Integrated temperature measurement type ceramic packaging tube shell

Abstract

The invention provides an integrated temperature measurement type ceramic packaging tube shell. The integrated temperature measurement type ceramic packaging tube shell further comprises a temperature measurement module which is designed integrally with the ceramic packaging tube shell; the temperature measurement module is a thermocouple or a thermal resistance temperature sensing region; the thermocouple or the thermal resistance temperature sensing region is formed by directly printing a thermo-sensitive resistor material on the inner surface of the ceramic packaging tube shell through a metal paste printing technology; a lead framework connected with the thermocouple or the thermal resistance temperature sensing region is reserved at the interior of the ceramic packaging tube shell; and the thermocouple or the thermal resistance temperature sensing region is communicated with a signal pin at the outside of the tube shell through the lead framework. According to the integrated temperature measurement type ceramic packaging tube shell, the temperature measurement function of the ceramic packaging tube shell per se can be realized, subsequent packaging steps can be simplified, and the production efficiency can be improved; and in addition, the thermo-sensitive resistor material is directly printed on the inner surface of the ceramic packaging tube shell through a metal paste printing technology, so that the degree of contact between the thermo-sensitive resistor material and the tube shell is maximized, the temperature of the interior of the tube shell can be responded exactly and in real time, and a very good monitoring index is provided for realization of the temperature control of the interior of the packaging structure.

Description

technical field [0001] The invention relates to a packaging shell of MEMS devices, in particular to an integrated temperature-measuring ceramic packaging shell. Background technique [0002] At present, MEMS sensors such as infrared thermal imaging and THz generally use ceramic shells to achieve high vacuum, constant temperature and small-volume packaging. In order to achieve a constant internal temperature of the packaging structure, it is necessary to set temperature measuring elements and temperature control elements inside the packaging structure, such as thermocouples or thermal resistance elements and TEC elements, to realize the function of real-time measurement and control of the internal temperature of the packaging structure. [0003] In the traditional packaging process, the assembly of thermocouples or thermal resistance elements needs to fix the independent thermocouples or thermal resistance elements on the shell by welding or bonding, but the installation proc...

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Problems solved by technology

[0003] In the traditional packaging process, the assembly of thermocouples or thermal resistance elements needs to fix independent thermocouples or thermal resistance elements on the shell by welding or bonding, but the installation process of independent thermocouples or thermal resistance elements is different from that of tubes. The temperature, time and equipment used in the assembly process of other components in the shell, such as getter components, temperature control components, and MEMS devices are different, which increases the complexity of the packaging process and is prone to failure caused by thermocouple or thermal resistance installation failure. The risk of failure of the temperature measurement function; in addition, in the vacuum packaged device, since the inside of the package is a high vacuum environment after packaging, there is no convective heat conduction condition, the contact degree between the independent thermocouple or thermal resistance temperature measuring component and the package is limited. It will directly affect the accuracy and real-time performance of the temperature measurement inside the shell, and the way of welding or bonding cannot guarantee the full contact between the thermocouple or thermal resistance element and the shell; moreover, in mass production, each packaged device The inconsistency of the contact degree between the thermocouple or thermal resistance and the shell will also affect the improvement of production yield

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