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But this kind of practice is not easy to do in 5-7.5μm ultra-thin polyimide film
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Embodiment 1
[0064] Embodiment 1: A kind of high-haze colored ultra-thin high-frequency cover film, such as figure 1 Shown, comprise colored ink layer 200 and high-frequency adhesive layer 300, described colored ink layer 200 is positioned at the top of described high-frequency adhesive layer 300, and described colored ink layer is provided with at least one layer;
[0065] The hardness of the colored ink layer is HB-5H;
[0066] The glossiness of the colored ink layer is 0-60% (60°);
[0067] The roughness of the colored ink layer is 50-1000nm;
[0068] The thickness of the colored ink layer is 1-10 μm, and the thickness of the high-frequency adhesive layer is 3-25 μm.
[0069] In this embodiment, the colored ink layer has a single layer, and the sum of the thicknesses of the colored ink layer 200 and the high frequency adhesive layer 300 is 4-35 μm.
[0070] Preferably, the hardness of the colored ink layer 200 is 2H-5H.
[0071] Preferably, the thickness of the colored ink layer 200...
Embodiment 2
[0087] Embodiment 2: as figure 2 As shown, the others are the same as in Example 1, except that the colored ink layer is provided with two layers, which are respectively the first colored ink layer 201 and the second colored ink layer 202, and the first colored ink layer 201 Located on the upper surface of the second colored ink layer 202, the second colored ink layer 202 is located on the upper surface of the high frequency adhesive layer 300;
[0088] The thicknesses of the first colored ink layer 201 and the second colored ink layer 202 are both 2-3 μm.
[0089]The resin material in the auxiliary adhesive layer is epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin, polyamide amide At least one of imine and the polyimide-based resin.
Embodiment 3
[0090] Embodiment 3: as image 3 As shown, the others are the same as in Embodiment 1, except that: the colored ultra-thin high-frequency cover film also includes an auxiliary adhesive layer 500, and the auxiliary adhesive layer 500 is located between the colored ink layer 200 and the high-frequency adhesive layer. between the agent layers 300, and the thickness of the auxiliary adhesive layer 500 is 3-25 μm.
[0091] The present invention also provides a kind of preparation method of the colored ultra-thin high-frequency covering film of described high haze, and described preparation method is a kind of in following method:
[0092] Method one (applicable to embodiment 1): proceed as follows:
[0093] Step 1. Coating colored ink raw materials on the lower surface of the upper release layer, curing at a low temperature of 50-180°C to form a colored ink layer;
[0094] Step 2, forming the high-frequency adhesive layer on the lower surface of the colored ink layer by coating m...
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Abstract
The invention discloses a high-haze colored ultra-thin high-frequency cover film and a preparation method thereof. The high-haze colored ultra-thin high-frequency cover film comprises a colored printing ink layer and a high-frequency adhesive layer, wherein the colored printing ink layer is arranged on the high-frequency adhesive layer, and at least one layer of the colored printing ink layer is arranged; the hardness of the colored printing ink layer is HB-5H; the glossiness of the colored printing ink layer is 0-60%(60-degree); the roughness of the colored printing ink layer is 50-1000 nm; and the thickness of the colored printing ink layer is 1-10 mu m, and the thickness of the high-frequency adhesive layer is 3-25 mu m. The high-haze colored ultra-thin high-frequency cover film provided by the invention comprises the colored printing ink layer and the high-frequency adhesive layer, is adhered with release films or release layers of release paper at the upper and lower surfaces, hasthe advantages of ultra-low dielectric constant and loss, extremely high ion purity, ultra-thin stack thickness, high heat dissipation performance, high flame retardancy and high despun light performance, is especially suitable to be used in a high-frequency thinning circuit, has higher reliability and operability compared to the ordinary cover film, and can adjust the glossiness value of the surfaces, thereby replacing the ordinary cover film material.
Description
technical field [0001] The invention relates to the technical field of a cover film for FPC (flexible circuit board) and its preparation, in particular to a colored ultra-thin high-frequency cover film with high haze and a preparation method. Background technique [0002] Since the electronic system is developing in the direction of thinness, lightness, high heat resistance, multi-functionality, high density, high reliability and low cost, it requires powerful and high-speed signal transmission in terms of function. In the high-frequency field, wireless infrastructure needs to provide sufficiently low insertion loss, lower dielectric constant and loss in order to effectively improve energy utilization. With the advent of the 5G era and application requirements such as USB3.1, RF products need to provide wider bandwidth and be backward compatible with 3G and 4G services. The material of the cover film currently on the market is common to use black polyimide film. In terms of...
Claims
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Application Information
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