Composite-structure copper foil substrate and making method thereof

A technology of copper foil substrate and manufacturing method, which is applied in the direction of chemical instruments and methods, synthetic resin layered products, lamination, etc., can solve problems such as cracking board, poor bonding force, complicated process, etc., and achieve high dimensional stability , easy processing, high stiffness effect

Inactive Publication Date: 2014-03-12
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Polyimide composite film has been widely used in electronic materials. At present, polyimide composite film is applied in the form of adhesive-free single-sided copper foil substrate products in downstream factories of flexible printed circuit boards (Flexible Printed Circuit). The polyimide layer and the polyimide composite film product are covered with pure glue, which is pressed and cured to make them tightly bonded. However, the problem encountered in th

Method used

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  • Composite-structure copper foil substrate and making method thereof
  • Composite-structure copper foil substrate and making method thereof
  • Composite-structure copper foil substrate and making method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example 1: A copper foil substrate with a composite structure, such as figure 1 As shown, it is composed of a copper foil layer 101, a black polymer layer 102, a black adhesive layer 103, and a black reinforcement layer 104, wherein the black polymer layer 102 is sandwiched between the copper foil layer 101 and the black adhesive layer Between the layers 103, the black adhesive layer 103 is sandwiched between the black polymer layer 102 and the black reinforcing layer 104, and the sum of the thickness of the black polymer layer and the black adhesive layer is 6 To 50 microns.

[0027] In order to prevent the quality of the flexible printed circuit board manufactured by the copper foil substrate from inadequate bonding force, cracking, and other quality concerns, the composite structure of the copper foil substrate of the present invention can adjust the thickness of the black adhesive layer in the copper foil substrate as needed. Composition and thickness. The material o...

Example Embodiment

[0038] Embodiment 2: A composite structure copper foil substrate, such as figure 1 As shown, it is composed of a copper foil layer 101, a black polymer layer 102, a black adhesive layer 103, and a black reinforcement layer 104, wherein the black polymer layer 102 is sandwiched between the copper foil layer 101 and the black adhesive layer Between the layers 103, the black adhesive layer 103 is sandwiched between the black polymer layer 102 and the black reinforcing layer 104, and the sum of the thickness of the black polymer layer and the black adhesive layer is 5 To 50 microns.

[0039] In order to prevent the quality of the flexible printed circuit board manufactured by the copper foil substrate from inadequate bonding force, cracking, and other quality concerns, the composite structure copper foil substrate of the present invention can adjust the thickness of the black adhesive layer in the copper foil substrate as required. Composition and thickness. The material of the bla...

Example

[0049] Examples 3 to 4:

[0050] The same method as in Example 2 is used to produce a composite structure copper foil substrate product. The difference lies in the thickness of the copper foil used and the thickness of the black polymer layer, the thickness of the black adhesive layer and the thickness of the black reinforcing layer have been adjusted as shown in Table 1. Show.

[0051] The rebound force test of the composite structure copper foil substrate of the present invention is as follows:

[0052] Taking the composite structure copper foil substrate of the present invention as an experimental group, the copper foil layer of the composite structure copper foil substrate of the present invention is etched and removed for testing;

[0053] Use only reinforcing materials as a control group;

[0054] Test conditions for the rebound force test: cut the test piece into 10mm×30mm test pieces, set the test R angle to 2.35 mm, measure 5 times for each group of test pieces, calculate the ...

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Abstract

The invention discloses a composite-structure copper foil substrate and a making method thereof. The composite-structure copper foil substrate is formed by a copper foil layer, a black polymer layer, a black adhesion layer and a black strengthening layer, wherein the black polymer layer is arranged between the copper foil layer and the black adhesion layer, the black adhesion layer is arranged between the black polymer layer and the black strengthening layer, and the sum of the thicknesses of the black polymer layer and the black adhesion layer is 5-50mum. The composite-structure copper foil substrate is made through a simple method, and the thicknesses of the black adhesion layer and the black polymer layer can be adjusted according to the demands of FPC downstream factories to satisfy the demands of FPC clients, so the composite-structure copper foil substrate accords the demands of high dimensional stability, high stiffness and workability, and is especially suitable for relevant electronic products of mobile phone antenna plates and the like.

Description

technical field [0001] The invention relates to a composite structural copper foil substrate applied to printed circuit boards and a manufacturing method thereof, in particular to a composite structural copper foil substrate with high stiffness, high dimensional stability and easy processing and a manufacturing method thereof. Background technique [0002] The flexible printed circuit board (Flexible Printed Circuit) substrate must have the material properties of high thermal conductivity, high heat dissipation, high heat resistance and low thermal expansion coefficient. Polyimide resin has high thermal stability and has excellent heat dissipation, mechanical strength and adhesiveness, and is often used in various electronic materials. At present, electronic systems are developing in the direction of light, thin, small and low cost. Therefore, the selection of substrates will become thinner and thinner. Due to the insufficient stiffness of materials, the yield and dimensiona...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B15/20B32B27/28B32B7/12B32B37/12
Inventor 张孟浩庄朝钦金进兴李建辉
Owner KUSN APLUS TEC CORP
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