Semiconductor packaging structure with multiple convex block structures

Abstract

The invention discloses a semiconductor packaging structure with multiple convex block structures. The semiconductor packaging structure is formed by stacking multiple semiconductor elements, wherein the corners of the connection surface of two semiconductor elements are provided with multiple convex block structures composed of multiple convex blocks which are conducted mutually; and the multiple convex block structures are used for increasing the extension paths of the cracks on the connection surface of the elements. Thus, when partial convex blocks in the multiple convex block structures lose effectiveness caused by stress failure, other convex blocks in the multiple convex block structures can still maintain normal functions, therefore, the electric connection path between the elements can be prevented from being damaged by stress and losing effectiveness, and further the reliability of the packaging structure is ensured.

Description

Technical field [0001] The invention relates to a semiconductor package structure, and more particularly to a multi-bump structure of a stacked package. Background technique [0002] In the era of the information society, electronic products have become one of the indispensable necessities of life, and a dazzling array of electronic products are flooding the market. With the advancement of electronic technology, many electronic products with strong functionality, fast computing speed and large memory capacity have been developed, but instead of increasing in size, they have moved towards the trend of being lighter, thinner, shorter, and smaller. In order to achieve the purpose of reducing the size and weight, as far as the circuit design is concerned, the concept of integration is integrated. In this way, many functions can be achieved with only one chip, and the integrated circuit with nanometer-level line width can be produced in the chip. The chip integrates many functions, a...

AI Technical Summary

Problems solved by technology

In particular, as the size of the bumps shrinks, the risk of failure of the bumps located at the corners of the component junctions due to stress damage increases significantly, which severely tests the reliability of the semiconductor package.

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