48results about How to "Simplify packaging steps" patented technology

The invention discloses a passive wireless pressure sensor based on flexible substrates. The passive wireless pressure sensor comprises an upper metal layer, an upper flexible substrate, a middle flexible substrate, a lower flexible substrate and a lower metal layer, wherein interlinked electrical through holes are formed in the upper flexible substrate, the middle flexible substrate and the lower flexible substrate; a cavity is formed on the middle flexible substrate; the upper metal layer comprises a planar inductance coil and a capacitive upper electrode plate which is arranged on the middle part of the planar inductance coil; an inner-side connecting head of the planar inductance coil is connected with the capacitive upper electrode plate; the lower metal layer comprises a capacitive lower electrode plate and an interconnecting wire, wherein the dimension of the capacitive lower electrode plate is the same as that of the capacitive upper electrode plate, the position of the capacitive lower electrode plate is opposite to that of the capacitive upper electrode plate, and the interconnecting wire is connected with the capacitive lower electrode plate; an outer-side connecting head of the planar inductance coil of the upper metal layer is connected with the interconnecting wire of the lower metal layer by a conductive medium column which is arranged in the electrical through holes; and the cavity of the middle flexible substrate is arranged between the capacitive upper electrode plate and the capacitive lower electrode plate. The pressure sensor has the excellent performances of non-contact, high flexibility, high quality factor and low power consumption.

The infra-red image sensor comprises a ceramic base, a metal upper cover and an infra-red cut filter. An infra-red image chip is stuck on said ceramic base. On the inner side of said metal upper cover there is a getter. Said infra-red cut filter is used to seal a photic opening in said metal upper cover. The method thereof comprises: respectively heating up said ceramic base, metal upper cover and infra-red cut filter; bonding said ceramic base, metal upper cover and infra-red cut filter using active getter together.

A light emitting diode (LED) package and the manufacturing method thereof are provided. The LED package (400) comprises a substrate (404), at least one LED die (403), a lens (410) and an in-mold decoration film (40), wherein the LED die (403) is fixed on the substrate (404); the lens (410) is convexly molded on the substrate (404) to encapsulate the LED die (403); and the in-mold decoration film (40) has at least one phosphor layer (401) disposed on the lens (410) and a surface treatment layer (406) disposed on the phosphor layer (401).

The method for packaging flip chip includes steps: supplying substrate, and the substrate possesses multiple IC substrate units; at least one metal inner connection layer is setup in each IC substrate unit; multiple connection pads are set up on surface of IC substrate unit; next, forming patternized procured adhesion layer to cover the substrate and the connection pads; forming openings to expose partial up surface of each connection pad, and filling conducting material into each opening; then, providing multiple chips, and multiple conductive salient points setup on bottom surface of chip; installing chip on surface of IC substrate unit; finally, dividing up the substrate into multiple structures of packaging flip chip. At least one chip is setup on surface of structure of packaging flip chip.

The process of manufacturing semiconductor package structure with micro electromechanical system includes the following steps: setting several micro electromechanical systems onto base plate units in one base plate, sealing these micro electromechanical systems with several covering bodies of one cover plate, eliminating the main body of the cover plate, and cutting the base plate to form several semiconductor package structures. The process has no need of forming locating markers and is simple. In addition, the cover plate has no need of being made of transparent material and the main body may be eliminated through a simple grinding step, so that the present invention has wide application and low production cost.

The invention relates to the technical field of packaging, in particular to a packaging method. The packaging method comprises the following steps: providing a bottom plate and a film; coating pressure-sensitive adhesive and / or a binder on the bottom plate or the film; compounding the film to the bottom plate, and forming a sealing area for accommodating a product; and turning over the bottom plate to stretch the film. The packaging method has the advantages that: the film is compounded to the bottom plate, and the bottom plate is turned over to stretch the film, so that product is fixed and sealed, packaging steps are simple and convenient, and the cost is low.

The invention provides an integrated multifunctional ceramic packaging tube shell. The integrated multifunctional ceramic packaging tube shell comprises a ceramic packaged tube shell, a getter module, a temperature measurement module and a temperature control module; and the getter module, the temperature measurement module, the temperature control module and the ceramic packaging tube shell are designed integrally. According to the integrated multifunctional ceramic packaging tube shell, air suction, temperature control and temperature measurement functions of the ceramic packaging tube shell per se can be realized, subsequent packaging steps can be simplified, production efficiency can be improved, and a risk in device failure caused by the installation link of each module is reduced. In addition, as the getter module, the temperature control module and the temperature measurement module are integrated in the ceramic packaging tube shell, the integration level of the ceramic packaging tube shell can be improved, and reduction of the volume of the packaged device is benefited.

