LED package structure and technology employing glass fluorescence sheet

A technology of LED packaging and fluorescent sheets, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of easy occurrence of defects, non-curing, and broken gold wires, so as to improve production efficiency, product yield and consistency, The effect of simplifying LED packaging steps

Inactive Publication Date: 2015-12-09
SHINEON BEIJING TECH
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Problems solved by technology

All three methods have problems such as yellowing of silica gel, cracking at high temperature, and non-curing when exposed to sulfur. Since the LED phosphor and the silver-plated reflective layer of the bracket are easily oxidized and cause light decay, how to use a simple method to completely isolate Water vapor in the air, etc., is of great significance to LED
In addition, the gold wire is easily broken due to the thermal expansion and contraction of the silica gel and the bracket, resulting in defects. Due to phosphor precipitation, uneven mixing, and air bubbles, the concentration of the LED prepared by the dispensing method is relatively scattered. The current LED packaging needs There are too many control factors, resulting in strict process requirements and prone to defects

Method used

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  • LED package structure and technology employing glass fluorescence sheet
  • LED package structure and technology employing glass fluorescence sheet

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Embodiment Construction

[0027] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0028] Such as figure 1 As shown, the LED packaging structure 1 using a glass fluorescent sheet includes a glass fluorescent sheet 2 coated with a crystal-bonding glue 3 , and an LED chip 4 is fixed above the crystal-bonding glue 3 . The LED chip 4 The die-bonding glue 3 is flip-chip mounted, and the gaps between the LED chips 4 are filled with filling glue 5 . It should be pointed out that, when coating the die-bonding glue 3 , it is necessary to use a patterned mask plate or mask sheet to realize the patterned coating of the die-bonding glue. The filler here can act as an optical reflection or block light, and the corresponding material can be...

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Abstract

The present invention discloses a LED package structure employing a glass fluorescence sheet. The LED package structure employing a glass fluorescence sheet comprises a glass fluorescence sheet, the glass fluorescence sheet is covered with fixed crystal glue, LED chips are fixed on the fixed crystal glue, and gaps between the LED chips are filled with filling glues. According to the LED package structure employing the glass fluorescence sheet, the luminescent materials and the glass are uniformly mixed together to form the glass fluorescence sheet, and the LED package is realized by employing good oxygen isolation and humidty isolation functions of the glass, therefore the problem of isolating the oxygen and the water vapor in the process of the LED package is solved, and the steps of the LED package are greatly simplified so as to effectively improve the production efficiency and the yield rate and the consistency of products.

Description

technical field [0001] The invention relates to an LED package structure and process, more precisely, an LED package structure and process using glass fluorescent sheets. Background technique [0002] At present, white light LEDs are packaged with transparent silica gel and phosphor powder. There are three main methods of dispensing silica gel, namely dispensing, potting and molding. All three methods have problems such as yellowing of silica gel, cracking at high temperature, and non-curing when exposed to sulfur. Since the LED phosphor and the silver-plated reflective layer of the bracket are easily oxidized and cause light decay, how to use a simple method to completely isolate Water vapor in the air, etc., is of great significance to LEDs. In addition, the gold wire is easily broken due to the thermal expansion and contraction of the silica gel and the bracket, resulting in defects. Due to phosphor precipitation, uneven mixing, and air bubbles, the concentration of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/48H01L33/00
CPCH01L33/50H01L33/48H01L33/502H01L33/505H01L2933/0041
Inventor 张俊福申崇渝孙国喜
Owner SHINEON BEIJING TECH
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