This invention discloses a modular, safe
solid-state thermal storage
system, comprising an insulated shell containing multiple vertically arranged individual thermal storage modules. Each module is equipped with an individual temperature sensor, a
solid-state
relay, and an
overcurrent protector. All modules are connected in parallel to a main power line and controlled by a single main
control unit. In the event of
overcurrent, open circuit, or overtemperature in one module, the main
control unit only disconnects the
solid-state
relay for that module, while the other modules continue to operate normally, achieving self-protection. Each thermal storage module is drawer-type with quick-connect terminal blocks, allowing damaged components to be removed within minutes. Furthermore, the
system includes an active buffer
thermal management system to regulate the storage and release of
excess heat. The central controller has a fault prediction function, which can predict heating wire aging or poor contact based on past operating trends. This invention solves the problems of traditional solid-state thermal storage devices where a
single component failure causes the entire device to stop operating, is difficult to repair, and lacks preventative maintenance. It offers advantages such as high reliability, ease of maintenance, active thermal management, and fault prediction, significantly improving
system reliability and economic efficiency.