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Infrared imaging sensor and its vacuum packing method

An image sensor and infrared technology, applied in radiation control devices and other directions, can solve problems such as affecting the sensitivity of infrared image sensors of sensors, complex manufacturing process, etc., and achieve the effects of improving sensitivity and service life, simplifying packaging steps, and increasing the amount of configuration.

Inactive Publication Date: 2006-11-01
UNIMEMS MFG
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Problems solved by technology

[0005] Therefore, the traditional packaging of thermal infrared image sensors requires a vacuum pumping process after the packaging is completed, and then the pumping tube is closed, which not only makes the process complicated, but also makes the process difficult because the getter is installed in the pumping tube. The number of getters that can be installed is limited by the volume of the suction pipe. If the number of getters is not enough, it will obviously affect the vacuum degree in the sensor and the sensitivity of the infrared image sensor

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  • Infrared imaging sensor and its vacuum packing method
  • Infrared imaging sensor and its vacuum packing method
  • Infrared imaging sensor and its vacuum packing method

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Embodiment Construction

[0036] The infrared image sensor and its vacuum packaging method of the present invention can not only simplify the steps of the packaging process required for the infrared image sensor, but also properly install the getter in the infrared image sensor, so that the infrared image sensor can reach the required vacuum degree. Requirements, thereby improving its sensitivity and service life. The following will clearly illustrate the concept of the present invention with the drawings and detailed description.

[0037] figure 1 It is a three-dimensional schematic diagram of parts of the infrared image sensor of the present invention. As shown in the figure, the infrared image sensor 100 of the present invention includes a filter 140 , an upper cover 130 , a base 120 and a thermoelectric temperature stabilizer 110 . The filter 140 is located above the upper cover 130 and is used to close the opening 134 of the upper cover 130 to maintain the vacuum of the infrared image sensor 100...

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Abstract

The infra-red image sensor comprises a ceramic base, a metal upper cover and an infra-red cut filter. An infra-red image chip is stuck on said ceramic base. On the inner side of said metal upper cover there is a getter. Said infra-red cut filter is used to seal a photic opening in said metal upper cover. The method thereof comprises: respectively heating up said ceramic base, metal upper cover and infra-red cut filter; bonding said ceramic base, metal upper cover and infra-red cut filter using active getter together.

Description

technical field [0001] The present invention relates to an infrared image sensor and a manufacturing method thereof, in particular to a vacuum-encapsulated infrared image sensor and a manufacturing method thereof. Background technique [0002] With the rapid progress of the semiconductor industry and electronic technology, the manufacturing technology of infrared sensors is also improving day by day. Infrared sensors can be used not only in medicine to measure body temperature, but also in science, business and military, such as laser detection, missile guidance, infrared spectrometer, remote control, anti-theft device, thermal image reconnaissance, etc. . The infrared sensors can be mainly divided into two categories: thermal and photon. Since thermal infrared sensors are more convenient to use, they are widely used in general. [0003] Thermal infrared image sensors generally work close to room temperature, but due to the heat conduction effect of the air, a large amoun...

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Application Information

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IPC IPC(8): H01L27/146
Inventor 李宗昇林炳蔚陈相甫利鸿褆欧政隆
Owner UNIMEMS MFG
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