Preparation method for polyamide acid resin and preparation method for double-sided flexible copper-clad plate

A polyamic acid resin, flexible copper clad laminate technology, applied in chemical instruments and methods, lamination, electronic equipment, etc., can solve the problems of high machine cost, decreased tear strength, copper foil peeling, etc., and achieve good dimensional stability , The effect of small change in tear strength and extended service life

Inactive Publication Date: 2019-03-22
广东圣帕新材料股份有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Poor heat resistance: the long-term use temperature is limited to 100 ° C ~ 200 ° C, when the temperature is greater than 120 ° C, the tear strength of the three-layer flexible board substrate will drop sharply due to the deterioration of the adhesive, generally in the soft board When doing SMT soldering, the temperature mostly exceeds 300°C. In addition, the temperature of the pressing process in the production of soft and rigid boards is also as high as 20°C. It is not suitable for high-temperature processing for three-layer flexible board substrates, and the application field is limited;
[0005] 2. The dimensional change rate of the three-layer flexible board is greatly affected by temperature, and the dimensional stability is poor;
[0006] 3. Poor chemical resistance: the three-layer flexible board substrate has poor chemical resistance of the adhesive, and the tear strength decreases significantly with time.
However, the sputtering method has very high requirements for it, the yield rate of the product is very low, and the cost of the machine is very high. The peel strength of the non-adhesive flexible double-sided flexible copper-clad laminate produced is very low (0.3-0.5Kgf / cm), and the copper foil Easily detaches from substrate
[0009] (2) Pressing method: Utilizing the thermoplasticity of TPI at high temperature, PI and copper foil are pressed together to form a non-adhesive flexible copper clad laminate. This method has high requirements on the machine, and the prepared non-adhesive double-sided flexible copper clad laminate Poor dimensional stability and low peel strength
[0010] It can be seen from the above that the poor heat resistance and weak chemical resistance of the adhesive used in the preparation are the key factors that limit the application field of flexible printed circuit boards, which leads to three main problems in the current double-sided flexible copper clad laminate and its preparation. : 1. poor dimensional stability; 2. low peel strength; 3. complicated process and high preparation cost

Method used

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  • Preparation method for polyamide acid resin and preparation method for double-sided flexible copper-clad plate
  • Preparation method for polyamide acid resin and preparation method for double-sided flexible copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A kind of preparation method of polyamic acid resin, described polyamic acid resin is prepared as follows:

[0035] (1) In a three-neck vessel with nitrogen, add 1095 grams of N-methylpyrrolidone, then add 43.5 grams (equivalent to 0.40 moles) of p-phenylenediamine and 29.0 grams (equivalent to 0.10 moles) of 1,3-bis( 4-aminophenoxy)benzene, stirred and dissolved at 50°C until completely dissolved to obtain an aromatic diamine solution with a mass concentration of 6.6%;

[0036] (2) After cooling the aromatic diamine solution in step 1 to 10°C, add 119.2 grams (equivalent to 0.405 moles) of 3,3',4,4'-biphenyltetracarboxylic dianhydride at 100 rpm After stirring at a rotational speed for 2 hours, 31.0 g (equivalent to 0.10 moles) of 4,4-oxodiphthalic anhydride was added, and the stirring was continued at a rotational speed of 100 rpm for 8 hours to obtain a polyamic acid resin;

[0037] (3) The polyamic acid resin prepared in step 2 was left to defoam, and the measured ...

Embodiment 2

[0046] A kind of preparation method of polyamic acid resin, described polyamic acid resin is prepared as follows:

[0047] (1) Add 1530 grams of dimethylacetamide to a three-neck vessel with nitrogen gas, then add 60.5 grams (equivalent to 0.03 moles) of 4,4'-diaminodiphenyl ether and 86.5 grams (equivalent to 0.20 moles) 4,4'-bis(4-aminophenoxy)diphenyl sulfone, stirred and dissolved at 40°C until completely dissolved to obtain an aromatic diamine solution with a mass concentration of 9.0%;

[0048] (2) After cooling the aromatic diamine solution in step 1 to 0°C, add 43.5 grams (equivalent to 0.20 moles) of pyromellitic anhydride, stir at 150 rpm for 2 hours, then add 107.5 grams (equivalent to 0.30 mol) of diphenylsulfone-3,3`,4,4`-tetracarboxylic dianhydride, and continued stirring at a speed of 150 rpm for 7 hours to obtain a polyamic acid resin;

[0049] (3) The polyamic acid resin prepared in step 2 was left to defoam, and the measured solid content was 15.2%, and the ...

