of the HBM bonding surface, sub-micron-level precise bonding of heterogeneous wafers, and dynamic adaptation and control of interface stress after bonding, significantly improving the yield, interface bonding strength, and long-term operational reliability of HBM bonding, thus meeting the advanced packaging requirements of next-generation high-bandwidth memory chips.
Owner:TIANJIN SAIWEI IND TECH CO LTD

A tantalum carbide-based composite coating for high-temperature crystal growth and a preparation method and application thereof

This invention relates to a tantalum carbide-based composite coating for high-temperature crystal growth, its preparation method, and its application. The tantalum carbide-based composite coating includes: a high-temperature resistant substrate; a Ta2C buffer layer formed on the surface of the substrate; a gradient transition layer formed on the Ta2C buffer layer, the chemical composition of which gradually changes from Ta2C phase to TaC phase from bottom to top, with the C / Ta atomic ratio increasing in a gradient distribution within the layer; and a TaC main functional layer formed on the gradient transition layer. Compared with the prior art, this invention maintains the performance of the high-purity TaC main functional layer on the surface, eliminates stress failure caused by CTE mismatch, and also takes into account the interface requirements of different crystals (AlN / SiC).
Owner:SHANGHAI DIANJI UNIV

Low dielectric glass material for integrated circuit package and tgv via preparation method thereof

PendingCN122355582AMeet millimeter wave communication requirementsimprove matchEtchingCopper plating
This invention discloses a low-dielectric glass material, glass-ceramic, and a method for preparing TGV through-holes for integrated circuit packaging. The glass material is composed of SiO2, B2O3, Al2O3, RO, R2O, and rare earth oxides Gd2O3 / La2O3, satisfying a SiO2 / B2O3 molar ratio of 2.0~3.5 and an Al2O3 / (Gd2O3+La2O3) molar ratio of 1:1~4:1. Through the "mixed base-like effect" and lattice distortion effect generated by the Gd2O3 / La2O3 dual doping, a dielectric constant ≤4.6, dielectric loss ≤0.001, and CTE 32~50 × 10⁻⁶ are achieved. ‑7 / °C. Further heat treatment yields a glass-ceramic containing single-crystal β-CaSiO3 phase, with a flexural strength ≥250 MPa. Based on this, laser-induced modification combined with wet etching is used to form TGV vias with an aspect ratio ≥50:1, followed by pulsed copper plating for filling, and low-temperature sealing with Kovar alloy at 975°C. Slow cooling and compressive stress design suppress bubbles and cracks. This invention solves the problems of signal loss, thermal stress failure, and insufficient mechanical strength in high-frequency packaging, and is suitable for RF connectors, MEMS, and 3D system-level packaging.
Owner:SHANGHAI INST OF TECH

A multi-stress coupling environment reliability test method for power utilization information collection terminal

The present application relates to the technical field of electrical detection, in particular to a kind of multi-stress coupling environment reliability test method of power utilization information acquisition terminal.The method includes applying combined stress field to power utilization information acquisition terminal by environmental test chamber;Obtaining power utilization information acquisition terminal parameters;Using electrical sensor to capture the metrology pulse response and carrier communication interaction signal of power utilization information acquisition terminal under the excitation of combined stress field, extracting carrier signal-to-noise ratio data and metrology reference drift data, generating reference voltage compensation coefficient and impedance matching threshold;Project carrier signal-to-noise ratio data to impedance matching threshold, and construct stress failure envelope according to hardware overload protection threshold;Map communication quality distortion residual vector to stress failure envelope, and calculate reliability life prediction value.The present application constructs unified excitation environment, and quantifies the performance degradation of different dimensions as cumulative stress damage integral, which is beneficial to truly reflect the comprehensive anti-interference capability of terminal in multi-stress coupling environment.
Owner:NANJING SIYU ELECTRIC TECH CO LTD

Anti-seismic hollow steel mesh formwork wall structure

The utility model relates to the technical field of building walls, and provides an anti-seismic hollow steel mesh mold wall structure, which comprises a mesh plate, vertical keels and truss ribs, the mesh plate is formed by assembling a plurality of wavy meshes, the wavy meshes are symmetrically arranged and form continuous prismatic hollow holes, the vertical keels are fixed in the prismatic hollow holes, and the truss ribs are fixed on the vertical keels. The truss ribs are symmetrically arranged at the wave trough positions of the screen plate. The truss ribs form a rigid frame in the intervals of the screen plates, positioning deviation caused by vibration of the steel bars is effectively restrained, the truss structure is even in stress, local stress failure risks caused by stress concentration are avoided, meanwhile, the overall structure is modularized, the construction technology is simple and convenient, and the construction efficiency is greatly improved.
Owner:JIANGSU ZHIJU INTELLIGENT CONSTR TECH CO LTD +2