The present invention discloses a LED package structure employing a glass fluorescence sheet. The LED package structure employing a glass fluorescence sheet comprises a glass fluorescence sheet, the glass fluorescence sheet is covered with fixed crystal glue, LED chips are fixed on the fixed crystal glue, and gaps between the LED chips are filled with filling glues. According to the LED package structure employing the glass fluorescence sheet, the luminescent materials and the glass are uniformly mixed together to form the glass fluorescence sheet, and the LED package is realized by employing good oxygen isolation and humidty isolation functions of the glass, therefore the problem of isolating the oxygen and the water vapor in the process of the LED package is solved, and the steps of the LED package are greatly simplified so as to effectively improve the production efficiency and the yield rate and the consistency of products.

The invention relates to the technical field of photoelectricity, in particular to an ultra-wideband short-wave infrared LED based on Bi-doped Ag2Se quantum dots and a preparation method and application thereof. The preparation method comprises the following steps of: adding selenium powder into an organic phosphine ligand solution to obtain a selenium precursor solution; heating a silver-containing compound, a metal ligand and a non-coordinating solvent, adding the selenium precursor solution, and reacting to obtain Ag2Se quantum dots; dissolving a bismuth-containing compound in a polar solvent, and heating to obtain a Bi precursor solution; heating the Ag2Se quantum dots and the Bi precursor solution for reaction to obtain Bi-doped Ag2Se quantum dots; and packaging the Bi-doped Ag2Se quantum dots to obtain the light-induced conversion type ultra-wideband short-wave infrared LED. According to the preparation method, the Ag2Se emission wave band is subjected to red shift through bismuth ion doping, light emission of the Ag2Se quantum dots in the wave band of 1400-1700 nm is enhanced, ultra-wideband light emission of the Ag2Se quantum dots in the SWIR full-wave band is achieved, and an ultra-wideband tunable light-induced conversion type short-wave infrared LED is prepared by combining the Ag2Se quantum dots with a blue light LED chip and has wide application prospects in short-wave infrared spectra.

The invention discloses photovoltaic solar panel gluing and framing equipment. The photovoltaic solar panel gluing and framing equipment comprises a shell. A cell panel is arranged on the upper end face of the shell, an installation plate is arranged on the upper side of the shell and can move vertically, four connecting rods are fixedly arranged on the lower end face of the installation plate, electric guide rails are fixedly arranged at the lower ends of the connecting rods, and a glue gun is installed on one side of each electric guide rail. According to the photovoltaic solar panel gluingand framing equipment, gluing can be carried out on the periphery of the cell panel, and four aluminum profiles directly reach assigned positions after gluing is finished, so that overturning of the aluminum profiles is not needed, and thus the time for conveying the aluminum profiles to the assigned positions is also omitted; and thus, encapsulating steps are simplified, the time needed for encapsulation is shortened, and the space occupied by the equipment is also reduced.

The invention discloses a COB package and a preparation method thereof. The COB package comprises a substrate, an LED chip, a light conversion layer, a silica gel layer and blocking glue. The LED chipis installed on the substrate. The light conversion layer wraps the LED chip. The light conversion layer comprises at least one of methyl silicone rubber and methyl phenyl silicone rubber. The preparation method comprises the following steps: fixing the LED chip; forming the blocking glue blocking: forming the blocking glue on the periphery of the LED chip; filling and coating the light conversion layer: filling and coating the light conversion layer to coat the LED chip, and then standing; filling and coating the silica gel layer: filling and coating the silica gel layer in the blocking glueand on the light conversion layer; performing defoaming and baking: after the silica gel layer is filled and coated, performing defoaming treatment, and then performing baking. Through material improvement of the light conversion layer, absorbed heat can be rapidly conducted out, and the problems that the light conversion layer loses efficacy due to heating and glue cracks are caused by too hightemperature are effectively solved.

The invention discloses a packaging structure and a packaging method for downward exposure of the front surface of a sensor chip. The packaging structure comprises a base, wherein the base is internally provided with a cavity, the cavity is internally provided with a sensor chip body, the top of the base is provided with a first gasket, the bottom inner wall of the base is fixedly provided with asecond gasket, the inner wall of the second gasket is fixedly provided with a third gasket in a sleeving mode, a screw is arranged at the bottom of the base in a penetrating mode, and two buffer devices are arranged at the top of the base. The structure is simple and novel, the sealing function of the sensor chip is improved, the stability of the sensor is improved, the sensor is connected with the outside through a screw through hole, the use sensitivity is improved, and the packaging method is simple and suitable for market popularization.

