High-density BGA printed circuit board wiring method

A technology for printed circuit boards and spherical contacts, which is used in printed circuits, printed circuit manufacturing, electrical components, etc. It can solve problems such as thin board thickness and difficulty in passing two vias through signal lines, and achieve easy-to-guaranteed yields. Conducive to impedance control and easy-to-achieve effects
CN100441071CInactive Publication Date: 2008-12-03HUAWEI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HUAWEI TECH CO LTD
Publication Date
2008-12-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

The method for high-dense ball contact matrix PEB routing comprises: for said PCB with small span, according to size parameters and technical requirements of BGA bonding pad, calculating maximal diameter of past-hole top bonding pad to obtain a hole-past hole diameter larger a little than said maximal diameter for PCB; if two adjacent past-holes do not conduct electricity on the signal layer, then gets rid of said past-hole pad or decreases diameter of said common pad to cross a signal wire between two holes. This invention can increase past-hole diameter and plate thickness benefit to control impedance and solve problem hard to cross signal wire.
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Description

technical field

[0001] The invention relates to the technical field of circuit design, in particular to a method for wiring a printed circuit board with a high-density spherical contact array. Background technique

[0002] With the rapid development of science and technology, the integration and complexity of chips are getting higher and higher, and the design and manufacturing of PCB (printed circuit board) are becoming more and more difficult. PCB design must consider the possible problems that may be encountered during PCB production and processing. For various problems, the quality of the PCB depends on the design. Only by fully considering the processing technology limit of the PCB manufacturer during the design process can it be possible to ensure the yield rate of the PCB during production. The following table 1 is some setting parameters recommended by domestic mainstream PCB manufacturers. If the recommended value is exceeded, PCB will form a process bottleneck in m...

Claims

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