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47results about How to "Simplify packaging steps" patented technology

Passive wireless pressure sensor based on flexible substrates

The invention discloses a passive wireless pressure sensor based on flexible substrates. The passive wireless pressure sensor comprises an upper metal layer, an upper flexible substrate, a middle flexible substrate, a lower flexible substrate and a lower metal layer, wherein interlinked electrical through holes are formed in the upper flexible substrate, the middle flexible substrate and the lower flexible substrate; a cavity is formed on the middle flexible substrate; the upper metal layer comprises a planar inductance coil and a capacitive upper electrode plate which is arranged on the middle part of the planar inductance coil; an inner-side connecting head of the planar inductance coil is connected with the capacitive upper electrode plate; the lower metal layer comprises a capacitive lower electrode plate and an interconnecting wire, wherein the dimension of the capacitive lower electrode plate is the same as that of the capacitive upper electrode plate, the position of the capacitive lower electrode plate is opposite to that of the capacitive upper electrode plate, and the interconnecting wire is connected with the capacitive lower electrode plate; an outer-side connecting head of the planar inductance coil of the upper metal layer is connected with the interconnecting wire of the lower metal layer by a conductive medium column which is arranged in the electrical through holes; and the cavity of the middle flexible substrate is arranged between the capacitive upper electrode plate and the capacitive lower electrode plate. The pressure sensor has the excellent performances of non-contact, high flexibility, high quality factor and low power consumption.
Owner:SOUTHEAST UNIV

Ultra-wideband short-wave infrared LED based on Bi-doped Ag2Se quantum dots and preparation method and application thereof

The invention relates to the technical field of photoelectricity, in particular to an ultra-wideband short-wave infrared LED based on Bi-doped Ag2Se quantum dots and a preparation method and application thereof. The preparation method comprises the following steps of: adding selenium powder into an organic phosphine ligand solution to obtain a selenium precursor solution; heating a silver-containing compound, a metal ligand and a non-coordinating solvent, adding the selenium precursor solution, and reacting to obtain Ag2Se quantum dots; dissolving a bismuth-containing compound in a polar solvent, and heating to obtain a Bi precursor solution; heating the Ag2Se quantum dots and the Bi precursor solution for reaction to obtain Bi-doped Ag2Se quantum dots; and packaging the Bi-doped Ag2Se quantum dots to obtain the light-induced conversion type ultra-wideband short-wave infrared LED. According to the preparation method, the Ag2Se emission wave band is subjected to red shift through bismuth ion doping, light emission of the Ag2Se quantum dots in the wave band of 1400-1700 nm is enhanced, ultra-wideband light emission of the Ag2Se quantum dots in the SWIR full-wave band is achieved, and an ultra-wideband tunable light-induced conversion type short-wave infrared LED is prepared by combining the Ag2Se quantum dots with a blue light LED chip and has wide application prospects in short-wave infrared spectra.
Owner:SHANDONG NORMAL UNIV

MEMS temperature, humidity and pressure three-in-one sensor chip and manufacturing process thereof

The invention provides an MEMS temperature, humidity and pressure three-in-one sensor chip and a manufacturing process thereof, the MEMS temperature, humidity and pressure three-in-one sensor chip comprises an SOI wafer, the SOI wafer comprises a bulk silicon layer, a buried oxide layer and a device silicon layer, a layer of metal film grows on the SOI wafer, a temperature measuring resistor and a pressure measuring resistor are constructed on the metal film through patterning, and the temperature measuring resistor and the pressure measuring resistor are arranged on the SOI wafer. A SiO2 layer is further deposited outside the metal thin film to serve as a temperature compensation layer and an inner layer medium, the SiO2 layer is patterned to form a through hole, a conductive metal layer is deposited on the SiO2 layer, and the conductive metal layer is patterned to form a metal bonding pad and a metal connecting wire, so that the piezoresistor is connected into a Wheatstone bridge; an interdigital structure for humidity measurement is also patterned on the conductive metal layer; and a cavity structure is etched on the back of the SOI wafer substrate. The problems that an existing sensor is not beneficial to overall size control of an intelligent product in part of scenes and lacks a convenient design of a composite temperature, humidity and pressure measurement function, and part of the design with the composite measurement function cannot effectively reduce parasitic capacitance and the like are solved. Belongs to the technical field of sensors.
Owner:贵州航天智慧农业有限公司

