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Conductive composition

A technology of composition and mixture, applied in the field of conductive composition

Inactive Publication Date: 2015-10-14
NUTRITION & BIOSCIENCES USA 1 LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, alternative strategies are needed, since changing the glass phase often imposes additional changes, for example, on the sintering conditions

Method used

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  • Conductive composition
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Embodiment Construction

[0072] Material

[0073] ETHOCEL STD 10 (EC STD 10): ethylcellulose obtained from Dow Chemical, DS: 2.5, M w : 83,000g / mol, PD: 3.30

[0074] ETHOCEL STD 45 (EC STD 45): ethylcellulose obtained from Dow Chemical, DS: 2.5, M w : 158,000g / mol, PD: 3.04

[0075] ETHOCEL STD 100 (EC STD 100): Ethylcellulose obtained from Dow Chemical, DS: 2.5, M w : 214,000g / mol, PD: 3.42

[0076] DC 249: Solid flake hydroxy-functional organopolysiloxane resin with Si-bound methyl and phenyl groups, available from Dow Corning, Si-bound OH group content: 5 wt.%, Ph / Me molar ratio : 1.3 / 1, M w : 2,763g / mol, if passed 29 Structural parameters determined by Si-NMR: a: 0, b: 0.67, c: 0.33, d: 0

[0077]DC 217: Solid flake hydroxy-functional organopolysiloxane resin with Si-bound methyl and phenyl groups, available from Dow Corning, Si-bound OH group content: 6 wt.%, Ph / Me molar ratio : 6.6 / 1, residual SiO 2 Content: 47wt.%, M w : 2,000g / mol, if passed 29 Structural parameters determined by S...

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Abstract

Disclosed is a conductive composition useful for the preparation of electrically conductive structures on a substrate comprising a plurality of metal particles, a plurality of glass particles and a vehicle comprising at least one cellulose derivative and at least one solid organopolysiloxane resin dissolved in a mutual organic solvent. The solid organopolysiloxane resin acts as adhesion promoter and assists in stably dispersing the metal and glass particles to avoid an agglomeration of such particles without degrading the rheological properties. From such conductive compositions uniform well adherent electrically conductive structures essentially free from defects in the form of cracks, bubbles or coarse particulates can be prepared on dielectric or semiconductor substrates such as silicon wafers in an efficient and cost-saving manner e.g. by screen printing, drying and sintering while inducing only low warping of the substrate. These characteristics render said conductive compositions particularly useful for the fabrication of electrodes of a semiconductor solar cell helping to increase the cell conversion efficiency.

Description

technical field [0001] The present invention relates to conductive compositions for the production of conductive structures on substrates, in particular for the production of electrodes for semiconductor solar cells. Background technique [0002] Conductive compositions such as metal-based inks and pastes are widely used for the preparation of conductive structures on dielectric or semiconducting substrates (for example in surface mount technology) and for the manufacture of hybrid integrated circuits, printed circuit boards, electro-optical devices, electrical Chemical, electromechanical or electroceramic devices such as photodiodes, sensors, fuel cells and photovoltaic cells. They are therefore key enabling components in important technical fields such as sustainable energy technologies, which represent a rapidly growing market driven by increasing economic pressures related to the depletion of fossil fuels and environmental concerns such as the greenhouse effect . Due t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0224H01L31/042H01L31/04H01B1/22
CPCH01L31/022425H01B1/22H01B13/0016H01B13/30Y02E10/50H01B1/16
Inventor Y·W·张W·Z·王S·史J·J·福尔肯罗斯
Owner NUTRITION & BIOSCIENCES USA 1 LLC
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