Patents
Literature
14results about How to "Improve bonding accuracy" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
Chip bonding device and method
ActiveCN119495604AAvoid errorsImprove bonding accuracySemiconductor/solid-state device manufacturingBonding processInfrared vision
The invention provides a chip bonding device and method. The chip bonding device comprises a bonding head used for adsorbing a chip to be bonded and adjusting the pose of the chip; the infrared vision system is used for penetrating through the chip so as to acquire images of the first mark on the back surface of the chip and the second mark at the target bonding position of the chip; and a controller configured to: acquire, via the infrared vision system, an image with the first marker and the second marker; analyzing the image to determine the poses of the first mark and the second mark in the image; adjusting the pose of the bonding head according to the pose difference of the first mark and the second mark in the image, so that the chip is aligned with the target bonding position; and bonding the chip to the target bonding position through the bonding head. According to the invention, extra errors caused by using a calibration sheet as an intermediate medium in the bonding process can be avoided, the bonding precision is improved, and the bonding process is simplified, so that the bonding efficiency is improved, and the productivity of equipment is improved.
Owner:PIOTECH (HAINING) SEMICON EQUIP CO LTD
Bonding head driving device and bonding device
ActiveCN222479334Ureduce vibrationImprove bonding accuracyInertia force compensationNon-rotating vibration suppressionControl theoryFour-slide
Owner:WUXI AUTOVEC SEMICON TECH CO LTD
Wafer alignment and bonding device, wafer bonding method and precision compensation method
PendingCN119581368Areduce errorHigh precisionSemiconductor/solid-state device manufacturingConveyor partsWaferingStructural engineering
The invention belongs to the technical field of wafer bonding, and discloses a wafer alignment and bonding device, a wafer bonding method and a precision compensation method. The wafer aligning and bonding device comprises a base, a first bearing assembly, a second bearing assembly and a camera assembly, the first bearing assembly is used for bearing a first wafer and driving the first wafer to translate along an X axis, translate along a Y axis and rotate around a Z axis, so that the relative position of the first wafer is adjustable; the second bearing assembly is used for bearing a second wafer and driving the second wafer to translate along the Z axis so as to realize bonding of the second wafer and the first wafer; the camera assembly comprises a CCD camera, and the CCD camera is used for identifying the mark points on the first wafer and the second wafer respectively so as to assist the alignment of the first wafer and the second wafer. According to the wafer alignment and bonding device, alignment and bonding are designed at the same position, the movement stroke to the bonding position is omitted after alignment is completed, errors are reduced, and the bonding quality and the product yield are guaranteed.
Owner:SUZHOU MINGCHANGZHENG PHOTOELECTRIC TECH CO LTD
Alignment device, wafer bonding equipment and wafer bonding test equipment
ActiveCN222637261Ueasy to operateImprove alignment efficiencySemiconductor/solid-state device testing/measurementSemiconductor/solid-state device manufacturingBonding processWafer bonding
The utility model provides an alignment device, wafer bonding equipment and wafer bonding test equipment, and relates to the technical field of semiconductors. The alignment device comprises a carrying table with a placing area, and at least two first alignment assemblies and a second alignment assembly which are arranged on the carrying table, the number of the first alignment assemblies is at least two, each first alignment assembly specifically comprises a first elastic alignment piece upwards extending out of the placing area, and the first elastic alignment pieces can move downwards when being pressed; the second alignment assembly comprises a rotating arm capable of rotating relative to the carrying table and an elastic reset piece connected to the rotating arm, and the elastic reset piece is used for driving the rotating arm to rotate towards the placing area; a second elastic alignment piece is arranged at the tail end of the rotating arm; the second elastic alignment piece upwards extends out of the placing area and can downwards move when being pressed; the first elastic alignment piece and the second elastic alignment piece are arranged in the containing area in a spaced and surrounding mode. According to the alignment device, alignment operation on the wafer is convenient, stable alignment on the wafer can be kept in the bonding process, and the bonding yield is high.
Owner:BEIJING U PRECISION TECH
Bearing platform and bonding machine
ActiveCN222483347Ureduce vibrationImprove bonding accuracySemiconductor/solid-state device manufacturingClassical mechanicsLead frame
The utility model provides a bearing platform and a bonding machine, the bearing platform comprises a bearing seat and a fixing seat, and the fixing seat comprises a bottom plate, a first side plate and a second side plate. The first side plate and the second side plate are oppositely arranged at two ends of the bottom plate; the bearing seat is located between the first side plate and the second side plate, the first side wall of the bearing seat is connected to the first side plate through at least one first elastic connecting assembly, and the second side wall of the bearing seat is connected to the second side plate through at least one second elastic connecting assembly. The first elastic connecting assembly and the second elastic connecting assembly are configured to generate elastic deformation in the length direction of the bottom plate after being pressed; the lower end of the damper is fixedly connected to the bottom plate of the fixing seat, and the upper end of the damper is fixedly connected to the bottom of the bearing seat. According to the bearing platform provided by the invention, when the bearing seat vibrates along the length direction of the bottom plate, the damper absorbs the vibration, so that the overall vibration of the bearing platform is reduced, and the bonding precision of the lead frame borne on the bearing seat is improved.
