White ink with high reflectivity as well as preparation method and application thereof

Abstract

The invention discloses white ink with high reflectivity. The white ink is prepared from the following raw materials in parts by weight: 3 to 8 parts of polyester resin, 1 to 6 parts of organic silicon resin, 10 to 30 parts of titanium dioxide, 2 to 4 parts of ultraviolet absorbent, 2 parts of accelerant, 10 parts of tripolymer curing agent, 0.5 part of gaseous silicon dioxide, 0.05 part of fluorine surfactant, and 30 parts of solvent. The invention also discloses a preparation method of the white ink with the high reflectivity and application in a flexible copper-coated plate. By adopting thewhite ink with the high reflectivity produced in the invention, the white ink with high performance can be directly smeared on a single-surface FCCL base material to form a special base material foran LED, so that the downstream process can be saved, the efficiency can be improved, and the commercial value is relatively high.

Description

technical field [0001] The invention relates to a white ink with high reflectivity and a preparation method and application thereof, in particular to a white ink with high reflectivity on an LED substrate. Background technique [0002] With the development of the information and communication industry driving the rapid development of the microelectronics industry, flexible printed circuit boards (Flexible Printed Circuit, FPC) came into being and developed rapidly. widely used. The biggest difference between a flexible printed circuit board and a PCB (Printed Circuit Board, rigid printed circuit board) is that the function of the former's use of a cover film exceeds that of the solder resist ink used in the PCB. It not only acts as a solder mask, but also protects the FPC from dust, Moisture, chemical erosion, and can reduce the impact of stress in the bending process. In addition, with the development of the FPC market, the cover film has been endowed with more functions,...

AI Technical Summary

Problems solved by technology

[0004] The first method: After the cover film is opened, the substrate is pressed, and after low-temperature drying, a layer of white ink is coated on the surface to improve the contrast of LED products and enhance its printing effect. The disadvantage is that the printing thickness is uneven and flexible poor sex;

[0005] The second type: use a white ink cover film directly attached to the FPC substrate, the white ink cover film includes the first white ink layer, yellow PI (polyimide) layer, first adhesive layer and first release layer , which can reduce the downstream process, but the white ink cover film has poor high temperature yellowing resistance and is difficult to achieve thinning

[0006] The third method: use a white PI cover film to directly attach to the FPC substrate. The white PI cover film includes a white PI layer, a white adhesive layer and a second release layer. It has high temperature yellowing resistance, good weather resistance and high Reflectivity, but its cost is high and thinning is difficult to achieve

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