LCP (Liquid Crystal Polymer) or fluoride polymer high-frequency high-transmission double-sided copper clad laminate and FPC (Flexible Printed Circuit)

A fluorine-based polymer, double-sided copper foil technology, used in electronic equipment, lamination, applications, etc., can solve the problems of difficult control of circuit board impedance value, inability to use fast press equipment, affecting copper plating continuity, etc. , to achieve stable dk/df performance, good impedance control, and good electrical properties

Pending Publication Date: 2018-05-18
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the high-frequency boards currently used in the industry are mainly LCP (liquid crystal polymer) boards and PTFE (polytetrafluoroethylene) fiber boards. (>280°C) can be operated, which also causes uneven film thickness. Uneven film thickness will make it difficult to control the impedance value of the circuit board, and the high-temperature pressing process will cause LCP or PTFE extrusion to affect the plating. The conductivity of copper forms an open circuit, which leads to poor relia

Method used

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  • LCP (Liquid Crystal Polymer) or fluoride polymer high-frequency high-transmission double-sided copper clad laminate and FPC (Flexible Printed Circuit)
  • LCP (Liquid Crystal Polymer) or fluoride polymer high-frequency high-transmission double-sided copper clad laminate and FPC (Flexible Printed Circuit)
  • LCP (Liquid Crystal Polymer) or fluoride polymer high-frequency high-transmission double-sided copper clad laminate and FPC (Flexible Printed Circuit)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0068] Embodiment 1: An LCP or fluorine-based polymer high-frequency high-transmission double-sided copper foil substrate, such as figure 1 As shown, the double-sided copper foil substrate is sequentially composed of the first copper foil layer 101, the first insulating polymer layer 104, the first very low dielectric adhesive layer 103, the first insulating polymer layer 104 and the second Two copper foil layers 102 are formed.

[0069] In this embodiment, preferably, the thickness of the first copper foil layer and the second copper foil layer are both 6-18 μm; the thickness of the ultra-low dielectric adhesive layer is 10-50 μm; the first The thickness of the insulating polymer layer is 12.5-25 μm.

[0070] Both the first copper foil layer and the second copper foil layer are rolled copper foil layers (RA / HA / HAV2) or electrolytic copper foil layers (ED).

[0071] In this embodiment, the preparation method of the double-sided copper foil substrate is carried out according ...

Embodiment approach 2

[0078] Embodiment 2: An LCP or fluorine-based polymer high-frequency high-transmission double-sided copper foil substrate, such as figure 2 As shown, the structure is similar to Embodiment 1, the difference is that: the double-sided copper foil substrate is sequentially composed of the first copper foil layer 101, the first insulating polymer layer 104, the first ultra-low dielectric adhesive layer 103, a second insulating polymer layer 105 and a second copper foil layer 102.

[0079] In this embodiment, the preparation method of the double-sided copper foil substrate is carried out according to the following steps:

[0080] Step 1. Apply LCP polymer or fluoropolymer resin on one side of the first copper foil layer, remove the solvent at 60-100°C, and then react at 300°C for 10 hours to form the first insulating layer. polymer layer;

[0081] Step 2, coating the ultra-low dielectric adhesive on the other side of the first insulating polymer layer, drying and pressing to obt...

Embodiment approach 3

[0085] Embodiment 3: An LCP or fluorine-based polymer high-frequency high-transmission double-sided copper foil substrate, such as image 3 As shown, the structure is similar to Embodiment 1, the difference is that: the double-sided copper foil substrate is sequentially composed of the first copper foil layer 101, the first insulating polymer layer 104, the first ultra-low dielectric adhesive layer 103 and the second copper foil layer 102.

[0086] The total thickness of the first copper foil layer, the first insulating polymer layer, the first ultra-low dielectric adhesive layer and the second copper foil layer is 9-170 μm.

[0087] In this embodiment, the preparation method of the double-sided copper foil substrate is carried out according to the following steps:

[0088] Step 1. Apply LCP polymer or fluoropolymer resin on one side of the first copper foil layer, remove the solvent at 60-100°C, and then react at 300°C for 10 hours to form the first insulating layer. polyme...

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Abstract

The invention discloses an LCP (Liquid Crystal Polymer) or fluoride polymer high-frequency high-transmission double-sided copper clad laminate which comprises a first copper foil layer, a second copper foil layer, a first very low dielectric glue layer and at least one insulating polymer layer, wherein the first very low dielectric glue layer is positioned between the first and second copper foillayers; the Rz value of the inner surfaces of the first and second copper foil layers is 0.1-1.0 micron; the insulating polymer is at least one of a first LCP polymer layer or a first fluoride polymerlayer; the first very low dielectric glue layer is a glue layer with a Dk value of 2.0-3.5 and a Df value of 0.002-0.010; the first polyimide layer is an insulating polymer layer with a Dk value of 2.20-3.50 and a Df value of 0.002-0.010. The double-sided copper clad laminate and the FPC disclosed by the invention have excellent electrical properties and also have cost advantages, short manufacture procedure processes, low thermal expansion coefficients, stable dk/df performances in high-temperature and humidity environments, ultra-low water absorption rate, excellent UV laser drilling abilities, low rebound, suitableness for high-density assembly and excellent mechanical properties.

Description

technical field [0001] The invention relates to the technical field of FPC (flexible circuit board) and its preparation, in particular to a double-sided copper foil substrate. Background technique [0002] With the rapid development of information technology, in order to meet the needs of high-frequency and high-speed signal transmission, rapid heat dissipation and heat conduction, and minimize production costs, the design and application of various forms of mixed-pressure multilayer boards are in the ascendant. Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, the demand for printed circuit boards is also increasing. Due to the flexible printed circuit board (FPC, Flexible Printed Circuit) has the characteristics of flexibility and three-dimensional space wiring, under the development trend of scientific and technological electronic products emphasizing lightness, shortness, flexibility, and high f...

Claims

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Application Information

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IPC IPC(8): B32B15/01B32B37/06B32B37/10
CPCB32B15/01B32B37/06B32B37/10B32B2255/26B32B2255/28B32B2457/00
Inventor 杜伯贤林志铭李建辉
Owner KUSN APLUS TEC CORP
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