The invention relates to a nuclear orphan receptor alpha (ROR alpha) adeno-associated virus vector related to retinoic acid in mice and a construction method of the vector and belongs to the field of gene therapy of diseases. The vector genome disclosed by the invention is small and contains a linear single-stranded DNA genome of which the size is between 4.7kb and 6kb. The rAAV-ROR alpha is packaged by virtue of a three-plasmid transfection method capable of reducing adenovirus pollution, a heparin agarose purification method without destroying AAV and AmiconUtra-15 efficient concentration effect and applied in transfection of tumor cells. The vector can infect cells in division and static stages, can be integrated into a specific domain of a host cell genome, is non-pathogenic and has weak immunogenicity, can be used in in-vivo tests and in-vitro experiments so as to give a full play to the effect of AAV vector in gene therapy as well as regulation effect of ROR alpha in a plurality of important physiological processes.

The invention discloses a passive wireless pressure sensor based on a flexible substrate, which comprises an upper metal layer, an upper flexible substrate, a middle flexible substrate, a lower flexible substrate and a lower metal layer. There are connected electrical through holes, and a cavity is provided on the middle flexible substrate; the upper metal layer includes a planar inductance coil and a capacitor upper plate located in the middle of the planar inductance coil, and the inner connector of the planar inductance coil is connected to the capacitor upper plate; The lower metal layer includes a capacitor lower plate that is the same size as the capacitor upper plate and is opposite to the capacitor, and an interconnection line connected to the capacitor lower plate; The conductive medium column is connected with the interconnection line of the lower metal layer, and the cavity of the middle flexible substrate is located between the upper pole plate of the capacitor and the lower pole plate of the capacitor. The pressure sensor has excellent performances of non-contact, high sensitivity, high quality factor and low power consumption.

The invention relates to the preparation field of insulating core shell composite structures, and concretely relates to preparation and applications of insulating core shell composite structures high in heat conduction and high in reflectivity. Compared with insulating core shell composite structures produced by the prior art, nano to micron insulating core shell composite structures prepared are high in heat conduction and high in reflectivity, and exhibit excellent insulating properties. Meanwhile, the insulating core shell composite structures can disperse steady in silica gel. An adopted synthesis process is environment-friendly, simple, and low in cost. Furthermore, a one-step packaging method is provided to enable LED chip packaging to be realized while highly reflective film layers can be printed. Module packaging steps are simplified, and the heat dissipation efficiency of devices is improved.

The invention provides an MEMS temperature, humidity and pressure three-in-one sensor chip and a manufacturing process thereof, the MEMS temperature, humidity and pressure three-in-one sensor chip comprises an SOI wafer, the SOI wafer comprises a bulk silicon layer, a buried oxide layer and a device silicon layer, a layer of metal film grows on the SOI wafer, a temperature measuring resistor and a pressure measuring resistor are constructed on the metal film through patterning, and the temperature measuring resistor and the pressure measuring resistor are arranged on the SOI wafer. A SiO2 layer is further deposited outside the metal thin film to serve as a temperature compensation layer and an inner layer medium, the SiO2 layer is patterned to form a through hole, a conductive metal layer is deposited on the SiO2 layer, and the conductive metal layer is patterned to form a metal bonding pad and a metal connecting wire, so that the piezoresistor is connected into a Wheatstone bridge; an interdigital structure for humidity measurement is also patterned on the conductive metal layer; and a cavity structure is etched on the back of the SOI wafer substrate. The problems that an existing sensor is not beneficial to overall size control of an intelligent product in part of scenes and lacks a convenient design of a composite temperature, humidity and pressure measurement function, and part of the design with the composite measurement function cannot effectively reduce parasitic capacitance and the like are solved. Belongs to the technical field of sensors.

The invention provides an air purification activated carbon bag production system. The production system comprises a charging mechanism, a packaging mechanism and a delivery mechanism; the charging mechanism is installed on the outer wall of the middle of the delivery mechanism; the packaging mechanism is arranged right behind the charging mechanism; and the packaging mechanism is installed on theouter wall of the delivery mechanism. According to the production system, the problems that in the packaging process for producing and manufacturing activated carbon, the activated carbon is light inweight and black in color, some powder in the activated carbon drifts easily to the outside of a packaging bag to blacken the outer surface in the packaging process, the blackened outer surface of the packaging bag becomes dirty and not attractive, selling of the activated carbon as a finished product commodity is affected, manual charging is adopted mostly during existing activated carbon bag production and packaging, the process is tedious, the specification and weight of transferred materials cannot be effectively controlled, the efficiency is low, the labor intensity of workers is increased, and the like are solved.

