Workpiece bonding system

Abstract

The invention provides a workpiece bonding system, and relates to the technical field of semiconductor processing and manufacturing. The workpiece bonding system is used for completing bonding processing of a semiconductor workpiece. The workpiece bonding system includes a workpiece providing device, a workpiece conveying device and a workpiece processing device. The workpiece providing device is used for obtaining a workpiece to be processed from a workpiece bearing device and conveying the workpiece to be processed to the workpiece conveying device; the workpiece conveying device is used for connecting the workpiece providing device and the workpiece processing device, obtaining the workpiece to be processed form the workpiece providing device, and conveying the workpiece to be processed to the workpiece processing device; and the workpiece processing device is used for obtaining the workpiece to be processed from the workpiece conveying device, and completing bonding of the workpiece. The workpiece conveying device can also be used for performing various preprocessing operation on the workpiece in the process of conveying the workpiece. The technical scheme of the workpiece bonding system in the invention can reduce consumption of time for workpiece delivery and preprocessing, and improve the overall efficiency of workpiece bonding.

Description

Technical field [0001] The invention relates to the technical field of semiconductor processing and manufacturing, in particular to a workpiece bonding system. Background technique [0002] Chip bonding is an indispensable key process step in the semiconductor device packaging process. The diced bare chip adhered to the blue film must undergo a series of processes such as bonding and plastic packaging to form a usable semiconductor device. Different semiconductor devices and their corresponding chips may require different chip bonding processes. For example, some chips require eutectic bonding and others require die bond bonding; some chips need to be removed from the blue film and flipped and then bonded while other chips do not need to be flipped; some chips will be bonded to the lead frame Or on the substrate and other chips will be bonded to the wafer; some chips need to be heated before bonding while other chip bonding is performed at room temperature; some chips need to be...

AI Technical Summary

Problems solved by technology

For example, in order to improve the efficiency of the whole machine on the basis of reliably completing chip preprocessing operations such as flipping, pre-alignment, and heating, some equipment sets up multiple independent preprocessing operation stations for parallel processing, but the cost is that the size of the equipment becomes larger and the preprocessing Configuration flexibility is not high

For another example, when it is necessary to remove the chip on the blue film and bond it to the wafer, due to the increasing size of the wafer (such as 300 mm), the equipment bonding head needs to change from The blue film pick-up position moves to the bonding position hundreds of millimeters away and then returns, which puts high requirements on the efficiency of the equipment and the reliability of motion control; some equipment manufacturers design two or more heads to overcome This problem, but the cost of equipment is greatly increased

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