Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Combined ultrathin double-side copper foil substrate and making method thereof

A technology of double-sided copper foil and manufacturing method, applied in chemical instruments and methods, lamination, layered products, etc., can solve the problems of high cost, high production cost, thick size, etc., and achieve simple manufacturing method, high dimensional stability, etc. the effect of high flexibility and high buckling performance

Inactive Publication Date: 2014-03-12
KUSN APLUS TEC CORP
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing double-sided copper foil substrates with glue are often unable to meet the needs of light and thin electronic products due to their thick size. Therefore, the existing double-sided copper foil substrates without glue must be used in many occasions. The process of adhesive double-sided copper foil substrate is as follows: double-sided copper foil is laminated with thermoplastic polyimide (TPI) after high-temperature pressing and baking process, and then the finished product is produced after the curing reaction is complete.
This production process not only consumes energy, but also uses relatively high-cost TPI raw materials, and the yield rate is low in the production process
Therefore, the currently used adhesive-free double-sided copper foil substrates have limitations in process control such as high-temperature treatment and long-term high-temperature baking during production, which not only requires higher production costs, wastes energy and production time, but also cannot guarantee The yield and efficiency of production limit the production capacity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Combined ultrathin double-side copper foil substrate and making method thereof
  • Combined ultrathin double-side copper foil substrate and making method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0025] Embodiment: a composite ultra-thin double-sided copper foil substrate, such as figure 1 As shown, it is composed of a first copper foil layer 103, a polyimide layer 102, an adhesive layer 101 and a second copper foil layer 104. The polyimide layer 102 is sandwiched between the adhesive layer 101 and the second copper foil layer. Between a copper foil layer 103, the adhesive layer 101 is sandwiched between the second copper foil layer 104 and the polyimide layer 102, wherein the polyimide layer 102 and the adhesive The sum of the thicknesses of both layers 101 is 8-25 microns.

[0026] The first copper foil layer 103 and the second copper foil layer 104 are ultra-thin carrier copper foils of 9um and below, which are difficult to take because they are easy to wrinkle, and need to be supported by a carrier layer (such as figure 2 as shown, figure 2 Take the first copper foil layer 103 as an example, and 105 is the carrier layer).

[0027] The carrier copper foil used ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a combined ultrathin double-side copper foil substrate and a making method thereof. The combined ultrathin double-side copper foil substrate is formed by a first copper foil layer, a polyimide layer, an adhesion layer and a second copper foil layer, the polyimide layer is arranged between the adhesion layer and the first copper foil layer, and the adhesion layer is arranged between the second copper foil layer and the polyimide layer, wherein the sum of the thicknesses of the polyimide layer and the adhesion layer is 8-25mum. The combined ultrathin double-side copper foil substrate has the advantages of lightness, thinness, high dimension stability, high buckling performance and low rebounding force; and the combined ultrathin double-side copper foil substrate is made through coating or transfer printing and low temperature stitching, so the making method has the advantages of simplicity, high yield and low cost.

Description

technical field [0001] The invention relates to a double-sided copper foil substrate and a manufacturing method thereof, in particular to a composite ultra-thin double-sided copper foil with high dimensional stability, high buckling performance and low rebound force for making flexible printed circuit boards Substrate and manufacturing method thereof. Background technique [0002] At present, electronic systems are developing in the direction of lightness, thinness, high heat resistance, multi-functionality, high density, high reliability, and low cost. Therefore, the selection of substrates has become a very important factor. A good substrate must have the material properties of high thermal conductivity, high dimensional stability, high color shielding effect, high heat dissipation, high heat resistance, and low thermal expansion coefficient. [0003] Double-sided copper foil substrates in the prior art are classified into those with glue and those without glue. The exis...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/20B32B7/12B32B37/12
Inventor 林志铭李建辉臧表
Owner KUSN APLUS TEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com