Manufacture method of flexible glue-free double-face copper clad

A technology of double-sided copper clad foil, applied in the field of preparation of flexible non-adhesive double-sided copper clad foil, can solve problems affecting the dimensional stability of copper clad foil, poor dimensional stability of mechanical properties, complex preparation methods and processes, etc., to achieve improved Dimensional stability, good thermal stability, and excellent overall performance

Inactive Publication Date: 2013-02-06
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This preparation method is complicated, and the copper foil needs to go through two processes of coating and pressing, which is prone to defects
In addition, the thermosetting polyimide layer prepared in this way has not been stretched, and the mechanical properties, especially the dimensional stability, are poor, which affects the most critical dimensional stability of the copper clad foil.

Method used

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  • Manufacture method of flexible glue-free double-face copper clad
  • Manufacture method of flexible glue-free double-face copper clad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] (1) Provide a kapton polyimide film with a thickness of 18 microns.

[0023] (2) Prepare thermoplastic polyimide precursor solution: dissolve 16.96g 3,3'-diaminobenzophenone and 4.96g 4,4'-diaminodiphenylsulfone in 100ml xylene and 400mlN respectively, In N-dimethylacetamide solvent, stir and mix well. Then 22g of pyromellitic dianhydride was added to the above solution in batches. After stirring and reacting at low temperature for 10 hours, a viscous thermoplastic polyamic acid solution (intrinsic viscosity η int =1.8dl / g).

[0024] (3) Coat both sides of the kapton film with a thermoplastic polyimide precursor solution with a thickness of 20 microns, and dry it at 60, 100, 120, 160, and 120°C for 10 seconds to obtain a three-layer composite film, and then follow the copper Foil, three-layer composite film, and copper foil are stacked from top to bottom (the bright side of the copper foil faces outward), and hot-pressed at 180°C under the protection of nitrogen, wit...

Embodiment 2

[0026] (1) Provide a dupont polyimide film with a thickness of 8 microns.

[0027] (2) Prepare thermoplastic polyimide precursor solution: Dissolve 18.44,4’-diaminodiphenyl ether and 1.6g aliphatic diamine X-173 in 100ml xylene and 400ml NMP solvent respectively, stir and mix well. Then 22g of pyromellitic dianhydride was added to the above solution in batches. After stirring and reacting at low temperature for 10 hours, a viscous thermoplastic polyamic acid solution (intrinsic viscosity η int =1.8dl / g).

[0028] (3) Coat both sides of the dupont polyimide film with a thermoplastic polyimide precursor solution with a thickness of 30 microns, and dry it at 60, 100, 120, 160, and 120°C for 10 seconds to obtain a three-layer composite film , and then stacked from top to bottom in the order of copper foil, three-layer composite film, and copper foil (the smooth side of the copper foil faces outward), and hot-pressed at 220°C under the protection of nitrogen, with a pressure of 5...

Embodiment 3

[0030] (1) Provide upliex polyimide film with a thickness of 12 microns.

[0031] (2) Prepare thermoplastic polyimide precursor solution: dissolve 11.96g of bis-diphenylaminomethane and 16.4g of 1,4'-bis(4-aminophenoxy)benzene in 100ml of xylene and 400ml of N, N - In dimethylacetamide solvent, stir to mix well. Then 31g of 4,4'-diphenyl ether tetra-acid dianhydride was added to the above solution in batches. After stirring and reacting at low temperature for 10 hours, a viscous thermoplastic polyamic acid solution (intrinsic viscosity η int =1.8dl / g).

[0032] (3) Coating a 10-micron-thick thermoplastic polyzimide precursor solution on both sides of a 12-micron thermosetting polyimide film, drying at 60, 100, 120, 160, and 120°C for 10 seconds respectively to obtain The three-layer composite film is then stacked from top to bottom in the order of copper foil, three-layer composite film, and copper foil (the smooth side of the copper foil faces outward), and hot-pressed at ...

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Abstract

The invention discloses a manufacture method of flexible glue-free double-face copper clad. The copper clad is of a five-layer structure respectively comprising copper clad, a thermoplastic polyimide layer, a thermosetting polyimide layer, a thermoplastic polyimide layer and copper clad. The manufacture method is that thermoplastic polyimide (TPI) solution is coated on two surface of a polyimide film respectively, and after drying, the polyimide film is once-pressed with the two layers of copper clad. The copper clad manufactured through the method is high in production efficiency and product yield and good in size stabilizing performance.

Description

technical field [0001] The invention belongs to the technical field of copper-clad foil, and in particular relates to a preparation method of flexible non-adhesive double-sided copper-clad foil. Background technique [0002] Flexible copper clad foil is the main raw material of FPC (flexible printed circuit board), which has been widely used in aerospace equipment, navigation equipment, aircraft instruments, military guidance systems and mobile phones, digital cameras, digital video cameras, automotive satellite direction positioning devices, LCD TVs , notebook computers and other electronic products. As computers, mobile phones, etc. have become common items for almost every resident in most countries around the world, it is expected that the market demand for flexible copper clad foil will continue to grow. With the continuous development of electronic products in the direction of light, thin, short and small, while the performance of flexible copper clad foil is required...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B37/10B32B37/15
Inventor 杨卫国
Owner JIANGSU UNIV OF SCI & TECH
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