Display panel, display device and packaging method of organic light-emitting assembly

The embodiment of the invention provides a display panel, and the display panel comprises a first substrate; an electrode and an organic light-emitting layer which are arranged on the first substrate; cured light-cured glue and a second substrate which are sequentially arranged on the organic light-emitting layer; and a light shielding layer, wherein the light shielding layer is located at the side, facing the first substrate, of the second substrate and is close to the electrode. The orthographic projection area of the light shielding layer on the first substrate and the orthographic projection area of the organic light-emitting layer on the first substrate are not overlapped. The embodiment of the invention further discloses a display device and a packaging structure of the organic light-emitting assembly. According to the embodiment of the invention, the packaging structure is simple, and the cured light-cured adhesive of the organic light-emitting component can be completely packaged, so that the packaging effect can be improved, and the water and oxygen blocking capability can be improved; meanwhile, the enough mechanical strength can be ensured, and the service life of the organic light-emitting component can be prolonged.
Owner:BOE TECH GRP CO LTD

Water-blocking front plate integrated with solar cell interconnection and processing method thereof

The invention discloses a water-blocking front plate integrated with solar cell interconnection. The water-blocking front plate comprises a base material, wherein multiple groups of series circuits for realizing interconnection of a plurality of solar sub-cells are arranged on the base material; each series circuit is configured to comprise a plurality of drainage sub-grid lines, a plurality of main grid line bus bars and series points, wherein the drainage sub-grid lines are used for collecting photo-generated currents and are in a connected state; the main grid line bus bars are used for collecting the photo-generated currents collected by the drainage sub-grid lines; and the series points are arranged at leading-out ends of the main grid line bus bars. According to the water-blocking front plate integrated with solar cell interconnection, the series circuits for sub-cell current drainage, confluence and sub-cell series connection are integrated on a multi-layer composite substrate with high transmittance and high water blocking, the defects of series lead displacement, welding spot sealing-off, cell displacement and water-blocking packaging layer dislocation which are generatedin a process of packaging and laminating can be effectively avoided, and the packaging effect and the efficiency and the yield of the cells are improved. The invention further provides a processing method of the water-blocking front plate.
Owner:绵阳皓华光电科技有限公司

Integrated temperature measurement type ceramic packaging tube shell

The invention provides an integrated temperature measurement type ceramic packaging tube shell. The integrated temperature measurement type ceramic packaging tube shell further comprises a temperature measurement module which is designed integrally with the ceramic packaging tube shell; the temperature measurement module is a thermocouple or a thermal resistance temperature sensing region; the thermocouple or the thermal resistance temperature sensing region is formed by directly printing a thermo-sensitive resistor material on the inner surface of the ceramic packaging tube shell through a metal paste printing technology; a lead framework connected with the thermocouple or the thermal resistance temperature sensing region is reserved at the interior of the ceramic packaging tube shell; and the thermocouple or the thermal resistance temperature sensing region is communicated with a signal pin at the outside of the tube shell through the lead framework. According to the integrated temperature measurement type ceramic packaging tube shell, the temperature measurement function of the ceramic packaging tube shell per se can be realized, subsequent packaging steps can be simplified, and the production efficiency can be improved; and in addition, the thermo-sensitive resistor material is directly printed on the inner surface of the ceramic packaging tube shell through a metal paste printing technology, so that the degree of contact between the thermo-sensitive resistor material and the tube shell is maximized, the temperature of the interior of the tube shell can be responded exactly and in real time, and a very good monitoring index is provided for realization of the temperature control of the interior of the packaging structure.
Owner:XINFOO SENSOR TECH CO LTD

Automatic fly ash transfer device suitable for small-sized coal-fired power plant

