The utility model discloses a thin
wafer edge removing
manipulator, which belongs to the technical field of
wafer polishing equipment and comprises a
handle, a connecting seat arranged on the upper side of the
handle, a connecting column arranged between the
handle and the connecting seat, a fixing head arranged at the upper end of the connecting seat, a fixing groove arranged at the upper end of the fixing head, and an
air cavity arranged in the connecting seat. The left end and the right end of the connecting base are provided with an air outlet and an air inlet connector respectively, the air inlet connector is connected with an
air pump through an air guide hose, the connecting base is provided with an opening and closing device in the
air cavity, the connecting column is connected with the opening and closing device, and air guide channels communicated with the fixing groove and the
air cavity are formed in the fixing head and the connecting base. Through the arrangement of the
air pump, the air cavity, the air guide channel, the air outlet hole and the air inlet connector, the air cavity and the fixing groove can form a negative pressure state, so that the
wafer is adsorbed and clamped in the fixing groove, an original
tweezers clamping mode is replaced, the clamping effect of the wafer is improved, and meanwhile the
machining efficiency and the
machining stability are improved.