Polyimide compound soft board and its making method

A technology of polyimide and polyimide film, applied in the direction of circuit substrate materials, chemical instruments and methods, lamination, etc., can solve the problems of unfavorable processing, bending, warping and other problems in the back-stage process, and achieve stable dimensions No warping or bending, high heat resistance, and excellent adhesion

Inactive Publication Date: 2008-06-04
CHANG CHUN PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after some polyimide resins are bonded to metal foils, under high-temperature processes, due to the difference in the coefficient of thermal expansion (CTE) of polyimides and metal foils, warping or bending problems often occur. The processing of the back-end process is less favorable

Method used

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  • Polyimide compound soft board and its making method
  • Polyimide compound soft board and its making method
  • Polyimide compound soft board and its making method

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example

[0039] (a) Synthesis of polyamic acid 1-1 (cyclized polyamic acid with a CTE value greater than 20ppm)

[0040] In a four-neck reaction flask with a stirrer and a nitrogen conduit, under the blowing of a nitrogen flow rate of 20cc / min, put 5.4 grams (0.05 moles) of p-phenylenediamine (PDA) in the reaction flask and use N-methyl Pyrrolidone (NMP) was dissolved, and 15 minutes after the dissolution, 10 g (0.05 mol) of 4,4'-oxydiphenylamine (ODA) was fed and dissolved while maintaining the temperature at 15°C. In addition, take a first flask with a stirring bar, feed 8.82 grams (0.03 moles) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and 15 grams of NMP and stir to dissolve it, then The content of this first flask was added to the above-mentioned reaction flask, and the reaction was carried out for 1 hour by continuously introducing nitrogen gas and stirring. Another second flask was taken, and 16.1 grams (0.05 moles) of 3,3',4,4'-benzophenonetetracarboxylic dianhydr...

Embodiment 1 to Embodiment 14 and comparative example 1 to 3

[0050] According to the compositions listed in Table 3 and Table 4, the polyamic acid resin 1 prepared in the above synthesis example was uniformly coated on a copper foil with a thickness of 18 microns by a wire bar, and the coating thickness was 3 microns. The solvent was removed by baking at 180°C for 3 minutes and at 180°C for 5 minutes. Take out the dried polyamic acid-coated copper foil, then apply polyamic acid resin 2 to a coating thickness of 17 microns, then bake in an oven at 120°C for 3 minutes and at 180°C for 7 minutes to remove the solvent. Then the obtained copper foil was placed in a nitrogen oven, placed at 180°C for 1 hour, at 220°C for 1 hour, at 300°C for 0.6 hour, and at 350°C for 0.5 hour to polyimide the polyamic acid ( Cyclization) reaction to make polyimide composite soft board. The structure of the composite soft board is copper foil / polyimide 1 (CTE greater than 20ppm) / polyimide 2 (CTE less than 20ppm).

[0051] Then, as described in (a) of the a...

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Abstract

The invention relates to a compound soft board made of polyimide resin and a manufacturing method thereof. In the method, polyamide acid with the coefficient of thermal-expansion (CTE) above 20ppm after cyclization and the polyamide acid with the thermal-expansion coefficient below 20ppm after the cyclization are orderly smeared and arranged on metallic foil, and then the polyamide acid is heated and cyclized to form the polyimide, so that the compound soft board made of the polyimide resin used in printed circuit boards is obtained. The method provided by the invention requires no the adhesion agent for obtaining the compound soft board of polyimide with the outstanding adhesiveness, mechanical property, high heat resistance and high size stability without warping as well.

Description

technical field [0001] The invention relates to a manufacturing method of a polyimide resin composite soft board and a polyimide composite soft board prepared by the method. Background technique [0002] Aramid films exhibit good high temperature resistance, good chemical properties, high insulation and high mechanical strength, and thus are widely used in various technical fields. For example, aromatic polyimide films are advantageously used in the form of continuous aromatic polyimide film / metallic film composite sheets for the manufacture of flexible printed boards (FPC), carrier tapes for automatic tape bonding (TAB ) and chip surface lead (LOC) structural tapes, especially flexible printed circuit boards, have been widely used in notebook computers, consumer electronics products, mobile phone communication equipment materials, etc. [0003] Heat-resistant plastic films (such as aromatic polyimide films) laminated with metal foils have been widely used in the manufactur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03C08G73/10B32B37/00B05C9/00
Inventor 黄坤源杜安邦巫胜彦林德裕
Owner CHANG CHUN PLASTICS
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