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Multi-layer circuit structure

A multi-layer circuit and transmission line technology, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of increased signal transmission loss and reduced signal transmission quality, and can reduce high-frequency signal reflection and impedance discontinuity. point, the effect of improving signal integrity

Active Publication Date: 2017-09-29
IND TECH RES INST +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, between the two first transmission lines 12a and the second transmission line 15a and between the first transmission line 12b and the second transmission line 15b, there are sections S1 and S3 where the spacing varies, so that the impedance will change with the spacing, resulting in Increased signal transmission loss degrades signal transmission quality

Method used

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  • Multi-layer circuit structure

Examples

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Embodiment Construction

[0052] image 3 is a partial schematic view of a multilayer circuit structure according to an embodiment of the present invention. It should be noted that, for the sake of brevity, image 3 Only the local and differential transmission lines and the reference plane are simply drawn, and the dielectric layer or other lines between the lines of different planes are omitted. see image 3 , the multilayer circuit structure 100 of this embodiment includes two sets of differential transmission line pairs 102a, 102b, two first differential pads 140a, 140b, two second differential pads 141a, 141b, two via holes 170, 180, two sets of conductive patterns 130a, 130b, two blind holes 150a, 150b.

[0053] More specifically, one of the differential transmission line pairs 102a, one of the first differential pads 140a, one of the second differential pads 141a, and one of the groups of conductive patterns 130a are located in one of the circuit layers (such as image 3In the upper plane 124...

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PUM

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Abstract

The invention discloses a multi-layer circuit structure which includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones. The conductive pattern is electrically connected to a reference potential and electrically insulated from the differential transmission line pair.

Description

technical field [0001] The present invention relates to a multi-layer line structure, and in particular to a differential transmission line structure. Background technique [0002] With the advancement of technology, the demand for signal transmission rate has greatly increased. At present, high-speed signals are often transmitted through high-speed differential transmission technology. The so-called differential transmission refers to the method of using two transmission lines to make the current flow in the opposite direction, and transmit through the potential difference between the transmission lines, which has the advantage of strong anti-interference ability. [0003] figure 1 It is a partial schematic diagram of an existing multilayer circuit structure. figure 2 yes figure 1 A partial top view schematic diagram of the multilayer circuit structure. It should be noted that, for the sake of brevity, figure 1 Only the partial lines related to differential transmiss...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0245H05K2201/09672
Inventor 徐健明李明林张慧如刘宏益张景山
Owner IND TECH RES INST
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