LCP high-frequency substrate having high-Dk and low-Df characteristic and fabrication method thereof

A substrate and high-frequency technology, which is applied in the field of high-frequency and high-transmission substrates and preparation, can solve the problems that cannot really meet high-frequency and high-speed, cannot meet high Dk requirements, and is prone to high leakage current, etc., to achieve good UV laser drilling capabilities , good mechanical properties, low rebound effect

Pending Publication Date: 2020-02-07
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Adding metal powder in the next layer can get a high Dk value of more than 45, but at the same time Df will also increase, which cannot really meet the needs of high frequency and high speed, and this kind of material is prone to high leakage current in practical applications behavior, greatly reducing its applicability
[0005] 2. Only pure high-content and high-dielectric ceramic powder is add

Method used

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  • LCP high-frequency substrate having high-Dk and low-Df characteristic and fabrication method thereof
  • LCP high-frequency substrate having high-Dk and low-Df characteristic and fabrication method thereof
  • LCP high-frequency substrate having high-Dk and low-Df characteristic and fabrication method thereof

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Experimental program
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Effect test

Embodiment approach

[0051] Embodiment: A LCP high-frequency substrate with high Dk and low Df characteristics, such as Figure 1 to Figure 3 As shown, including at least one copper foil layer, at least one high dielectric LCP (liquid crystal polymer) core layer and at least one high dielectric adhesive layer, the high dielectric LCP core layer is located between the copper foil layer and the high dielectric adhesive layer Among them, the high dielectric LCP core layer refers to a core layer with a Dk (dielectric constant) value of 6-100 (10GHz), and a Df (dielectric loss factor) value of 0.002-0.010 (10GHz), the A high dielectric adhesive layer refers to an adhesive layer with a Dk value of 6-100 (10GHz) and a Df value of 0.002-0.010 (10GHz);

[0052] The thickness of the copper foil layer is 1-35 μm; the thickness of the high dielectric LCP core layer is 12-100 μm, and the thickness of the high dielectric glue layer is 12-100 μm.

[0053] The high dielectric adhesive layer has a bonding strengt...

Embodiment approach 1

[0070] Embodiment 1: An LCP high-frequency substrate with high Dk and low Df characteristics, such as figure 1As shown, the LCP high-frequency substrate is a single-sided copper-clad substrate, and the single-sided copper-clad substrate includes a copper foil layer, a high dielectric LCP core layer and a high dielectric adhesive layer, and the high dielectric LCP The core layer is located between the copper foil layer and the high dielectric adhesive layer, and the thickness of the single-sided copper-clad substrate is 25-235 μm.

[0071] In this embodiment, the single-sided copper-clad substrate further includes a release layer, and the release layer is located on the surface of the high-dielectric adhesive layer.

[0072] The release layer can be a release film whose material is at least one of polypropylene, biaxially oriented polypropylene and polyethylene terephthalate, and can be a release film with double-sided release capability. film, or use release paper.

[0073] ...

Embodiment approach 2

[0077] Embodiment 2: An LCP high-frequency substrate with high Dk and low Df characteristics, such as figure 2 As shown, the LCP high-frequency substrate is a double-sided copper-clad substrate, and the double-sided copper-clad substrate includes two copper foil layers, two high-dielectric LCP core layers and a high-dielectric adhesive layer, and the double-sided clad The copper substrate consists of copper foil layer, high dielectric LCP core layer, high dielectric glue layer, high dielectric LCP core layer and copper foil layer from top to bottom, and the thickness of the double-sided copper clad substrate is 38-370 μm.

[0078] The preparation method of embodiment 2 comprises the following steps:

[0079] Step 1. Coating the precursor of the high-dielectric LCP core layer on one side of the copper foil layer, removing the solvent at 60-180°C, and annealing at 250°C for 10 hours to obtain two semi-finished products A;

[0080] Step 2, coating the precursor of the high diel...

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Abstract

The invention discloses an LCP high-frequency substrate having the high-Dk and low-Df characteristic. The LCP high-frequency substrate comprises at least one copper foil layer, at least one high-dielectric LCP core layer and at least one high-dielectric glue layer, wherein the high-dielectric LCP core layer is arranged between the copper foil layer and the high dielectric layer, the high dielectric LCP core layer is a core layer with a Dk value being 6-100 and a Df value being 0.002-0.010, the high dielectric glue layer is a glue layer with a Dk value being 6-100 and a Df value being 0.002-0.010, the thickness of the copper layer is 1-35 micrometers, the thickness of the high dielectric LCP core layer is 12-100 micrometers, and the thickness of the high dielectric glue layer is 12-100 micrometers. The high dielectric LCP core layer and the high dielectric glue layer both have the high-Dk and low-Df characteristics, thus, the fabricated LCP high-frequency substrate has excellent high-speed transmission, low loss, high-Dk and low-Df performance, low roughness, the ultralow water absorption rate, low elastic force suitable for high-density assembly, favorable UV laser drilling capability and the excellent mechanical property.

Description

technical field [0001] The invention relates to the field of FPC (flexible circuit board) and its preparation technology, in particular to a high-frequency high-transmission substrate and its preparation method, which are mainly used in the field of high-frequency and high-speed transmission FPC, such as automotive radar, global positioning satellite antenna, and cellular telecommunication systems , wireless communication antenna, data link cable system, direct broadcast satellite, power backplane, etc. Background technique [0002] With the rapid development of information technology, wireless communication has become a necessity of life. The wireless communication system is composed of transmitting, receiving and antenna. The antenna is responsible for the conversion of the electromagnetic energy value between the circuit and the air, and is an indispensable basic equipment for the communication system. In antenna-related circuit design, passive components such as capacit...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K3/02
CPCH05K1/0373H05K3/022H05K2201/0191H05K2201/0195H05K2201/0209
Inventor 李建辉林志铭何家华
Owner KUSN APLUS TEC CORP
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