High performance cooling assembly for electronics

Abstract

An assembly for high performance cooling of electronics is described that includes a container for heat transfer liquid in which complex electronic assemblies are immersed. The electronics are sealed inside the liquid container such that an electrical connector protrudes to the exterior of the container. A thermally conductive plate is made part of the liquid filled container assembly such that a portion of the plate is in contact with the liquid and a portion of the plate protrudes from or forms part of the exterior of the container.

Description

RELATED APPLICATIONS [0001] This application claims the benefit of U.S. Provisional Application No. 60 / 688,641 filed on Jun. 9, 2005, which is incorporated herein by reference in its entirety.FIELD OF THE INVENTION [0002] The present invention relates to the field of cooling systems for electronic circuit boards. BACKGROUND OF THE INVENTION [0003] The following discussion is provided solely to assist the understanding of the reader, and does not constitute an admission that any of the information discussed or references cited constitute prior art to the present invention. [0004] Heat dissipation is an important operational aspect of electronic assemblies. As performance and density of electronics increases, the devices typically produce more heat. Fans are widely used to provide cooling in electronics enclosures, but certain configurations of electronic circuits are difficult to cool sufficiently solely with forced air. Air has low density and poor thermal conductivity compared to o...

AI Technical Summary

Benefits of technology

[0016] The present invention provides a high performance method for the cooling of complex, heat generating circuit boards and other complex electronic assemblies, using a dielectric liquid as a heat conducting medium, without necessitating the use of complex apparatus for circulating cooling liquid. This is accomplished using a container enclosing the entire electronic assembly such that the assembly is submerged in the dielectric liquid. A thermally conductive plate is in contact with the fluid and the plate extends beyond the exterior wall of the container. The ...

Problems solved by technology

Fans are widely used to provide cooling in electronics enclosures, but certain configurations of electronic circuits are difficult to cool sufficiently solely with forced air.

Air has low density and poor thermal conductivity compared to other materials.

Moving high volumes of air typically generates high levels of noise and turbulence.

On the other hand, use of liquid with electronic assemblies is problematic because of the potential for spillage and leakage.

While this solution may work for microprocessors and other flat components; it is impractical where heat generating components of odd shapes and/or a large number of components are present.

Further, the system is prone to leaks due to the numerous fluid connections.

The heat flow path is limited to the specific components that are in contact with the pads, and the system is prone to leaks due to the numero...

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