Multi-layer mixed synchronization bonding structure and method for three-dimensional packaging

Abstract

The invention relates to a multi-layer mixed synchronization bonding structure and a method for three-dimensional packaging. The method comprises the following steps of: forming a hard metal conical array on a surface of a metallic pad of a substrate to be mixed and bonded; forming a soft metal layer on the surface of the metallic pad of the other substrate to be mixed and bonded; forming dielectric adhesion layers on surfaces of non-metallic pads of the two substrates to be mixed and bonded; aligning the hard metal conical array with the soft metal layer, heating and pressurizing to make thehard metal conical array inserted into the soft metal layer, and combining the dielectric adhesion layers with each other to form a mixed pre-bonding structure; and then heating, forming an intermetallic compound in the hard metal conical array which is inserted into the soft metal layer, and solidifying and combining the dielectric adhesion layers. Compared with the conventional bonding method, the method provided by the invention has the advantages that: yield is high; bonding time is saved; cost is reduced; and the reliability of a product is improved at the same time.

Description

technical field [0001] The invention relates to a multi-layer hybrid synchronous bonding structure and method for three-dimensional packaging, belonging to the technical field of microelectronic packaging. Background technique [0002] With the development of people's requirements for electronic products in the direction of miniaturization, multi-function, and environmental protection, people strive to make electronic systems smaller and smaller, with higher integration, more functions, and stronger . As a result, many new technologies, new materials, and new designs have emerged. For example, technologies such as three-dimensional stacked packaging are typical representatives of these technologies. This structure can directly stack multiple bare chips or substrates by bonding to achieve three-dimensional The metal interconnection structure in the direction greatly reduces the interconnection distance and increases the transmission speed, thereby realizing the integration o...

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the problems of long bonding time and high bonding temperature in existing bonding structures and methods, which seriously affect production efficiency and product reliability, and cause wafer warpage, and provide a multi-layer bonding device for three-dimensional packaging. Hybrid Synchronous Bonding Structure and Method

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