This reduces the time required from designing
semiconductor devices using miniaturized chips and chiplets to the front-end and back-end production processes. [Solution] The
system includes a
wafer process unit that manages a
wafer process for manufacturing wafers based on
silicon design data, a packaging process unit that manages a packaging process for packaging chips obtained from wafers manufactured in the
wafer process based on
package design data, and an analysis unit that acquires
silicon design data,
package design data,
manufacturing data from the wafer process, and
manufacturing data from the packaging process, determines whether the product is good or defective, and outputs at least one corrective action based on the results of a
cause analysis performed in the case of a defective product, which includes a process to change the process
recipe in the wafer process and / or the packaging process, a process to change the
semiconductor design kit, and a process to change either or both of the
silicon design data and the
package design data.