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5results about How to "No warping" patented technology

Platform moving type shaping device

The invention discloses a platform moving type shaping device which comprises a gantry frame, a moving driving mechanism, a material receiving overturning platform, a battery cell side pushing mechanism, an X-direction positioning mechanism, a shaping mechanism and a Y-direction positioning mechanism, and the Y-direction positioning mechanism, the gantry frame and the battery cell side pushing mechanism are sequentially arranged from front to back. The movement driving mechanism penetrates through the gantry frame and the battery cell side pushing mechanism, one end of the movement driving mechanism is close to the Y-direction positioning mechanism, and the material receiving and overturning platform is arranged on the movement driving mechanism and located between the gantry frame and the battery cell side pushing mechanism; the X-direction positioning mechanism and the shaping mechanism are both arranged on the gantry frame and located above the material receiving and overturning platform. According to the invention, the accuracy of the position of the battery cell can be ensured, so that the battery cell can be accurately fed into the cartridge holder of the formation and capacity grading device through the material taking device, one end of a tab and one end of an air bag are prevented from warping, and the quality of the battery cell is improved.
Owner:湖北精实机电科技有限公司

A method for soldering a semiconductor chip

ActiveCN114864423BNo warpingNo archingMetallurgySemiconductor chip
The application belongs to the field of semiconductor chip assembly, and particularly relates to a method for eutectic sintering of semiconductor chips. The method uses formic acid as a protective agent during eutectic sintering, and scientifically sets the eutectic sintering temperature rising and constant temperature programs, so that heat can be effectively and uniformly transferred to the solder and the chip, the solder can be stably melted, the formation of voids is reduced, and the adverse effects of the voids on the qualified rate of the solder piece are reduced.
Owner:GUIZHOU SPACE APPLIANCE CO LTD

A method for electron beam fusion additive manufacturing of beta titanium alloy components

ActiveCN121649543Bavoid pollutionimprove internal qualityAviationHigh density
The application discloses a method for electron beam fuse additive manufacturing of beta titanium alloy components, and belongs to the technical field of additive manufacturing. The application aims to solve the problems of long preparation period, low efficiency, low utilization rate, serious oxidation, significant beta spot and poor strength and toughness of the prior art. The method comprises the following steps: pretreating the printing wire and the substrate; establishing a three-dimensional entity model based on the target beta titanium alloy component, performing slice processing on the three-dimensional entity model to generate multi-layer two-dimensional slice data, and then importing the slice data into an electron beam fuse additive manufacturing equipment, and setting a scanning path, preheating parameters and printing process parameters; starting the equipment and performing vacuumization, printing the beta titanium alloy according to the set printing parameters and procedures, completing all layers, and obtaining the beta titanium alloy component. The beta titanium alloy component prepared by the application has high density, and provides a reliable technical approach for the preparation of high-performance beta titanium alloy components in the fields of aviation and aerospace.
Owner:HARBIN INST OF TECH +1

Cutting device for packaging bag processing

ActiveCN224210693UCut to size as requiredMeet the required shapeBag making operationsPaper-makingElectric machineryStructural engineering
The utility model relates to the technical field of packaging bag processing, and discloses a cutting device for packaging bag processing, which comprises a working table, a connecting assembly is fixedly connected outside the working table, the connecting assembly is used for supporting and limiting a processing assembly, the front side of the connecting assembly is fixedly connected with a fixing plate, and the fixing plate is fixedly connected with the working table. A first motor is fixedly connected to the upper side of the fixing plate, a rotating roller is fixedly connected to the output end of the first motor, a coil is slidably connected to the outer portion of the rotating roller, a supporting block is fixedly connected to the left end of the coil, and a sliding block is fixedly connected to the upper side of the supporting block. According to the packaging bag cutting device, it can be guaranteed that the cutting size and shape of each packaging bag meet the requirements, the cutting process can be automatically completed, the production efficiency is greatly improved, the packaging bags can be automatically fixed and limited, edge warping of the packaging bags is avoided, and the packaging bag cutting device is convenient for workers to use.
Owner:HUBEI JIATENG NEW MATERIALS TECHNOLOGY GROUP CO LTD

A glue strip pressing device for door and window processing

ActiveCN224588654UEasy to installInstall flatAdhesiveStructural engineering
This utility model discloses a sealing strip pressing device for door and window processing, relating to the field of door and window processing equipment. It includes a first support rod, a second support rod, a roller, a third support rod, a guide tube, a guide wheel, a fourth support rod, a handle, and a dripper. The first support rod is horizontally positioned, with its front end vertically connected to the second support rod. The bottom end of the second support rod is connected to a roller for pressing the sealing strip. The rear end of the first support rod is vertically connected to the third support rod, with the bottom end of the third support rod connected to the guide tube. The guide tube has guide wheels on its bottom and left and right sides for guiding the sealing strip. The top of the first support rod is vertically connected to the fourth support rod, with the top end of the fourth support rod connected to the handle. The bottom of the guide tube is connected to a dripper containing adhesive. This device integrates sealing strip guiding, adhesive dripping control, and sealing strip compaction functions, allowing the operator to complete all actions with one hand.
Owner:JINAN DEXIN DOOR & WINDOW CO LTD