2results about How to "Improve bonding accuracy" patented technology

The invention provides a display panel. The display panel comprises a glass substrate, a plurality of light-emitting units, a plurality of first bonding parts, a silicon-based driving substrate, an insulating layer and a protective layer. The glass substrate is provided with a plurality of conductive through holes extending from the first surface to the second surface; the plurality of conductive through holes comprise a plurality of first conductive through holes; the first bonding parts are electrically connected with the corresponding anode electrodes through the corresponding first conductive through holes; the silicon-based driving substrate comprises a plurality of first bonding electrodes which are in one-to-one counterpoint bonding with the plurality of first bonding parts; the insulating layer is provided with a first clamping part; the protective layer is provided with a second clamping part; one of the first clamping part and the second clamping part is of a concave structure, the other one of the first clamping part and the second clamping part is of a convex structure, and the convex structure is embedded in the concave structure. According to the display panel, the pixel driving circuit can be prevented from being damaged due to the fact that the light-emitting units are directly manufactured on the silicon-based driving substrate; and the bonding precision can be improved, and relative displacement of the glass substrate and the silicon-based driving substrate is avoided.

The utility model provides a kind of wafer motion system.The wafer motion system includes mounting seat;Wafer carrier plate (3), wafer carrier plate (3) is set above mounting seat;Clamping assembly, wafer carrier plate (3) is clamped and fixed on mounting seat by clamping assembly;At least 3 Z direction drive assembly, be set below mounting seat, and with mounting seat movably connected.The wafer motion system provided by the utility model can solve the problem that the existing wafer alignment equipment causes wafer carrier plate instability and wafer deviation during the process of wafer rising to the bonding position, resulting in wafer early alignment failure, bonding error and reduced wafer quality after bonding.