38results about How to "Improve bonding accuracy" patented technology

The invention belongs to the technical field of automatic assembly, and discloses bonding assembly equipment which is used for bonding assembly of a first workpiece and a second workpiece. The bondingassembly equipment comprises a jig, a first feeding device, a second feeding device, an assembling device and a glue dispensing device. The jig is configured to clamp the first workpiece. The first feeding device is configured to receive the jig input from the outside and can further transfer the jig to an assembling station and a discharging station. The second feeding device is configured to store and output the second workpiece. And the assembling device can be moved to the position among the second feeding device, the assembling station and the glue dispensing mechanism so as to pick up the second workpiece provided by the second feeding device, and after the glue dispensing device coats glue onto the bonding part of the second workpiece, the second workpiece can be bonded and assembled to the first workpiece located at the assembling station. The bonding assembly equipment provided by the invention can be used for efficiently carrying out bonding assembly operations.

It is an integration circuit chip vision aligning method belonging to integration circuit chip seal method, which comprises the following steps: to select sample from the lead wire frame and chip; to get the sample measurement coordinates by image process and to measure the defect chip by image constant moment; to get the chip position transformation parameters to get the coordinates; to get the sample non-linear error by minus measurement coordinates from computation coordinates till the error is within the permitted value; finally to transform the bonding arranged coordinates into bonding workbench displacement coordinates.

The invention discloses a glass circuit board based FPC (flexible printed circuit) board hot-pressing device, processing system and method. The hot-pressing device comprises a rotating platform capable of rotating intermittently, wherein the rotating platform is provided with two layers of fixing boards which are mutually parallel and can rotate simultaneously, one layer is hot-pressing fixing board used for fixing hot-pressing assemblies, the other layer is a jig fixing board for fixing jig assemblies, the rotating platform is divided into a plurality of station areas, and one hot-pressing assembly and one jig assembly are arranged in each station area; each hot-pressing assembly comprises a lifting control mechanism, a hot-pressing head and a buffering mechanism; a loading platform, a first preset platform, an ACF (anisotropic conductive film) attachment assembly, a second preset platform, the hot-pressing device and an unloading platform are mounted on a mounting platform. The work efficiency of the hot-pressing device can be improved, the area occupied by the equipment can be reduced, and the cost is saved.

The invention discloses a COG chip inversion bonding device which comprises a precalibration clamping device, a base plate positioning device and a delivering device, wherein the precalibration clamping device calibrates the position of a chip; the base plate positioning device positions a glass base plate bonded with the chip; the delivering device delivers the chip and the glass base plate; the precalibration clamping device and the base plate positioning device are sequentially fixed on a base; and the delivering device is respectively connected with drive parts on the precalibration clamping device and the base plate positioning device. The traditional delivering device chip is placed in the position of the precalibration clamping device, and the precalibration clamping device chip carries out precalibration; the position of the glass base plate on the base plate positioning device is calibrated by the base plate positioning device; and finally, the control device controls the clamping device to bond the chip on the glass base plate. Because the positions of the chip and the glass base plate are respectively calibrated before the chip is bonded, the bonding precision of the chip can be improved.

The invention discloses a clamping device for precalibration of a COG chip, which comprises a base, a first motor and a fixing device, wherein the first motor is fixed on the base; the first motor is connected with a first rotating wheel fixed with a first rotating shaft through a first transmission belt; the first rotating shaft is connected with the base; a first cam is arranged on the first rotating shaft; a first transmission rod which is in close contact with the first cam is arranged outside the first cam; the first transmission rod which is provided with a first calibration block is connected with the base slidably; a first spring is arranged between the first transmission rod and the base; the first transmission rod is connected with a first sliding block through a first transmission piece; the first sliding block is matched with a first guide rod on the base slidably; a second calibration block is arranged on the first sliding block; and the second calibration block and the first calibration block are oppositely arranged and are respectively positioned at two sides of the fixing device. The clamping device for precalibration of the COG chip can calibrate the position of the bonded chip to improve the bonding accuracy of the chip.

The invention provides a vacuum apparatus, a substrate alignment apparatus, and a method of forming a pre-bonded wafer. The vacuum apparatus includes an upper fixing module, a lower fixing module, anda vacuum module. The vacuum module is configured to form a vacuum cavity between the upper fixing module and the lower fixing module after an upper substrate is aligned with a lower substrate. The vacuum module includes a housing, a sealing module, and a vacuum interface. The housing has an opening and is configured to sleeve the outer sides of the upper fixing module and the lower fixing modulein a manner that the opening is arranged upwards. The sealing module is disposed between the upper fixing module and the housing to seal the upper fixing module and the housing to form a sealed cavity. The vacuum interface penetrates through the sidewall of the housing and provides a vacuum input for the sealed cavity to form a vacuum cavity. The vacuum apparatus eliminates a spacer structure between two substrates and avoids a series of alignment and bonding errors introduced by the spacer.

A wire bonding method and apparatus are provided for electronic components to enable PR processing and wire bonding to be carried out substantially concurrently. The apparatus comprises a bond head carrying a bonding tool for performing wire bonding and a rotary motor coupled to the bond head that is configured to change an angular orientation of the bonding tool relative to an electronic component to be bonded. There are first and second carriers for respectively mounting electronic components for wire bonding, and an optical system is arranged and configured to view bonding points on an electronic component mounted on the first carrier when the bonding tool is located over an electronic component mounted on the second carrier to perform wire bonding.

