36results about How to "Improved Impedance Control" patented technology

Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control, improved power / ground distribution and more direct paths to tester electronics. The probecards can also use thinner interconnector substrates to conform to the planarity of a DUT and may suspend such a substrate by wires attached to a perimeter edge of the substrate to permit the substrate to tilt. Tilting can also be facilitated by positioning tester-side springs away from the perimeter of the substrate. Low compliance MEMS probes for such architectures can be provided on replaceable coupons having attachment points away from electrical connections, and a method for fabricating probe springs can plate spring material on a membrane deformed by contact with a bumped substrate.

A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.

The invention discloses a double-sided copper foil base plate for PI type high-frequency and high-speed transmission. The double-sided copper foil base plate sequentially comprises a first low-profilecopper foil layer, an upper pole low dielectric adhesive layer, a core layer, a lower pole low dielectric adhesive layer and a second low-profile copper foil layer from top to bottom, wherein the core layer is a polyimide film, the Rz values of the first low-profile copper foil layer and the second low-profile copper foil layer are 0.4-1.0 [mu]m, the components of the formulas of the upper pole low dielectric adhesive layer and the lower pole low dielectric adhesive layer contain a polyimide-based resin, sintered silica, teflon, a fluorine-based resin and a phosphorus flame retardant so as toachieve the Dk value of 2.0-3.0 (10 GHz) and the Df value of 0.002-0.010 (10 GHz), the adhesion strength of the stacked structure formed from the first low-profile copper foil layer, the upper pole low dielectric adhesive layer, the core layer, the lower pole low dielectric adhesive layer and the second low-profile copper foil layer is more than 0.7 kgf / cm, and the water absorption is 0.01-1.5%.According to the present invention, the obtained double-sided copper foil base plate has advantages of good electrical property, high-speed transmission, low thermal expansion coefficient, stable dk / df performance in high temperature and humidity environments, ultra-low water absorption, good UV laser drilling ability, low rebound force suitable for high density assembly and excellent mechanical property.