35results about How to "Improved Impedance Control" patented technology

Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control, improved power/ground distribution and more direct paths to tester electronics. The probecards can also use thinner interconnector substrates to conform to the planarity of a DUT and may suspend such a substrate by wires attached to a perimeter edge of the substrate to permit the substrate to tilt. Tilting can also be facilitated by positioning tester-side springs away from the perimeter of the substrate. Low compliance MEMS probes for such architectures can be provided on replaceable coupons having attachment points away from electrical connections, and a method for fabricating probe springs can plate spring material on a membrane deformed by contact with a bumped substrate.

A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.

To provide more compact dimensions of a via structure formed by signal via pairs and ground vias in multilayer substrate. A multilayer substrate is provided such that the multilayer substrate comprising a high-isolated via cell wherein the high-isolated via cell comprises: two signal via pairs; a shield structure around two signal via pairs consisting of ground vias and ground strips connected to ground vias wherein the shield structure is formed symmetrically in respect to two via pairs to reduce the transformation between mixed modes and also leakage from two signal via pairs; a clearance hole separating signal via pairs from other conductive parts of the multilayer substrate and having predetermined dimensions to provide broadband operation of the high-isolated via cell; and the separating strip disposed symmetrically between said signal via pairs to provide crosstalk reduction between two signal via pairs and common mode decrease.

An antenna (11) includes a patch antenna element (22) capacitively coupled to a load patch (27). A switch (33) connects the load patch (27) to one of one or more strip lines (35, 37, 40), each of which has a different length. Each strip lines causes the load patch (27) to have a different impedance, with one causing a short circuit, one causing an open circuit, and one causing an impedance in between these extremes. Different impedances of the load patch (27) cause different frequencies of operation of the antenna patch (22) by virtue of the capacitive coupling therebetween. The antenna (11) is thereby tuneable to three separate frequencies. Other frequency bands are unaffected by virtue of the location of the load patch (27) relative to the antenna patch (22). By allowing tuning by way of controlling the impedance of the load patch (27), the antenna arrangement can be made smaller than a corresponding passive antenna operable at the same frequencies. By using an N throw switch, N strip lines of different lengths can be connected, each giving rise to a different operating frequency.

An improved high performance twisted pair data cable having a calculated impedance standard deviation of less than 3.5 at an average impedance of 50 to 200 ohms and a maximum of 90 to 110 ohms. The twisted pair is helically wrapped with metal shielding tape under a certain tension, which provides a shielded twisted pair with a cross-sectional void of less than 25%, preferably less than 18%. The tape is helically wrapped with an overlap of 30-45% and at 35-45 degrees to the longitudinal axis of the cable. This cable has a frequency up to 600MHz.

The invention discloses an LCP high-frequency substrate having the high-Dk and low-Df characteristic. The LCP high-frequency substrate comprises at least one copper foil layer, at least one high-dielectric LCP core layer and at least one high-dielectric glue layer, wherein the high-dielectric LCP core layer is arranged between the copper foil layer and the high dielectric layer, the high dielectric LCP core layer is a core layer with a Dk value being 6-100 and a Df value being 0.002-0.010, the high dielectric glue layer is a glue layer with a Dk value being 6-100 and a Df value being 0.002-0.010, the thickness of the copper layer is 1-35 micrometers, the thickness of the high dielectric LCP core layer is 12-100 micrometers, and the thickness of the high dielectric glue layer is 12-100 micrometers. The high dielectric LCP core layer and the high dielectric glue layer both have the high-Dk and low-Df characteristics, thus, the fabricated LCP high-frequency substrate has excellent high-speed transmission, low loss, high-Dk and low-Df performance, low roughness, the ultralow water absorption rate, low elastic force suitable for high-density assembly, favorable UV laser drilling capability and the excellent mechanical property.

The invention discloses a radio frequency PCB connecting structure and connecting method. The radio frequency PCB connecting structure comprises a first PCB and a second PCB. The first PCB is arranged above the second PCB, a first radio-frequency circuit is arranged on the top layer of the first PCB, a first signal welding disc is arranged on the bottom layer of the first PCB, and the first radio-frequency circuit is electrically connected with the first signal welding disc through a signal through hole; a second radio-frequency circuit is arranged on the top layer of the second PCB, a second signal welding disc corresponding to the first signal welding disc is arranged on the second radio-frequency circuit, and the first signal welding disc and the second signal welding disc are welded. According to the radio frequency PCB connecting structure and connecting method, the first radio-frequency circuit is communicated with the first signal welding disc through the signal through hole, then the first signal welding disc and the second signal welding disc located on the second radio-frequency circuit are welded, and signal communication between the first radio-frequency circuit and the second radio-frequency circuit is achieved.

