38results about How to "Improve bonding accuracy" patented technology

A wire bonding method and apparatus are provided for electronic components to enable PR processing and wire bonding to be carried out substantially concurrently. The apparatus comprises a bond head carrying a bonding tool for performing wire bonding and a rotary motor coupled to the bond head that is configured to change an angular orientation of the bonding tool relative to an electronic component to be bonded. There are first and second carriers for respectively mounting electronic components for wire bonding, and an optical system is arranged and configured to view bonding points on an electronic component mounted on the first carrier when the bonding tool is located over an electronic component mounted on the second carrier to perform wire bonding.

The present invention relates to the technical field of semiconductor manufacturing, in particular to a wafer bonding equipment, including: a first fixing device that can only move along the X-axis and Y-axis directions, and is used to fix the first wafer to be bonded. A wafer is provided with a first calibration mark; a reference mark is set on the first fixing device; a second fixing device movable along the X axis, Y axis, and Z axis is arranged opposite to the first fixing device; the rotation device , arranged on the side of the second fixing device facing the first fixing device, for fixing a second wafer to be bonded, and a second calibration mark is provided on the second wafer; for the oppositely arranged and synchronous along the X-axis 1, Y-axis, and Z-axis moving image capture devices are respectively used to capture the first calibration mark and the second calibration mark; a reference mark capture device is used to read the reference mark. Beneficial effects: it can ensure that the image acquisition device can clearly capture the first calibration mark and the second calibration mark at the same time, thereby improving the wafer bonding precision.

The invention discloses a wire bonding clamp which comprises a fixed shaft, a gear box, a pinion, a bull wheel, a small shaft and a big shaft, wherein one end of the fixed shaft is connected with an equipment working platform, the other end of the fixed shaft is connected with the gear box, the bull wheel is meshed with the pinion, the small shaft and the big shaft are respectively center shafts of the pinion and the bull wheel, the bull wheel and the pinion are embedded inside the gear box, the end face of the bull wheel is provided with a bull wheel lug boss, and the end face of the bull wheel lug boss is provided with uniformly-distributed through holes for fixing a device to be clamped. The bull wheel is driven to rotate through rotation of the pinion, and the bull wheel drives the device fixed on the bull wheel to rotate simultaneously so that the device is switched into the next working face. The invention realizes continuous switching of a plurality of side surfaces in a three-dimensional space of the device, and avoids multiple times of installation of the device, thus suspend time of the wire bonding clamp is greatly saved and production efficiency is increased. The clamp is convenient and simple in operation; and processing precision is increased, and better welding quality is ensured.

The invention provides a vacuum apparatus, a substrate alignment apparatus, and a method of forming a pre-bonded wafer. The vacuum apparatus includes an upper fixing module, a lower fixing module, anda vacuum module. The vacuum module is configured to form a vacuum cavity between the upper fixing module and the lower fixing module after an upper substrate is aligned with a lower substrate. The vacuum module includes a housing, a sealing module, and a vacuum interface. The housing has an opening and is configured to sleeve the outer sides of the upper fixing module and the lower fixing modulein a manner that the opening is arranged upwards. The sealing module is disposed between the upper fixing module and the housing to seal the upper fixing module and the housing to form a sealed cavity. The vacuum interface penetrates through the sidewall of the housing and provides a vacuum input for the sealed cavity to form a vacuum cavity. The vacuum apparatus eliminates a spacer structure between two substrates and avoids a series of alignment and bonding errors introduced by the spacer.