The embodiment of the invention provides a display panel, and the display panel comprises a first substrate; an electrode and an organic light-emitting layer which are arranged on the first substrate; cured light-cured glue and a second substrate which are sequentially arranged on the organic light-emitting layer; and a light shielding layer, wherein the light shielding layer is located at the side, facing the first substrate, of the second substrate and is close to the electrode. The orthographic projection area of the light shielding layer on the first substrate and the orthographic projection area of the organic light-emitting layer on the first substrate are not overlapped. The embodiment of the invention further discloses a display device and a packaging structure of the organic light-emitting assembly. According to the embodiment of the invention, the packaging structure is simple, and the cured light-cured adhesive of the organic light-emitting component can be completely packaged, so that the packaging effect can be improved, and the water and oxygen blocking capability can be improved; meanwhile, the enough mechanical strength can be ensured, and the service life of the organic light-emitting component can be prolonged.

The invention discloses a water-blocking front plate integrated with solar cell interconnection. The water-blocking front plate comprises a base material, wherein multiple groups of series circuits for realizing interconnection of a plurality of solar sub-cells are arranged on the base material; each series circuit is configured to comprise a plurality of drainage sub-grid lines, a plurality of main grid line bus bars and series points, wherein the drainage sub-grid lines are used for collecting photo-generated currents and are in a connected state; the main grid line bus bars are used for collecting the photo-generated currents collected by the drainage sub-grid lines; and the series points are arranged at leading-out ends of the main grid line bus bars. According to the water-blocking front plate integrated with solar cell interconnection, the series circuits for sub-cell current drainage, confluence and sub-cell series connection are integrated on a multi-layer composite substrate with high transmittance and high water blocking, the defects of series lead displacement, welding spot sealing-off, cell displacement and water-blocking packaging layer dislocation which are generatedin a process of packaging and laminating can be effectively avoided, and the packaging effect and the efficiency and the yield of the cells are improved. The invention further provides a processing method of the water-blocking front plate.

The invention discloses a packaging method for rapidly obtaining high-titer lentivirus, which comprises the following steps: mixing lentivirus packaging plasmids, a target gene expression plasmid, a transfection reagent and protamine to form liposome, wherein the lentivirus packaging plasmids are pRsv-REV, pMDLG-pRRE and pVSV-G; adding the formed liposome into tool cells for transfection and culture; and collecting the cultured virus supernatant, and treating to obtain a virus solution. Through the mode, the optimized and improved formula of the four-plasmid system of the lentivirus packaging system and the transfection reagent are adopted, the virus packaging period can be greatly shortened, the time cost is saved, the method does not need to repeatedly replace medium for cells, the packaging steps are simple and easy to operate, the types of reagents used in the method are reduced, the operation is easy, and the lentivirus packaged by the method is high in titer and high in purity, and can be used for animal-level research.

The invention provides an integrated temperature measurement type ceramic packaging tube shell. The integrated temperature measurement type ceramic packaging tube shell further comprises a temperature measurement module which is designed integrally with the ceramic packaging tube shell; the temperature measurement module is a thermocouple or a thermal resistance temperature sensing region; the thermocouple or the thermal resistance temperature sensing region is formed by directly printing a thermo-sensitive resistor material on the inner surface of the ceramic packaging tube shell through a metal paste printing technology; a lead framework connected with the thermocouple or the thermal resistance temperature sensing region is reserved at the interior of the ceramic packaging tube shell; and the thermocouple or the thermal resistance temperature sensing region is communicated with a signal pin at the outside of the tube shell through the lead framework. According to the integrated temperature measurement type ceramic packaging tube shell, the temperature measurement function of the ceramic packaging tube shell per se can be realized, subsequent packaging steps can be simplified, and the production efficiency can be improved; and in addition, the thermo-sensitive resistor material is directly printed on the inner surface of the ceramic packaging tube shell through a metal paste printing technology, so that the degree of contact between the thermo-sensitive resistor material and the tube shell is maximized, the temperature of the interior of the tube shell can be responded exactly and in real time, and a very good monitoring index is provided for realization of the temperature control of the interior of the packaging structure.

The invention provides an MEMS sensor and a preparation method thereof, and the method comprises the steps: forming corresponding electrode layers on the front surfaces of a first substrate and a second substrate, enabling the front surfaces of the first substrate and the second substrate to be bonded together through a bonding technology, and enabling the electrode layers to be sealed in a cavityformed through bonding, and the electrode layer is electrically connected with the pressure points on the front surface of the first substrate through a conductive connection structure or directly connected with the pressure points on the front surface of the first substrate. Equivalently, the preparation of the device is realized by utilizing an MEMS process, the reliability of the device is improved, the preparation difficulty is reduced, and the subsequent packaging step can be simplified.