The invention provides a double data rate (DDR) signal wiring encapsulation substrate and a DDR signal wiring encapsulation method. A plurality of DDR storage control modules are symmetrically arranged on a chip. A plurality of storage control signal pins corresponding to the DDR storage control module are symmetrically arranged in the area outside the chip. A plurality of DDR signal wires which are symmetrically distributed are used for respectively and correspondently joining one of the DDR storage control modules to one of the storage control signal pins. The DDR signal wiring encapsulation substrate comprises a ground plane layer, a first medium layer, a DDR signal layer, a second medium layer and a DDR interface power supply plane layer; and the DDR interface power supply plane layer and the ground plane layer are simultaneously selected as a reference plane layer of a DDR signal. The DDR storage control modules are respectively and correspondently connected to the storage control signal pins through a plurality of DDR signal holes which are symmetrically distributed. A plurality of ground holes are correspondently and symmetrically distributed referring to the positions of the DDR signal holes.

The invention discloses a multi-layer circuit structure which includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones. The conductive pattern is electrically connected to a reference potential and electrically insulated from the differential transmission line pair.

The invention discloses an FPC (Flexible Printed Circuit) multilayer board based on a high-frequency FRCC and a high-frequency double-sided board. The FPC multilayer board comprises at least one FRCCand at least one double-sided board, wherein the FRCC and the double-sided board are pressed together; the FRCC comprises a first copper foil layer, a first low dielectric glue layer and a second lowdielectric glue layer; the double-sided board is at least one of a PI type double-sided board and an LCP type double-sided board. According to the invention, the FRCC without the LCP layer is matchedwith the high-frequency PI type double-sided board or the LCP type double-sided board to manufacture a three-layer to six-layer FPC, the process flow for manufacturing the FPC is simple, the laser drilling process is better, the situation of retraction is not easy to occur, the FPC has lower hygroscopicity and lower Dk and Df electrical properties, fast press equipment or pressure transmission equipment can be matched, the FPC has the cost advantage, the thick film manufacturing technology is provided, and meanwhile, the FRCC with the simpler interface and the lower cost is used in the FPC multilayer board structure based on the high-frequency FRCC and the high-frequency double-sided board.

An electronic apparatus which achieves ease of incorporating flexible boards into the electronic apparatus and ease of impedance control at the same time. A first flexible board and a second flexible board are placed along a structure having a bent portion and a flat portion. Differential signal wires are wired on one surface of the first flexible board placed between the structure and the second flexible board, and first ground wires for impedance control of the differential signal wires are wired on the other surface and on a rear side of the differential signal wires. Second ground wires for impedance control of the differential signal wires are wired on one surface of the second flexible board the one surface of the first flexible board faces. A wiring density of the first and second ground wires differs between an area along the bent portion and an area along the flat portion.

The present invention proposes a connection method and a connection structure of a radio frequency PCB. A metalized via of the appropriate size is designed at the end of a PCB1 radio frequency microstrip line. One end of the metalized via is connected to the end of a radio frequency microstrip transmission line on the PCB1, and the other end is connected to a first signal pad on the lower surfaceof the PCB1. There is also a second signal pad on a PCB2 at a position corresponding to the first signal pad of the PCB1. The PCB1 and the PCB2 are soldered together by two pads. Both the PCB1 and PCB2 on both sides of a radio frequency microstrip via are provided with ground pads soldered together. With the technical scheme of the present invention, the two connected PCBs can be grounded with good standing wave, and the beneficial effect of small insertion loss can be achieved.

The embodiments of the invention disclose a charging circuit. The charging circuit is characterized in that the circuit comprises a universal serial bus (USB) interface, a main board, a battery, a first charging line for transmitting current, a second charging line for transmitting current, and a signal line for transmitting data signals; the USB interface is connected with the first end of the first charging line, the first end of the second charging line, and the first end of the third signal line; the second end of the first charging line and the second end of the second charging line are connected with the battery through the main board; and the second end of the signal line is connected with the main board. The embodiments of the present invention also provide a charging method of theabove charging circuit.

