2results about How to "Small rebound" patented technology

The present application relates to the technical field of energy storage, in particular to a circuit board heat dissipation assembly, a preparation method thereof, and an energy storage system, the circuit board heat dissipation assembly comprising a circuit board, a frame, a heat-conducting glue, and a functional component; the circuit board has a heat dissipation area and a connecting area, and the connecting area is arranged around the heat dissipation area; the frame is formed with a heat dissipation cavity; the functional component covers a first open end of the heat dissipation cavity, the circuit board is arranged in the frame through the connecting area to cover a second open end of the heat dissipation cavity, and the heat dissipation area is communicated with the heat dissipation cavity; the heat dissipation area is provided with a glue pouring hole and a glue overflow hole communicated with the heat dissipation cavity; the heat-conducting glue is configured to be injected into the heat dissipation cavity through the glue pouring hole when in a liquid state and solidified, and the heat-conducting glue is fixed to the heat dissipation area and the functional component, respectively. Through the arrangement of the frame and the heat-conducting glue, a heat conduction path is formed between the circuit board and the functional component, heat generated by the circuit board or the functional component can be efficiently conducted and dissipated through the heat-conducting glue, and the operation reliability of the circuit board and the functional component is ensured.

The application provides a foldable electronic device and a screen assembly. The electronic device comprises a screen, a rotating shaft assembly, a first housing, a second housing and an elastic assembly. The material of the elastic part of the elastic assembly is an elastic material or a non-Newtonian fluid material. The material of the supporting part of the elastic assembly is a rigid material. The electronic device has an open state and a closed state. When the electronic device is in the open state, the elastic assembly is flat. The screen, the elastic assembly and the rotating shaft assembly are stacked in the thickness direction of the electronic device. The elastic part and the supporting part are stacked in the thickness direction of the electronic device. The first part of the elastic assembly overlaps the first connecting part of the rotating shaft assembly, and the second part overlaps the second connecting part of the rotating shaft assembly. When the electronic device is in the closed state, the elastic assembly is bent, the first part of the elastic assembly overlaps the first connecting part, and the second part overlaps the second connecting part. The screen drop reliability of the electronic device is high, and the rebound force is small.