Owner:WUXI AUTOVEC SEMICON TECH CO LTD
Display panel
PendingCN121772534ARealize electrical propertiesAvoid situations that affect signal lossHemt circuitsProtection layer
The invention provides a display panel. The display panel comprises a glass substrate, a plurality of light-emitting units, a plurality of first bonding parts, a silicon-based driving substrate, an insulating layer and a protective layer. The glass substrate is provided with a plurality of conductive through holes extending from the first surface to the second surface; the plurality of conductive through holes comprise a plurality of first conductive through holes; the first bonding parts are electrically connected with the corresponding anode electrodes through the corresponding first conductive through holes; the silicon-based driving substrate comprises a plurality of first bonding electrodes which are in one-to-one counterpoint bonding with the plurality of first bonding parts; the insulating layer is provided with a first clamping part; the protective layer is provided with a second clamping part; one of the first clamping part and the second clamping part is of a concave structure, the other one of the first clamping part and the second clamping part is of a convex structure, and the convex structure is embedded in the concave structure. According to the display panel, the pixel driving circuit can be prevented from being damaged due to the fact that the light-emitting units are directly manufactured on the silicon-based driving substrate; and the bonding precision can be improved, and relative displacement of the glass substrate and the silicon-based driving substrate is avoided.
Owner:HKC CORP LTD
Suction nozzle leveling module, pickup head of piece to be bonded, bonding method and storage medium
PendingCN119447000AImprove bonding accuracySemiconductor/solid-state device manufacturingPhysicsNozzle
The invention provides a suction nozzle leveling module, a pickup head of a to-be-bonded piece, a bonding method and a computer readable storage medium. The suction nozzle leveling module comprises a flexible plate structure and a plurality of displacement sensors. The flexible plate structure is installed below a suction nozzle of the pick-up head, a plurality of air holes are distributed in the flexible plate structure, and the flexible plate structure moves according to the difference of acting force generated by airflow flowing through the air holes. And the plurality of displacement sensors are arranged in the plurality of air holes and are respectively used for detecting the displacement amount of the corresponding air holes so as to represent the parallelism between the suction nozzle and the to-be-bonded piece. According to the invention, the parallelism between the suction nozzle and the to-be-bonded piece can be detected by using the flexible plate structure provided with the plurality of air holes and the displacement sensor, and the device is used for supporting real-time leveling of the pickup head in the process of picking up the to-be-bonded piece, so that the problem of parallelism change caused by multiple bonding is avoided, and the bonding precision is improved.
Owner:PIOTECH (HAINING) SEMICON EQUIP CO LTD
Substrate mounting apparatus and substrate mounting method
ActiveCN117198933BReduce action stepsReduce steps in the bonding process
The application relates to the technical field of display panel production equipment, and discloses a substrate bonding device and method. The substrate bonding device is used for bonding a flexible substrate and a rigid substrate which are respectively provided with a first bonding area and a second bonding area, and comprises a table assembly and an image acquisition assembly. The table assembly comprises a first light-transmitting part and a second light-transmitting part, the first bonding area is attached to the first light-transmitting part, the second bonding area can be arranged opposite to the second light-transmitting part, the image acquisition assembly is arranged below the table assembly, and images of the first bonding area and the second bonding area are respectively acquired through the first light-transmitting part and the second light-transmitting part. The thickness of the second light-transmitting part is greater than that of the first light-transmitting part, so that the focal point of the image acquisition assembly for acquiring the image through the second light-transmitting part is higher than the upper surface of the first bonding area. The substrate bonding device can simultaneously focus on the first bonding area and the second bonding area and acquire clear images, the steps are few, and the bonding efficiency and precision are high.
Owner:合肥维信诺电子有限公司 +1
Bonding structure, manufacturing method thereof and micro light-emitting diode device
The invention relates to a bonding structure, a manufacturing method thereof and a miniature light-emitting diode device, and the method comprises the steps: providing a first substrate and a second substrate, one side of the first substrate comprises a first bonding surface and a first bonding part, one side of the second substrate comprises a second bonding surface and a second bonding part, and the first bonding surface is provided with a first bonding groove; bonding the first bonding surface with the second bonding surface to obtain a pre-bonding structure; determining that a first bonding groove and a second bonding surface in the pre-bonding structure form a sealing cavity with the internal air pressure smaller than one standard atmospheric pressure, and heating a first bonding part and / or a second bonding part in the pre-bonding structure to a molten state in an environment in which the air pressure is smaller than or equal to the air pressure in the sealing cavity, and the first bonding part and the second bonding part are bonded to obtain the bonding structure, so that the self-correcting and ultrahigh-precision bonding structure is provided, and the bonding yield is high.
