Combined ultrathin double-side copper foil substrate and making method thereof

Abstract

The invention discloses a combined ultrathin double-side copper foil substrate and a making method thereof. The combined ultrathin double-side copper foil substrate is formed by a first copper foil layer, a polyimide layer, an adhesion layer and a second copper foil layer, the polyimide layer is arranged between the adhesion layer and the first copper foil layer, and the adhesion layer is arranged between the second copper foil layer and the polyimide layer, wherein the sum of the thicknesses of the polyimide layer and the adhesion layer is 8-25mum. The combined ultrathin double-side copper foil substrate has the advantages of lightness, thinness, high dimension stability, high buckling performance and low rebounding force; and the combined ultrathin double-side copper foil substrate is made through coating or transfer printing and low temperature stitching, so the making method has the advantages of simplicity, high yield and low cost.

Description

technical field [0001] The invention relates to a double-sided copper foil substrate and a manufacturing method thereof, in particular to a composite ultra-thin double-sided copper foil with high dimensional stability, high buckling performance and low rebound force for making flexible printed circuit boards Substrate and manufacturing method thereof. Background technique [0002] At present, electronic systems are developing in the direction of lightness, thinness, high heat resistance, multi-functionality, high density, high reliability, and low cost. Therefore, the selection of substrates has become a very important factor. A good substrate must have the material properties of high thermal conductivity, high dimensional stability, high color shielding effect, high heat dissipation, high heat resistance, and low thermal expansion coefficient. [0003] Double-sided copper foil substrates in the prior art are classified into those with glue and those without glue. The exis...

AI Technical Summary

Problems solved by technology

The existing double-sided copper foil substrates with glue are often unable to meet the needs of light and thin electronic products due to their thick size. Therefore, the existing double-sided copper foil substrates without glue must be used in many occasions. The process of adhesive double-sided copper foil substrate is as follows: double-sided copper foil is laminated with thermoplastic polyimide (TPI) after high-temperature pressing and baking process, and then the finished product is produced after the curing reaction is complete.

This production process not only consumes energy, but also uses relatively high-cost TPI raw materials, and the yield rate is low in the production process

Therefore, the currently used adhesive-free double-sided copper foil substrates have limitations in process control such as high-temperature treatment and long-term high-temperature baking during production, which not only requires higher production costs, wastes energy and production time, but also cannot guarantee The yield and efficiency of production limit the production capacity

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