Resin composition and application thereof

A resin composition and resin technology are applied in the field of resin compositions for high-frequency and high-speed printed circuit boards, which can solve the problems of unsuitable high-frequency and high-speed printed circuit boards, lack of applications, etc., and achieve small rebound force, reduced dielectric loss, The effect of good heat resistance

Active Publication Date: 2019-12-10
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The main purpose of the present invention is to provide a kind of resin composition and its application, to solve the problem that the resin composition in the prior art is not suitable for printing at high frequency and high speed due to the lack of photosensitivity, dielectric property, softness or processability. Application problems in circuit boards

Method used

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  • Resin composition and application thereof
  • Resin composition and application thereof
  • Resin composition and application thereof

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preparation example Construction

[0062] According to one aspect of the present invention, there is also provided a method for preparing a high-frequency high-speed printed circuit board solder resist protective layer, which includes the following steps: roll coating the above-mentioned resin composition to form a wet film; applying the wet film After pre-drying, heat roller lamination, exposure, development, and thermal curing are performed in sequence to obtain a solder resist protective layer. Using the above resin composition, the high-frequency and high-speed printed circuit boards (PCB, FPC, etc.) formed have lower dielectric constant and dielectric loss, and have good performance in heat resistance, bending property, rebound force, resolution and the like.

[0063] In a preferred embodiment, the thickness of the wet film is 25-50 μm; preferably, during the pre-drying process, the pre-drying temperature is 80-100 ° C, and the time is 15-30 min; Exposure energy is 100~500mJ cm -2 ; Preferably, in the dev...

Embodiment 1

[0066] Preparation of a resin composition for high-frequency high-speed printed circuit boards: 15g alkali-soluble photosensitive epoxy acrylic resin ZAR-1035 (acid value 100mgKOH / g, solid content 64%), 2.5g acrylate monomer (wherein 1.5 g 20EOBPDMA, 1.0g 10EOTMPTA), 0.5g photopolymerization initiator (0.2g 184, 0.3g 907), 0.05g photosensitizer (ITX), 3.5g epoxy resin (2.7g naphthalene ring type low dielectric epoxy Resin, 0.8g toughened epoxy resin MX-154), 0.01g boron trifluoride ethylamine latent curing accelerator, 0.3g carbon black MA-7, 0.5g other additives (0.3g dispersant BYK168, 0.1 g leveling agent BYK 394, 0.1g defoamer BYK354), firstly grinded by three rollers, then stirred at high speed to dissolve and disperse, and finally filtered to obtain the glue solution, which was stored in dark light for later use.

Embodiment 2

[0068] Preparation of a resin composition for high-frequency high-speed printed circuit boards: 15g alkali-soluble photosensitive epoxy acrylic resin ZAR-1035 (acid value 100mgKOH / g, solid content 64%), 2.5g acrylate monomer (wherein 1.5 g 20EOBPDMA, 1.0g 10EOTMPTA), 0.5g photopolymerization initiator (0.2g 184, 0.3g 907), 0.05g photosensitizer (ITX), 3.5g epoxy resin (1.8g naphthalene ring type low dielectric epoxy Resin, 0.9g NPES-901, 0.8g toughened epoxy resin MX-154), 0.01g boron trifluoride ethylamine latent curing accelerator, 0.3g carbon black MA-7, 0.5g other additives (wherein 0.3 g dispersant BYK168, 0.1g leveling agent BYK 394, 0.1g defoamer BYK354), first grinded by three rolls, then stirred at high speed to dissolve and disperse, and finally filtered to obtain glue, and stored in dark light for later use.

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Abstract

The invention provides a resin composition and an application thereof. The resin composition comprises the following components in parts by weight: 100 parts of alkali-soluble resin, 5-30 parts of acrylate monomer, 0.1-10 parts of photoinitiator, 10-30 parts of first epoxy resin and 0-15 parts of second epoxy resin, wherein the first epoxy resin is low-dielectric epoxy resin with a dielectric constant less than 3.5, and the second epoxy resin is different from the first epoxy resin. By adding the low-dielectric epoxy resin with the dielectric constant less than 3.5 and adjusting the ratio of all the components, the dielectric constant and the dielectric loss are remarkably reduced, the dielectric constant is reduced to 3.0 or below, and the dielectric loss is reduced to 0.008 or below. Inaddition, the resin composition has the advantages of good heat resistance, good resolution, small rebound force, and relatively good flexibility and bending resistance. Meanwhile, the resin composition is a photosensitive resin composition, and can realize image transfer through photosensitive development.

Description

technical field [0001] The invention relates to the technical field of circuit board printing, in particular to a resin composition and its application, in particular to a resin composition for high-frequency and high-speed printed circuit boards. Background technique [0002] With the advent of the 5G era, the current trend of miniaturization, thinning, high integration, and full-screen form makes terminal equipment more and more demanding on supporting materials. Since 5G signals will use higher frequencies and faster transmission speeds during transmission, PCB and FPCB materials are required to reduce electrical signal loss in high-frequency regions, specifically regions with frequencies above 1GHz, which requires PCB and FPCB materials have lower dielectric constant (Dk) and dielectric loss (Df). Among them, Dk must be less than or equal to 3.0, and Df must be less than or equal to 0.008. [0003] In the prior art, the photosensitive polyimide cover film has a lower D...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004H05K1/03
CPCG03F7/027G03F7/004H05K1/0373G03F7/038G03F7/033G03F7/035G03F7/031G03F7/029G03F7/105G03F7/322G03F7/0385H05K3/287H05K2201/0154C09D7/65C09D7/61C09D7/70C09D4/06C09D133/062C09D163/10C09D175/04G03F7/162G03F7/40H05K1/0237
Inventor 林晓英童荣柏周光大林建华
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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