Production method for sintered metal-ceramic layered compact and production method for thermal stress relief pad

a technology of sintered metal and compact, which is applied in the manufacture/treatment of thermoelectric devices, metal-working apparatuses, thermoelectric device details, etc., can solve the problems of thermal stress relief pad short circuit, time-consuming, and numerous processes, and achieve efficient performance and reduce the number of processes
US20050002818A1Inactive Publication Date: 2005-01-06HITACHI POWDERED METALS COMPANY
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
HITACHI POWDERED METALS COMPANY
Publication Date
2005-01-06
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides a production method for a sintered metal-ceramic layered compact, comprising steps of: filling and layering a metal powder and a ceramic powder, or filling and layering a metal powder, a mixed powder of a metal powder and a ceramic powder, and a ceramic powder; forming a green compact of the layered powders by compacting the layered powders; and sintering a layer including the metal of the green compact at a temperature of lower than a melting point of the metal by heating by irradiation of microwaves in a non-oxidizing atmosphere.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a production method for producing metal-ceramic layered compacts by using a powder metallurgy technique, and relates to a production method for producing thermal stress relief pads for thermoelectric conversion elements by using a powder metallurgy technique. The metal-ceramic layered compact is heat resistant and thermally conductive, or is electrically insulated at one portion thereof and electrically conductive and thermally conductive at another portion thereof, and has a required thermal stress relief function. The thermal stress relief pad has a structure in which metal and ceramic are layered and which is electrically conductive and electrically insulated.

[0003] 2. Description of the Related Art

[0004] A metal-ceramic layered compact which is heat resistant and heat dissipating is disclosed in, for example, Japanese Unexamined Patent Application Publication No. 5-286776, as d...

Claims

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