Well wall collapse process prediction method and device, electronic equipment and storage medium

The invention discloses a well wall collapse process prediction method and device, electronic equipment and a storage medium. The method comprises the following steps: establishing a mapping function corresponding to the well wall shape of a target well wall; establishing a complex potential function of a second plane of the well wall shape, determining a first stress corresponding to the well wall shape based on the mapping function and the complex potential function, and converting the first stress into a second stress; the first stress is a stress solution of the second plane; the second stress is a stress solution of the first plane; the second stress is judged based on a stress failure criterion, and an updated well wall shape is obtained according to a judgment result; and if the increment of the collapse depth of the updated well wall shape is larger than a preset increment, the above process is repeated based on the updated well wall shape to update the well wall shape until the increment of the collapse depth of the updated well wall shape is smaller than a preset value, and prediction of the well wall collapse process is completed. According to the method, the mechanical behavior of the rock can be described more accurately, and the collapse evolution behavior and rule can be analyzed more effectively.
Owner:CHINA NAT PETROLEUM CORP +1

Waterproof structure with high crack resistance and high fatigue resistance

The invention discloses a high-crack-resistance and high-fatigue-resistance waterproof structure, belongs to the technical field of building waterproofing, and overcomes the defects that an existing single waterproof coating is poor in crack resistance and fatigue resistance when a stress failure effect is generated due to dynamic change of base layer cracks. A permeable emulsion layer, polyester cloth, an emulsion coating layer and a waterproof coating layer are sequentially arranged on the outer surface of a cement base layer. And the emulsion coating layer is formed by brushing pure acrylic emulsion with small particle size, medium viscosity and high water resistance. And the waterproof coating layer is formed by brushing polymer cement waterproof coating. The waterproof structure is provided with a plurality of waterproof layers, has high crack resistance and high fatigue resistance when stress damage is generated due to dynamic change of cracks of a cement base layer, and is mainly used for building waterproofing.
Owner:覃国军

Steel-aluminum heterogeneous connection system with constant force characteristic displacement compensation and its calibration method

This invention discloses a steel-aluminum heterogeneous connection system with constant force characteristic displacement compensation and its calibration method, relating to the fields of vehicle engineering and structural strength technology. The system includes bolts, an elastic compensation core, and a rigid limiting element. The elastic compensation core forms a constant force characteristic platform area through specific geometric parameter ratios, and the platform width can completely cover the thermal expansion mismatch displacement of the steel and aluminum caused by temperature differences. The rigid limiting element has an axial limiting part, achieving temperature difference displacement compensation under normal conditions and quickly switching to rigid force transmission under collision conditions. The calibration method uses a room temperature mid-position anchoring method, initially compressing the elastic compensation core to the midpoint of the constant force platform to achieve bidirectional displacement compensation. This invention effectively solves the problems of drastic changes in preload, loosening and abnormal noise, stress failure, and unreliable force transmission in steel-aluminum connections under extreme temperature differences, improving structural durability, NVH performance, and simulation accuracy. It is applicable to various vehicle steel-aluminum composite bolt connection scenarios.
Owner:CHANGCHUN ENGLEY MOLD MFG

A double-layer beam analysis model and method for stress failure characteristics of a circular tunnel across a fault

This invention belongs to the field of disaster prevention and mitigation for underground structures. It discloses a double-layer beam analysis model and method for analyzing the stress and failure characteristics of a circular tunnel spanning a fault. The method constructs a double-layer beam analysis model using the stiffness coefficient of the foundation springs and the calculation parameters of the beam elements. If the limit state of the double-layer beam analysis model meets the criteria, the failure state of the structure can be quickly determined through bending moment and shear force, and the failure location can be identified. Simultaneously, the failure state can be quickly determined by analyzing the proportions of bending moment and shear force terms. This invention achieves high-precision reproduction of fault deformation modes through a load-bearing beam, reproduces the stress and deformation characteristics of a tunnel spanning a fault during fault slippage through the double-layer beam model, and achieves rapid identification of the tunnel structure's failure state and failure mode through the limit state compliance criteria for the bearing capacity of annular reinforced concrete structures.
Owner:CHANGAN UNIV +1

