Double-sided copper foil substrate for pi-type high-frequency and high-speed transmission and preparation method thereof

A double-sided copper foil, high-speed transmission technology, applied in circuit substrate materials, chemical instruments and methods, applications, etc., can solve problems such as poor mechanical strength, uneven film thickness, and poor electrical properties, and reduce line oxidation. risk, improve the quality of signal transmission, the effect of rapid heat dissipation and heat conduction
CN108454192BActive Publication Date: 2020-01-14KUSN APLUS TEC CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
KUSN APLUS TEC CORP
Publication Date
2020-01-14

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Abstract

The invention discloses a double-sided copper foil base plate for PI type high-frequency and high-speed transmission. The double-sided copper foil base plate sequentially comprises a first low-profilecopper foil layer, an upper pole low dielectric adhesive layer, a core layer, a lower pole low dielectric adhesive layer and a second low-profile copper foil layer from top to bottom, wherein the core layer is a polyimide film, the Rz values of the first low-profile copper foil layer and the second low-profile copper foil layer are 0.4-1.0 [mu]m, the components of the formulas of the upper pole low dielectric adhesive layer and the lower pole low dielectric adhesive layer contain a polyimide-based resin, sintered silica, teflon, a fluorine-based resin and a phosphorus flame retardant so as toachieve the Dk value of 2.0-3.0 (10 GHz) and the Df value of 0.002-0.010 (10 GHz), the adhesion strength of the stacked structure formed from the first low-profile copper foil layer, the upper pole low dielectric adhesive layer, the core layer, the lower pole low dielectric adhesive layer and the second low-profile copper foil layer is more than 0.7 kgf / cm, and the water absorption is 0.01-1.5%.According to the present invention, the obtained double-sided copper foil base plate has advantages of good electrical property, high-speed transmission, low thermal expansion coefficient, stable dk / df performance in high temperature and humidity environments, ultra-low water absorption, good UV laser drilling ability, low rebound force suitable for high density assembly and excellent mechanical property.
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Description

technical field

[0001] The invention relates to a double-sided copper foil substrate for FPC (flexible circuit board) and the technical field of its preparation, in particular to a double-sided copper foil substrate for PI (polyimide) type high-frequency and high-speed transmission. Background technique

[0002] With the rapid development of information technology, in order to meet the requirements of high-frequency and high-speed signal transmission, rapid heat dissipation and heat conduction, and minimized production cost, the design and application of various forms of mixed-pressure multilayer boards have emerged as the times require. Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, so does the demand for printed circuit boards. As flexible printed circuit boards (FPC, Flexible Printed Circuits) have the characteristics of flexibility and three-dimensional space wiring, under the development of ...

Claims

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