4results about How to "Improve bonding accuracy" patented technology

The utility model provides an alignment device, wafer bonding equipment and wafer bonding test equipment, and relates to the technical field of semiconductors. The alignment device comprises a carrying table with a placing area, and at least two first alignment assemblies and a second alignment assembly which are arranged on the carrying table, the number of the first alignment assemblies is at least two, each first alignment assembly specifically comprises a first elastic alignment piece upwards extending out of the placing area, and the first elastic alignment pieces can move downwards when being pressed; the second alignment assembly comprises a rotating arm capable of rotating relative to the carrying table and an elastic reset piece connected to the rotating arm, and the elastic reset piece is used for driving the rotating arm to rotate towards the placing area; a second elastic alignment piece is arranged at the tail end of the rotating arm; the second elastic alignment piece upwards extends out of the placing area and can downwards move when being pressed; the first elastic alignment piece and the second elastic alignment piece are arranged in the containing area in a spaced and surrounding mode. According to the alignment device, alignment operation on the wafer is convenient, stable alignment on the wafer can be kept in the bonding process, and the bonding yield is high.

The invention provides a display panel. The display panel comprises a glass substrate, a plurality of light-emitting units, a plurality of first bonding parts, a silicon-based driving substrate, an insulating layer and a protective layer. The glass substrate is provided with a plurality of conductive through holes extending from the first surface to the second surface; the plurality of conductive through holes comprise a plurality of first conductive through holes; the first bonding parts are electrically connected with the corresponding anode electrodes through the corresponding first conductive through holes; the silicon-based driving substrate comprises a plurality of first bonding electrodes which are in one-to-one counterpoint bonding with the plurality of first bonding parts; the insulating layer is provided with a first clamping part; the protective layer is provided with a second clamping part; one of the first clamping part and the second clamping part is of a concave structure, the other one of the first clamping part and the second clamping part is of a convex structure, and the convex structure is embedded in the concave structure. According to the display panel, the pixel driving circuit can be prevented from being damaged due to the fact that the light-emitting units are directly manufactured on the silicon-based driving substrate; and the bonding precision can be improved, and relative displacement of the glass substrate and the silicon-based driving substrate is avoided.

The application relates to the technical field of display panel production equipment, and discloses a substrate bonding device and method. The substrate bonding device is used for bonding a flexible substrate and a rigid substrate which are respectively provided with a first bonding area and a second bonding area, and comprises a table assembly and an image acquisition assembly. The table assembly comprises a first light-transmitting part and a second light-transmitting part, the first bonding area is attached to the first light-transmitting part, the second bonding area can be arranged opposite to the second light-transmitting part, the image acquisition assembly is arranged below the table assembly, and images of the first bonding area and the second bonding area are respectively acquired through the first light-transmitting part and the second light-transmitting part. The thickness of the second light-transmitting part is greater than that of the first light-transmitting part, so that the focal point of the image acquisition assembly for acquiring the image through the second light-transmitting part is higher than the upper surface of the first bonding area. The substrate bonding device can simultaneously focus on the first bonding area and the second bonding area and acquire clear images, the steps are few, and the bonding efficiency and precision are high.

The utility model provides a kind of wafer motion system.The wafer motion system includes mounting seat;Wafer carrier plate (3), wafer carrier plate (3) is set above mounting seat;Clamping assembly, wafer carrier plate (3) is clamped and fixed on mounting seat by clamping assembly;At least 3 Z direction drive assembly, be set below mounting seat, and with mounting seat movably connected.The wafer motion system provided by the utility model can solve the problem that the existing wafer alignment equipment causes wafer carrier plate instability and wafer deviation during the process of wafer rising to the bonding position, resulting in wafer early alignment failure, bonding error and reduced wafer quality after bonding.