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46results about How to "High dimensional stability" patented technology

Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof

The invention discloses a composite electromagnetic-shielding copper clad laminate with a heat conduction effect and a manufacture method of the composite electromagnetic-shielding copper clad laminate. The composite electromagnetic-shielding copper clad laminate, manufactured by utilizing the manufacture method, comprises a copper foil layer, an insulated polymer layer, a metal shielding layer, an electric conduction glue layer and a sixth stacking layer which are sequentially overlapped, wherein the sixth stacking layer is a metal layer or a release material layer. The composite electromagnetic-shielding copper clad laminate simultaneously has high heat dissipation and electromagnetic-shielding functions, can be applied to electronic products with relatively strict requirements on electromagnetic compatibility and is further used for solving the problem that the heat of electronic products cannot be timely dissipated. According to the composite electromagnetic-shielding copper clad laminate with the heat conduction effect and the manufacture method of the composite electromagnetic-shielding copper clad laminate with the heat conduction effect, a mode for using a conventional copper foil base material in a manner of being matched with shielding films and radiating electronic components is replaced, and original combination of multiple materials is replaced by a composite material, so that the material cost is saved, the thickness of products is decreased, the production process links are decreased, and the integral size stability of the base material of the products can be better improved.
Owner:SONGYANG ELECTRONICS MATERIAL KUSN

Continuous laminating method for composite floor

The invention provides a continuous laminating method for a composite floor. The method comprises the steps that a base material, a surface plate and a bottom plate are selected and prepared; secondly, point type gluing is conducted on the base material through moisture curing reaction type polyurethane hot melt adhesive; thirdly, blank assembling is conducted, and the surface plate, the base material and the bottom plate are automatically and continuously assembled through accurate surface plate, base material and bottom plate positioning equipment, and are directly and automatically conveyed to enter a continuous press to be subjected to cold pressing; fourthly, continuous normal-temperature pressure applying is conducted; and fifthly, splitting is conducted, a floor blank obtained after cold pressing enters a multiple blade saw unit and is split into floor blank bodies equal in width, wherein a multiple blade saw is a composition unit of the continuous cold press and is arranged after the laminating procedure. The composite floor manufactured through the method has many beneficial effects that the glue spreading amount is small, glue spreading is uniform, the gluing strength is uniform, the inner stress of the floor is small, the size stability is high, free formaldehyde release is avoided, the product quality is high, and the cold pressing period is short; and the production technology is simple, energy consumption is low, the production efficiency is high, and continuous and automatic production can be achieved.
Owner:菲林格尔家居科技股份有限公司

Composite high-frequency substrate with characteristics of high Dk and low Df and preparation method thereof

The invention discloses a composite high-frequency substrate with the characteristics of high Dk and low Df. The high-frequency substrate comprises a first copper foil layer and a core layer; the corelayer comprises a plurality of high-molecular polymer film layers and a plurality of dielectric adhesive layers; the dielectric adhesive layer comprises at least one of a first dielectric adhesive layer and a second dielectric adhesive layer; the first dielectric adhesive layer is an adhesive layer with a Dk value of 6-30 and a Df value of 0.002-0.020, the second dielectric adhesive layer is an adhesive layer with a Dk value of 15-100 and a Df value of 0.002-0.020, and the Dk value of the second dielectric adhesive layer is greater than the Dk value of the first dielectric adhesive layer; andthe core layer refers to a core layer with a Dk value of 6-50 and a Df value of 0.002-0.020. The laser drilling technology is better, the inward shrinkage condition is not likely to happen, the hygroscopicity is low, the insulativity is high, the size stability is high, the thermal stability is excellent, and the high Dk and low Df electrical property is better; normal press fit parameters can beused for being matched with quick press equipment or pressure transmission equipment, the cost advantage is achieved, and the thick film manufacturing technology is achieved.
Owner:KUSN APLUS TEC CORP

Preparation method for polyamide acid resin and preparation method for double-sided flexible copper-clad plate

The invention discloses a preparation method for polyamide acid resin and a preparation method for a double-sided flexible copper-clad plate. The preparation method for the polyamide acid resin is asfollows: under the protection of nitrogen, aromatic diamine monomer is dissolved into an aprotic polar solvent, and after stirring for dissolution at 25 DEG C to 50 DEG C, an aromatic diamine monomersolution with the mass concentration of 6 to 9 percent is obtained; after being cooled to 0 DEG C to 25 DEG C, the aromatic diamine monomer solution is added with an aromatic dianhydride monomer, wherein the molar ratio of the aromatic diamine monomer to the aromatic dianhydride monomer is (1:0.95) to (1:1.05), and after 6 to 10 hours of polymerization reaction, standing for defoaming is carried out, so that the polyamide acid resin is obtained. The invention further discloses the method for preparing the double-sided flexible copper-clad plate by utilizing the polyamide acid resin. Accordingto the invention, the reaction for preparing the polyamide acid resin is simple and controllable, and the polyamide acid resin has excellent heat resistance and chemical resistance; and the prepared double-sided flexible copper-clad plate has good heat resistance, high dimensional stability and excellent chemical resistance, and properties such as peel strength and elongation are excellent.
Owner:广东圣帕新材料股份有限公司

Composite electromagnetic shielding copper foil substrate with high thermal conductivity and manufacturing method thereof

The invention discloses a composite electromagnetic-shielding copper clad laminate with a heat conduction effect and a manufacture method of the composite electromagnetic-shielding copper clad laminate. The composite electromagnetic-shielding copper clad laminate, manufactured by utilizing the manufacture method, comprises a copper foil layer, an insulated polymer layer, a metal shielding layer, an electric conduction glue layer and a sixth stacking layer which are sequentially overlapped, wherein the sixth stacking layer is a metal layer or a release material layer. The composite electromagnetic-shielding copper clad laminate simultaneously has high heat dissipation and electromagnetic-shielding functions, can be applied to electronic products with relatively strict requirements on electromagnetic compatibility and is further used for solving the problem that the heat of electronic products cannot be timely dissipated. According to the composite electromagnetic-shielding copper clad laminate with the heat conduction effect and the manufacture method of the composite electromagnetic-shielding copper clad laminate with the heat conduction effect, a mode for using a conventional copper foil base material in a manner of being matched with shielding films and radiating electronic components is replaced, and original combination of multiple materials is replaced by a composite material, so that the material cost is saved, the thickness of products is decreased, the production process links are decreased, and the integral size stability of the base material of the products can be better improved.
Owner:SONGYANG ELECTRONICS MATERIAL KUSN
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