The invention discloses a composite high-frequency substrate with the characteristics of high Dk and low Df. The high-frequency substrate comprises a first copper foil layer and a core layer; the corelayer comprises a plurality of high-molecular polymer film layers and a plurality of dielectric adhesive layers; the dielectric adhesive layer comprises at least one of a first dielectric adhesive layer and a second dielectric adhesive layer; the first dielectric adhesive layer is an adhesive layer with a Dk value of 6-30 and a Df value of 0.002-0.020, the second dielectric adhesive layer is an adhesive layer with a Dk value of 15-100 and a Df value of 0.002-0.020, and the Dk value of the second dielectric adhesive layer is greater than the Dk value of the first dielectric adhesive layer; andthe core layer refers to a core layer with a Dk value of 6-50 and a Df value of 0.002-0.020. The laser drilling technology is better, the inward shrinkage condition is not likely to happen, the hygroscopicity is low, the insulativity is high, the size stability is high, the thermal stability is excellent, and the high Dk and low Df electrical property is better; normal press fit parameters can beused for being matched with quick press equipment or pressure transmission equipment, the cost advantage is achieved, and the thick film manufacturing technology is achieved.

The invention discloses an FPC (Flexible Printed Circuit) based on a high-frequency FRCC and an FCCL single panel. The FPC comprises at least one FRCC and at least one FCCL single panel, wherein the FRCC and the FCCL single panel are pressed together; the FRCC comprises a first copper foil layer, a first low dielectric glue layer and a second low dielectric glue layer; the FCCL single panel includes, in order, a second copper foil layer and an insulating polymer layer which is a polymer layer in a cured state. According to the invention, the FRCC without the LCP layer is matched with the high-frequency FCCL single panel to manufacture a three-layer or six-layer FPC, the process flow for manufacturing the FPC is simple, the laser drilling process is better, the situation of retraction is not easy to occur, the FPC has lower hygroscopicity and lower Dk and Df electrical properties, fast press equipment or pressure transfer equipment can be matched, the FPC has the cost advantage, the thick film manufacturing technology is provided, and meanwhile, the FRCC with the simpler interface and the lower cost is used in the FPC structure based on the high-frequency FRCC and the FCCL single panel.

Modular electronic card to support and manage a plurality of calculation nodes and their interconnections with a three-dimensional topology, wherein each node includes a card carrying at least a processing unit, a memory battery and connection members with the modular card. The modular electronic card has a spatial density of the calculation nodes equal, on the surface, to at least 0.8 nodes per square decimeter, given a node that has at least 108 differential connections divided into 12 independent groups, two for each of the fundamental directions (x, y, z) of the 3D topology.

The invention provides a high-uniformity multi-layer impedance flexible circuit board and a fabrication method thereof. By employing a base layer, a dielectric constant of the impedance flexible circuit board using the base layer can be effectively reduced, and impedance control of the impedance flexible circuit board is improved; by combining an impedance layer material provided by the invention and by means of a formulation and synergistic effect of each constituent, the impedance flexible circuit board has lower dielectric constant compared with an impedance flexible circuit board which has the same thickness structure and uses a traditional glass fabric; the fabrication method of the circuit board is simple and is easy to operate and master, accurate alignment among layers and uniform stress are achieved, plate sliding and pressure loss can be prevented, a product is high in quality, and a positioning line is arranged by an infrared positioning emitter; and the impedance flexible circuit board after lamination is high in integral uniformity, the time that resin in a prepreg is in melting flowing is prolonged, full filling among a plurality of core board layers is ensured, flowing is uniform, the efficiency is greatly improved, and a lamination parameter is optimized.

The invention provides an improved impedance PCB. By using a basic layer in the invention, a dielectric constant of the PCB using the basic layer can be effectively reduced and PCB impedance control is improved. Through combining an impedance layer material provided in the invention, and through a compound synergy effect of each component, compared to the PCB which has a same thickness structure and uses traditional glass fiber fabric, the PCB of the invention possesses a lower dielectric constant.