Embodiment 3

[0058] A kind of preparation method of polyamic acid resin, described polyamic acid resin is prepared as follows:

[0059] (1) Add 1080 grams of dimethylacetamide to a three-neck vessel with nitrogen gas, then add 30.5 grams (equivalent to 0.15 moles) of 4,4'-diaminodiphenyl ether and 38.0 grams (equivalent to 0.35 moles) For p-phenylenediamine, stir and dissolve at 50°C until completely dissolved to obtain an aromatic diamine solution with a mass concentration of 6.3%;

[0060] (2) After cooling the aromatic diamine solution in step 1 to 20°C, add 27.5 grams (equivalent to 0.125 moles) of pyromellitic anhydride, stir at 250 rpm for 1.5 hours, then add 99.0 grams (equivalent to Add 0.35 mol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride, and continue stirring at a speed of 250 rpm for 6 hours to obtain a polyamic acid resin;

[0061] (3) The polyamic acid resin prepared in step 2 was left to defoam, and the measured solid content was 15.8%, and the viscosity was 15300CPS. ...

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Abstract

The invention discloses a preparation method for polyamide acid resin and a preparation method for a double-sided flexible copper-clad plate. The preparation method for the polyamide acid resin is asfollows: under the protection of nitrogen, aromatic diamine monomer is dissolved into an aprotic polar solvent, and after stirring for dissolution at 25 DEG C to 50 DEG C, an aromatic diamine monomersolution with the mass concentration of 6 to 9 percent is obtained; after being cooled to 0 DEG C to 25 DEG C, the aromatic diamine monomer solution is added with an aromatic dianhydride monomer, wherein the molar ratio of the aromatic diamine monomer to the aromatic dianhydride monomer is (1:0.95) to (1:1.05), and after 6 to 10 hours of polymerization reaction, standing for defoaming is carried out, so that the polyamide acid resin is obtained. The invention further discloses the method for preparing the double-sided flexible copper-clad plate by utilizing the polyamide acid resin. Accordingto the invention, the reaction for preparing the polyamide acid resin is simple and controllable, and the polyamide acid resin has excellent heat resistance and chemical resistance; and the prepared double-sided flexible copper-clad plate has good heat resistance, high dimensional stability and excellent chemical resistance, and properties such as peel strength and elongation are excellent.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a method for preparing polyamic acid resin and a method for preparing double-sided flexible copper-clad laminates. Background technique [0002] Flexible printed circuit boards, referred to as soft boards, have the advantages of softness, lightness, thinness and flexibility. With the rapid trend of electronic products becoming lighter, thinner, shorter and smaller, they have been widely used in notebook computers, digital cameras, Electronic fields such as mobile phones and night crystal displays. [0003] The traditional soft board material mainly consists of a three-layer structure of polyimide film, adhesive, and copper foil. The adhesive is mainly epoxy resin and acrylic. The soft board material with this structure has the following defects: [0004] 1. Poor heat resistance: the long-term use temperature is limited to 100 ° C ~ 200 ° C, when the temperature is g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10B32B15/088B32B15/20B32B33/00B32B37/06B32B38/16
CPCB32B15/088B32B15/20B32B33/00B32B37/06B32B38/164B32B2255/10B32B2255/26B32B2307/306B32B2307/5825B32B2457/20C08G73/1007C08G73/1042C08G73/1067C08G73/1071
Inventor 徐娘华高侠
Owner 广东圣帕新材料股份有限公司
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