The application discloses a vacuum chuck comprising a chuck body including a fixed central portion and a peripheral portion that can stretch along the radial direction of the chuck body. When a wateris attached to the chuck body, the peripheral portion is controlled to stretch along the radial direction of the chuck body; and the peripheral portion stretching along the radial direction of the chuck body can drive the attached wafer to deform along the radial direction of the chuck body, so that the wafer dimension changes. The wafer with the changed dimension matches the dimension of a to-be-bonded wafer to realize basic consistence of the dimensions of the two wafers. Moreover, the peripheral portion drives the wafer to deform along the plane direction of the wafer to prevent deformationof the wafer along other directions, so that the space between the two to-be-bonded wafers is not changed based on the wafer deformation amount controlling mode. Therefore, the vacuum chuck is able to control the deformation amount of the wafer, so that the bonding precision of wafers is improved.

The invention discloses a device and a method for compensating a wedge-shaped error in wafer bonding, and belongs to the field of semiconductor wafer processing. The device comprises an upper bearingtable and a lower bearing table, a first adsorption device is arranged on the lower bearing table, a gasket is arranged on the upper surface of the lower bearing table, the gasket is connected with agasket driving device, and a lifting and angle adjusting device is arranged on the lower surface of the lower bearing table; the upper bearing table comprises an inner frame and an outer frame, the edge area of the inner frame is located above the outer frame, the inner frame is connected with the outer frame in a floating mode through a gravity balance device, a plurality of capacitance sensors are arranged on the edge area of the inner frame, and a second adsorption device is arranged on the inner frame. According to the invention, the wedge-shaped error between an upper wafer and a lower wafer is eliminated by adopting a wedge-shaped error compensation method, so that the two unparallel wafers are three-dimensionally parallel, and finally, the effect of improving the wafer bonding precision is achieved.

According to a semiconductor structure and a manufacturing method thereof provided by the invention, the electrical connection between the electronic component and the substrate is realized through wire bonding, and the characteristics of the bonding start point and the bonding end point are determined in real time by using wire bonding, so that the deviation caused by the precision of die bonding is compensated in a maximum allowable range, moreover, the subsequent fabrication of the fan out layer only needs to align the circuit on the substrate, and does not need to align the electronic assembly, thereby improving the yield.

The invention discloses a wafer bonding dynamic calibration method and device, and the method comprises the steps: transmitting a wafer to a corresponding wafer slide device, and obtaining wafer information which comprises an alignment mark position under a wafer coordinate system; whether the positions of the alignment mark recognition device and the calibration mark are aligned with the alignment mark position of the corresponding wafer or not is judged, if not, the alignment mark recognition device and the calibration mark are controlled to move to be aligned with the alignment mark of the corresponding wafer, and then the deviation value of the alignment mark recognition device is calibrated through the calibration mark; the alignment mark recognition device recognizes the alignment marks of the wafers respectively to obtain deviation values of the alignment marks, and controls the wafers to move by integrating the deviation values of the alignment mark recognition device and the deviation values of the alignment marks, so that the alignment marks of the pair of wafers are aligned. According to the invention, the calibration mark and the alignment mark identification device are synchronously moved to the same position of the alignment mark in advance, so that the alignment error can be greatly reduced, and the wafer bonding precision is improved.

The invention relates to the technical field of microelectronic packaging, and particularly discloses a wedge-shaped chopper structure for improving lead bonding precision. The wedge-shaped chopper structure for improving lead bonding precision comprises a chopper handle and a chopper head connected with one end of the cutter handle; the chopper head is provided with a bonding lead via hole; and the bonding lead via hole comprises a guide hole and an elliptical through hole, wherein the guide hole is formed in the side surface of the chopper head and an elliptical through hole communicating with the guide hole. According to the wedge-shaped chopper structure for improving the lead bonding precision, the movable range of the bonding lead in the horizontal direction is effectively limited, and the bonding lead is prevented from deviating in the bonding lead via hole; the bonding lead can be always located in the center of the end face of the chopper head in the bonding process; and the bonding precision of the bonding lead is effectively improved.

The invention provides a wafer assembly. The wafer assembly comprises a first wafer and a first alignment mark located on the first wafer, a second wafer and a second alignment mark located on the second wafer. At least one of the first alignment mark and the second alignment mark extends from an intersection area of the cutting channels to a non-intersection area on the wafer where the first alignment mark and the second alignment mark are located. The length of a pattern (such as a strip-shaped pattern) in the first alignment mark and/or the second alignment mark can be larger than the width of the cutting channel and is not limited by the width of the cutting channel any more. On the basis of an existing wafer bonding machine and process conditions, large-size alignment marks can be made under the condition that the width of a cutting channel is fixed, and the wafer bonding recognition efficiency and precision are improved.

The invention, which relates to the field of electronic component manufacturing, particularly discloses a bonding fixture for a small component. The bonding fixture comprises a carrying piece; a plurality of station slots are formed in the carrying piece; and at least one elastic mechanism is arranged at the side of each station slot. When components are placed in the station slots, the elastic mechanisms extrude the sides of the components to fix the components in the station slots. With the bonding fixture with a simple structure, fixation of a small device is realized and thus the device isprevented from being offset during the bonding process and is protected from being polluted, so that the quality of the piezoelectric quartz device is improved substantially and the yield of the piezoelectric quartz device is enhanced. Meanwhile, the bonding fixture has advantages of low manufacturing cost, low manufacturing difficulty and low cost, so that the manufacturing cost of the piezoelectric quartz device is lowered.