This invention relates to the field of
energy storage technology, particularly to circuit board heat dissipation components and their manufacturing methods, as well as
energy storage systems. The circuit board heat dissipation component includes a circuit board, a frame, thermally conductive
adhesive, and functional components. The circuit board includes a substrate and electronic components, with the substrate having a heat dissipation area. The frame forms a heat dissipation cavity. The functional components and the circuit board respectively seal a first opening and a second opening of the heat dissipation cavity, with the heat dissipation area connected to the heat dissipation cavity. The thermally conductive
adhesive is configured to be injected into the heat dissipation cavity through the first or second opening in a
liquid state and then solidify, fixing the thermally conductive
adhesive to both the heat dissipation area and the functional components. When the substrate thickness is between 1.6 mm and 2.0 mm, the frame
hardness is between 38 and 70 degrees, and the frame thickness is not less than 6 mm. Through the arrangement of the frame and the thermally conductive adhesive, a heat conduction path is formed between the circuit board and the functional components, enabling efficient conduction and dissipation of heat generated by the circuit board or functional components, ensuring the
operational reliability of the circuit board and functional components.