Stress fault detection method and device of high-voltage circuit breaker and electronic equipment

According to the stress fault detection method and device for the high-voltage circuit breaker and the electronic equipment provided by the invention, the stress digital signal of the high-voltage circuit breaker to be detected is firstly obtained, and then the stress digital signal is input into the stress distribution prediction model for processing to obtain the predicted stress data; the stress distribution prediction model is determined after historical stress data is trained, simulation data covers multiple fault scenes, the stress distribution prediction model learns more comprehensive stress characteristics, detection deviation caused by insufficient samples is reduced, and the prediction accuracy is improved based on predicted stress data and preset allowable stress. According to the method, the stress fault mode of the high-voltage circuit breaker to be detected is determined, the fault type is matched through a quantitative standard, manual subjective judgment errors are reduced, it is ensured that the whole process from data input to fault judgment is supported by accurate data, the accuracy of stress state detection of the high-voltage circuit breaker is effectively improved, and a foundation is laid for reliable early warning. And finally, generating early warning information according to the stress fault mode.
Owner:GUANGDONG POWER GRID CO LTD DONGGUAN POWER SUPPLY BUREAU

A comprehensive platform and method for reproducing mechanical stress failure of capacitor

This invention provides a capacitor mechanical stress fault reproduction platform, including a PCB board. The PCB board has a plurality of circumferential capacitor mounting positions with progressively increasing diameters along its center. Each circumferential capacitor mounting position is used to mount capacitors of different sizes and materials for mechanical stress fault testing. This invention also provides a reproduction method for the capacitor mechanical stress fault reproduction platform described above. By using a plurality of circumferential capacitor mounting positions with progressively increasing diameters along the center of the PCB board and correspondingly mounting capacitors of different sizes and materials for mechanical stress fault testing, this invention allows for the simultaneous observation of mechanical stress fault reproduction for multiple types and package sizes of capacitors, thus solving the problems of limited fault reproduction methods and single testing methods in existing approaches.
Owner:EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE

High-toughness and high-strength concrete and well lid and preparation method thereof

The application discloses high-toughness and high-strength concrete and a well lid and a preparation method thereof, and belongs to the technical field of concrete well lids; the concrete comprises the following components in parts by weight: 100-120 parts of epoxy resin, 5-10 parts of anhydrous ethanol, 25-40 parts of T31 curing agent, 25-40 parts of modified carbon fiber-diatomic earth composite filler, 40-60 parts of fly ash, 5-10 parts of liquid butyl nitrile rubber, 400-450 parts of quartz fine sand and 5-15 parts of modified basalt fiber; the concrete contains the modified carbon fiber-diatomic earth composite filler and the modified basalt fiber; under the action of impact load, the two components jointly act, so that the material has high compressive strength when initially stressed, and can effectively dissipate energy when reaching the limit, resists sudden brittle failure, forms stronger energy absorption and impact resistance, and under the synergistic action, when facing various types and different development stages of stress failure, the stress failure can be effectively inhibited and the impact energy can be absorbed, so that the overall crack resistance and impact resistance of the concrete are remarkably improved.
Owner:SICHUAN HIGHWAY PLANNING SURVEY DESIGN AND RESEARCH INSTITUTE LTD +1

Effective fracturing volume prediction method and device based on pressure failure simulation, electronic equipment and medium

The invention discloses an effective fracturing volume prediction method and device based on pressure failure simulation, electronic equipment and a medium. The method comprises the following steps: establishing a relationship between the distance from the maximum fracture front to a fracturing point and time, and identifying an effective fracturing event; establishing a discrete seam network geological model; and calculating the effective fracturing volume based on the discrete fracture network geological model. According to the method, the interference of invalid microseism event points is reduced, the effective fracturing volume with relatively high precision is obtained, and the reliability of fracturing effect evaluation is improved.
Owner:CHINA PETROLEUM & CHEMICAL CORP +1

Method and system for determining bearing capacity of prefabricated assembled bridge pier under compression-bending-shearing-torsion action

