Bonding assembly equipment

A technology for assembling equipment and bonding, applied in mechanical equipment, connecting components, injection devices, etc., can solve problems such as low bonding efficiency, long bonding cycle, and need for repeated positioning, so as to improve bonding efficiency and improve bonding. Accuracy and the effect of saving positioning times
CN112076947AInactive Publication Date: 2020-12-15BOZHON PRECISION IND TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BOZHON PRECISION IND TECH CO LTD
Publication Date
2020-12-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention belongs to the technical field of automatic assembly, and discloses bonding assembly equipment which is used for bonding assembly of a first workpiece and a second workpiece. The bondingassembly equipment comprises a jig, a first feeding device, a second feeding device, an assembling device and a glue dispensing device. The jig is configured to clamp the first workpiece. The first feeding device is configured to receive the jig input from the outside and can further transfer the jig to an assembling station and a discharging station. The second feeding device is configured to store and output the second workpiece. And the assembling device can be moved to the position among the second feeding device, the assembling station and the glue dispensing mechanism so as to pick up the second workpiece provided by the second feeding device, and after the glue dispensing device coats glue onto the bonding part of the second workpiece, the second workpiece can be bonded and assembled to the first workpiece located at the assembling station. The bonding assembly equipment provided by the invention can be used for efficiently carrying out bonding assembly operations.
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Description

technical field

[0001] The invention relates to the technical field of automatic assembly, in particular to an adhesive assembly equipment. Background technique

[0002] In the production process of electronic equipment, some parts need to be bonded and assembled into the frame of the electronic equipment, for example, the listening / microphone structure bracket of the mobile phone is installed to the corresponding mounting hole on the mobile phone frame. In order to improve production efficiency, the above-mentioned bonding and assembly operations are generally completed by bonding and assembling equipment.

[0003] However, the existing bonding and assembly equipment is generally arranged in a production line, and each station involved in the assembly needs to rely on the assembly line to transfer the jigs carrying the workpieces to be bonded, resulting in a long bonding cycle and when the workpieces are transferred to each station. Repeated positioning is required, and th...

Claims

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