A packaging structure and packaging method with the front surface of a sensor chip exposed downward

Abstract

The invention discloses a packaging structure and a packaging method in which the front surface of a sensor chip is exposed downward. The packaging structure includes a base, and a cavity is opened inside the base, and a sensor chip body is arranged inside the cavity. The top of the base is provided with a first washer, the inner wall of the bottom of the base is fixed with a second washer, the inner wall of the second washer is fixedly provided with a third washer, and the bottom of the base is provided with a screw , the top of the base is provided with two buffer devices. The invention has a simple and novel structure, improves the sealing function of the sensor chip, improves the stability of the sensor, and the sensor is connected to the outside through the through hole of the screw rod, thereby improving the sensitivity of use, and the packaging method is simple, and is suitable for market promotion.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and packaging method in which the front side of a sensor chip is exposed downward. Background technique [0002] In order to obtain information from the outside world, people must rely on sensory organs. People's own sensory organs are far from enough to study natural phenomena and laws and their functions in production activities. In the process of using information, the first thing to solve is to obtain accurate and reliable information, and sensors are the main ways and means to obtain information in the natural and production fields. In modern industrial production, especially in the automated production process, various sensors are used to monitor and control various parameters in the production process, so that the products can achieve the best quality. Therefore, it can be said that without a large number of excellent sensors, modern...

AI Technical Summary

Problems solved by technology

When the sensor is in use, it needs to be packaged to ensure the stability and sealing of the internal parts of the sensor and to ensure the beam sensitivity of the sensor to perceive things. However, the existing sensor package is to package the sensor directly with the connector, so that there is no sensor outside the sensor. The protective structure, which has insufficient protection for the sensor, will affect the stability of the sensor in long-term use. For this reason, we have proposed a packaging structure and packaging method in which the front side of the sensor chip is exposed downward.

Images