The invention provides an automatic fly ash transfer device suitable for a small-sized coal-fired power plant, and belongs to the technical field of fly ash transfer devices. The device comprises a base and a charging piece, a rotating shaft is rotationally connected to the base, the rotating shaft is fixedly provided with an intermittent piece, a rotating disc and a conversion piece in sequence and in a sleeving mode, the side surface of a shaft of the rotating disc is uniformly provided with grooves, movable grooves are uniformly formed in the front surface of the rotating disc, stabilizingmechanisms are movably arranged in the movable grooves, and a centrifugal driving mechanism is arranged on the conversion piece. According to the automatic fly ash transfer device suitable for the small-sized coal-fired power plant, the rotating disc is used for driving the charging piece through the grooves on the rotating disc, meanwhile, the stabilizing mechanisms are combined to automaticallycomplete the timed and quantitative discharge and transfer of fly ash, so that the flying situation of the fly ash caused by a large amount of movement of the fly ash is effectively reduced, the harmof the fly ash to the health of people and the pollution to the environment are greatly reduced, and the device is very suitable for small-sized coal-fired power plants and similar fly ash generationplaces.

The process of manufacturing semiconductor package structure with micro electromechanical system includes the following steps: setting several micro electromechanical systems onto base plate units in one base plate, sealing these micro electromechanical systems with several covering bodies of one cover plate, eliminating the main body of the cover plate, and cutting the base plate to form severalsemiconductor package structures. The process has no need of forming locating markers and is simple. In addition, the cover plate has no need of being made of transparent material and the main body may be eliminated through a simple grinding step, so that the present invention has wide application and low production cost.

The invention relates to the technical field of food processing equipment, in particular to a yolk weighting and packaging device. The yolk weighting and packaging device comprises a feeding device, a conveying device and a packaging device, and the feeding device, the conveying device and the packaging device are sequentially arranged from right to left; the feeding device is provided with a feeding hopper and a baffle; the conveying device comprises supporting platforms arranged on the two sides below the baffle; the packaging device comprises a conveying plate arranged below the tail end of a conveying belt, and the tail end of the conveying plate is connected with a fixing groove; and the packaging device comprises an oscillator and a vacuumizing sealing assembly. According to the yolk weighting and packaging device, yolk can be automatically weighted and subjected to vacuum packaging, the labor intensity of workers is reduced, and the packaging efficiency is improved.

The invention provides a sterilization package capable of preventing from being wetted, belonging to the technical fields of sterilization and package. The sterilization package is characterized in that the sterilization package is formed by overlapping a water sucking layer package sheet and a waterproof layer package sheet, and coating a device through a water sucking surface of the water suckling layer package sheet. An overlapping manner comprises a connected type overlapping manner and a separated type overlapping manner. The connected type overlapping manner is characterized in that the upper and lower sheet edges of one corresponding edge of the water sucking layer package sheet and the waterproof layer package sheet are adhered or sewed to form a half-open type sterilization package sheet, wherein one corresponding edge of the half-open type sterilization package sheet is adhered and the other corresponding edge of the half-open type sterilization package sheet is opened. The separated type overlapping manner is characterized in that the water sucking layer package sheet with an upward water sucking surface is flatly paved on the waterproof layer package sheet which is flatly paved, so as to form the sterilization package sheet. The device to be coated is placed on the sterilization package sheet, and is coated and sterilized, so as to form the sterilization package capable of preventing from being wetted. The sterilization package capable of preventing from being wetted has the beneficial effects as follows: the packaging step can be simplified, so that the working efficiency of packaging can be improved; and a water sucking layer is arranged inside and a waterproof layer is arranged outside, so that the package wetting phenomenon can be greatly reduced.

The invention discloses a packaging structure and a packaging method in which the front surface of a sensor chip is exposed downward. The packaging structure includes a base, and a cavity is opened inside the base, and a sensor chip body is arranged inside the cavity. The top of the base is provided with a first washer, the inner wall of the bottom of the base is fixed with a second washer, the inner wall of the second washer is fixedly provided with a third washer, and the bottom of the base is provided with a screw , the top of the base is provided with two buffer devices. The invention has a simple and novel structure, improves the sealing function of the sensor chip, improves the stability of the sensor, and the sensor is connected to the outside through the through hole of the screw rod, thereby improving the sensitivity of use, and the packaging method is simple, and is suitable for market promotion.