The invention provides an automatic fly ash transfer device suitable for a small-sized coal-fired power plant, and belongs to the technical field of fly ash transfer devices. The device comprises a base and a charging piece, a rotating shaft is rotationally connected to the base, the rotating shaft is fixedly provided with an intermittent piece, a rotating disc and a conversion piece in sequence and in a sleeving mode, the side surface of a shaft of the rotating disc is uniformly provided with grooves, movable grooves are uniformly formed in the front surface of the rotating disc, stabilizingmechanisms are movably arranged in the movable grooves, and a centrifugal driving mechanism is arranged on the conversion piece. According to the automatic fly ash transfer device suitable for the small-sized coal-fired power plant, the rotating disc is used for driving the charging piece through the grooves on the rotating disc, meanwhile, the stabilizing mechanisms are combined to automaticallycomplete the timed and quantitative discharge and transfer of fly ash, so that the flying situation of the fly ash caused by a large amount of movement of the fly ash is effectively reduced, the harmof the fly ash to the health of people and the pollution to the environment are greatly reduced, and the device is very suitable for small-sized coal-fired power plants and similar fly ash generationplaces.
Owner:吴承毅

Three-dimensional stacking encapsulation method based on silicon through-hole

The invention discloses a three-dimensional stacking and packaging method based on silicon through-holes, and relates to an integration technology in the semi-conductor field. The method comprises thefollowing steps: wafers to be packaged are provided, and each wafer is provided with a plurality of welding pads; etching process is carried out for blocking layers deposited on the faces of the wafers until the welding pads on the wafers are exposed; silicon through-holes are formed in positions corresponding to the welding pads; electrodeless plating is adopted for filling the silicon through-holes with metal, and ends of through-holes filled with the metal are electrically connected with the welding pads, and the other ends thereof extend from the backs of the wafers to form connection parts; electrodeless plating is used for plating the welding pads with metal, and the plated metal protrudes from the faces of the wafers to form connection parts; and wafer bonding equipment is utilizedfor bonding the connection part onto the face of one wafer with the connection part on the back of another wafer, and then stacking the two connection parts up. Compared with the prior art, in the method provided by the invention, the electrodeless plating technology is adopted for filling the silicon through-holes with the metal, thereby simplifying the packaging process and improving the reliability of the stacked wafers.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Sterilization package capable of preventing from being wetted

The invention provides a sterilization package capable of preventing from being wetted, belonging to the technical fields of sterilization and package. The sterilization package is characterized in that the sterilization package is formed by overlapping a water sucking layer package sheet and a waterproof layer package sheet, and coating a device through a water sucking surface of the water suckling layer package sheet. An overlapping manner comprises a connected type overlapping manner and a separated type overlapping manner. The connected type overlapping manner is characterized in that the upper and lower sheet edges of one corresponding edge of the water sucking layer package sheet and the waterproof layer package sheet are adhered or sewed to form a half-open type sterilization package sheet, wherein one corresponding edge of the half-open type sterilization package sheet is adhered and the other corresponding edge of the half-open type sterilization package sheet is opened. The separated type overlapping manner is characterized in that the water sucking layer package sheet with an upward water sucking surface is flatly paved on the waterproof layer package sheet which is flatly paved, so as to form the sterilization package sheet. The device to be coated is placed on the sterilization package sheet, and is coated and sterilized, so as to form the sterilization package capable of preventing from being wetted. The sterilization package capable of preventing from being wetted has the beneficial effects as follows: the packaging step can be simplified, so that the working efficiency of packaging can be improved; and a water sucking layer is arranged inside and a waterproof layer is arranged outside, so that the package wetting phenomenon can be greatly reduced.
Owner:胡建平

a packaging system

The invention relates to the technical field of packaging equipment, and discloses a packaging system. The packaging system includes a packaging film unwinding mechanism, an intelligent weighing and conveying device, a packaging film wrapping mechanism, a packaging film cutting mechanism and a packaging film heat shrinking furnace arranged in sequence. The packaging film unwinding mechanism is equipped with an inner packaging film roll and a heat-shrinkable film roll. The intelligent weighing and conveying device weighs the object to be packaged and transmits the data to the control center, and then transports the object to be packaged to the packaging film wrapping mechanism. The lower part of the intelligent weighing conveying device is provided with a passage for the inner packaging film and heat shrinkable film released from the packaging film unwinding mechanism at the same time; a packaging system provided by the invention uses inner packaging film and heat shrinkable film Synchronously and continuously realize the complete wrapping of plastic film rolls, fully automatic operation, high degree of intelligence, low equipment operation and maintenance costs, good overall effect of packaging structure appearance, reasonable process design, and greatly improved production efficiency.
Owner:湖北金鸿星昌盛科技有限公司
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