The present application relates to the technical field of bridge engineering, in particular to a method and system for determining the bearing capacity of a prefabricated and assembled bridge pier under compression-bending-shear-torsion action, comprising determining the stress failure model and analysis assumption conditions of the prefabricated and assembled bridge pier, and then establishing the limit axial force expression and shear force balance equation; the limit axial force expression, shear force balance equation, bending moment equation and torsion equation are derived to obtain the unified analysis equation of the prefabricated and assembled bridge pier; the joint torsional bearing capacity calculation formula is constructed based on the shear bearing capacity data and joint stress conditions; the peak load of different prefabricated and assembled bridge piers is calculated and compared with the test according to the unified analysis equation of the prefabricated and assembled bridge pier and the joint torsional bearing capacity calculation formula. The present application comprehensively considers the combined action of compression, bending moment, shear force and torsion, can more accurately reflect the stress condition of the prefabricated and assembled bridge pier, and realizes the accurate prediction of the peak bearing capacity and peak torsion of the prefabricated and assembled bridge pier under compression-bending-shear-torsion load action.
Owner:EAST CHINA JIAOTONG UNIVERSITY

In-situ test apparatus and test method for simulating the stress failure characteristics of gravity dams

ActiveCN117129338BStructural engineeringStress failure
This invention discloses an in-situ testing device and method for simulating the stress-induced failure characteristics of gravity dams, belonging to the field of hydraulic engineering testing technology. The technical solution adopted in this invention includes an in-situ testing device comprising a mold for casting concrete to create gravity dam specimens and a crack preparation device for creating cracks in the gravity dam specimens, as well as a multi-stage stress loading device and a hydraulic loading device. This invention, employing a multi-stage stress loading device and a loading method with multiple loading points, solves the technical problem that traditional methods cannot achieve stress testing on gravity dams with cracks having azimuth angles, and addresses the previous limitation that a single loading point could not simulate the stress experienced when a crack exists above that loading point, thus achieving the simulation of the stress-induced failure characteristics of real gravity dams.
Owner:NANTONG UNIV

High-toughness and high-strength concrete, well lid and preparation method of well lid

The invention discloses high-toughness and high-strength concrete, a well lid and a preparation method of the high-toughness and high-strength concrete, and belongs to the technical field of concrete well lids. The coating comprises the following components in parts by weight: 100-120 parts of epoxy resin, 5-10 parts of absolute ethyl alcohol, 25-40 parts of a T31 curing agent, 25-40 parts of a modified carbon fiber-diatomite composite filler, 40-60 parts of fly ash, 5-10 parts of liquid nitrile rubber and 400-450 parts of quartz fine sand, and 5-15 parts of modified basalt fiber. The concrete provided by the invention contains a modified carbon fiber-diatomite composite filler and modified basalt fibers, under the action of impact load, the two components act together, so that the material has high compressive strength during initial stress, and can effectively dissipate energy, resist sudden brittle failure and form stronger energy absorption and impact resistance when reaching the limit, and under the synergistic effect, when facing stress failure of various types and different development stages, the material has high compressive strength. And effective inhibition and absorption of impact energy can be ensured, so that the overall crack resistance and impact resistance of the concrete are remarkably improved.
Owner:SICHUAN HIGHWAY PLANNING SURVEY DESIGN AND RESEARCH INSTITUTE LTD +1

A method for predicting the anti-tilting bearing capacity of a three-cylinder foundation suitable for sandy soil

PendingCN122366005ASoil scienceSoil properties
This invention relates to the field of computer-aided engineering and engineering structure simulation technology, and discloses a method for predicting the overturning bearing capacity of a three-tube foundation suitable for sandy soil. The method includes extracting geometric data of the tubes and soil properties data of the sandy soil, establishing foundation design parameters and site soil parameters, calculating the ultimate tensile bearing capacity and overturning bearing capacity of the single-tube foundation using the formulas for the ultimate tensile bearing capacity and the ultimate overturning bearing capacity of the single-tube foundation, calculating the tube spacing ratio and length-to-diameter ratio of the three-tube foundation, and querying and determining whether the stress failure mode of the three-tube foundation is the single-tube resistance development mode or the single-tube resistance fully utilized mode. Calculations are then performed according to the calculation formula for mode one or mode two, achieving rapid and accurate prediction of the overturning capacity of the three-tube foundation.
Owner:TIANJIN UNIVERSITY OF TECHNOLOGY