LCP (Liquid Crystal Polymer) or fluoride polymer high-frequency high-transmission double-sided copper clad laminate and FPC (Flexible Printed Circuit)

Abstract

The invention discloses an LCP (Liquid Crystal Polymer) or fluoride polymer high-frequency high-transmission double-sided copper clad laminate which comprises a first copper foil layer, a second copper foil layer, a first very low dielectric glue layer and at least one insulating polymer layer, wherein the first very low dielectric glue layer is positioned between the first and second copper foillayers; the Rz value of the inner surfaces of the first and second copper foil layers is 0.1-1.0 micron; the insulating polymer is at least one of a first LCP polymer layer or a first fluoride polymerlayer; the first very low dielectric glue layer is a glue layer with a Dk value of 2.0-3.5 and a Df value of 0.002-0.010; the first polyimide layer is an insulating polymer layer with a Dk value of 2.20-3.50 and a Df value of 0.002-0.010. The double-sided copper clad laminate and the FPC disclosed by the invention have excellent electrical properties and also have cost advantages, short manufacture procedure processes, low thermal expansion coefficients, stable dk / df performances in high-temperature and humidity environments, ultra-low water absorption rate, excellent UV laser drilling abilities, low rebound, suitableness for high-density assembly and excellent mechanical properties.

Description

technical field [0001] The invention relates to the technical field of FPC (flexible circuit board) and its preparation, in particular to a double-sided copper foil substrate. Background technique [0002] With the rapid development of information technology, in order to meet the needs of high-frequency and high-speed signal transmission, rapid heat dissipation and heat conduction, and minimize production costs, the design and application of various forms of mixed-pressure multilayer boards are in the ascendant. Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, the demand for printed circuit boards is also increasing. Due to the flexible printed circuit board (FPC, Flexible Printed Circuit) has the characteristics of flexibility and three-dimensional space wiring, under the development trend of scientific and technological electronic products emphasizing lightness, shortness, flexibility, and high f...

AI Technical Summary

Problems solved by technology

In addition, the high-frequency boards currently used in the industry are mainly LCP (liquid crystal polymer) boards and PTFE (polytetrafluoroethylene) fiber boards. (>280°C) can be operated, which also causes uneven film thickness. Uneven film thickness will make it difficult to control the impedance value of the circuit board, and the high-temperature pressing process will cause LCP or PTFE extrusion to affect the plating. The conductivity of copper forms an open circuit, which leads to poor reliability and a decrease in reliability; in addition, it is faced with the inability to use fast press equipment, resulting in processing difficulties; in addition, in SMT (surface mount) high temperature process or other FPC process , such as bending, strong acid and strong alkali liquid process, the subsequent strength is insufficient, resulting in a drop in yield

Although other resin films do not have the above problems, they face problems such as poor electrical properties or poor mechanical strength.

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