Owner:SHENZHEN SITAN TECH CO LTD
Wafer bonding machine and working method thereof
ActiveCN117497457Bguaranteed damageGuaranteed tightnessSemiconductor/solid-state device manufacturing
The present invention relates to the technical field of wafer bonding, a wafer bonding machine and a working method thereof, comprising a fine-tuning mechanism, a small cylinder assembly, an oil cylinder assembly, a pressure assembly and a vacuum chamber; the fine-tuning mechanism is arranged above the small cylinder assembly and the upper part of the top block of the small cylinder assembly is movably embedded in a groove of the fine-tuning mechanism, the small cylinder assembly is arranged inside the oil cylinder assembly, the lower part of the top block of the small cylinder assembly is fixedly arranged on the upper part of the hydraulic cylinder piston of the oil cylinder assembly, the pressure assembly is arranged below the oil cylinder assembly, the lower part of the hydraulic cylinder piston of the oil cylinder assembly is sealed and fixedly arranged on the weighing sensor of the pressure assembly, and the lower part of the pressure assembly is sealed and fixedly arranged on the upper pressure head of the vacuum chamber, which solves the problems of easy breakage of wafers and low bonding accuracy during wafer bonding.
Owner:BEIJING TORCH CO LTD +1
3D printing orthodontic bracket model and 3D printing manufacturing method thereof
PendingCN119139041Areduce mistakesImprove bonding accuracyBracketsAdditive manufacturing apparatus3d printOral problems
The invention relates to the technical field of dental correction, in particular to a 3D printing orthodontic bracket model and a 3D printing manufacturing method thereof. The 3D printing orthodontic bracket model comprises a bracket and a guide plate which are integrally formed through 3D printing, an occlusal surface is arranged on the top surface of the guide plate, and a handle is arranged on the bottom surface of the guide plate; one side, deviating from teeth, of the bracket is a connecting and fixing surface, and the top of the connecting and fixing surface is integrally connected with the side part of the guide plate through a connecting rod. According to the 3D printing orthodontic bracket model manufacturing method, a bracket and a guide plate which are integrally formed through 3D printing are obtained according to oral tooth data, the shape, the size and the edge structure of the bracket are formed through digital design and construction according to the oral tooth data of a patient, and the face, away from the occlusal face, of the guide plate serves as a datum plane for positioning; and determining that the bracket is attached to the teeth. The problems that a bracket is not high in fitting degree, adaptation degree and adhesion degree, poor in correction effect, low in working efficiency, long in-mouth operation time and not high in patient comfort degree are solved.
Owner:ZHEJIANG FLASHFORGE 3D TECH CO LTD
Pickup head of to-be-bonded part, bonding method and storage medium
PendingCN119447008AAvoid parallelism changesImprove bonding accuracySemiconductor/solid-state device manufacturingBoard structureDeflection angle
The invention provides a pickup head of a to-be-bonded piece, a bonding method and a computer readable storage medium. The pick-up head of the to-be-bonded piece comprises a body and a detection module. The body comprises a suction nozzle and an extraction opening. And the extraction opening provides negative pressure for the to-be-bonded piece through the suction nozzle so as to adsorb the to-be-bonded piece. The detection module comprises a hard board structure and an angle sensor. A plurality of air holes are distributed in the hard board structure, and the hard board structure is installed between the suction nozzle and the extraction opening through a rotating structure so as to deflect according to the difference of acting force generated by airflow flowing through the air holes. And the angle sensor detects the deflection angle of the hard board structure so as to represent the parallelism between the suction nozzle and the to-be-bonded piece. The device can be used for supporting real-time leveling of the pick-up head in the process of picking up the to-be-bonded piece, so that the problem of parallelism change caused by multiple bonding is avoided, and the bonding precision is improved.
Owner:PIOTECH (HAINING) SEMICON EQUIP CO LTD
Wafer motion system
The utility model provides a kind of wafer motion system.The wafer motion system includes mounting seat;Wafer carrier plate (3), wafer carrier plate (3) is set above mounting seat;Clamping assembly, wafer carrier plate (3) is clamped and fixed on mounting seat by clamping assembly;At least 3 Z direction drive assembly, be set below mounting seat, and with mounting seat movably connected.The wafer motion system provided by the utility model can solve the problem that the existing wafer alignment equipment causes wafer carrier plate instability and wafer deviation during the process of wafer rising to the bonding position, resulting in wafer early alignment failure, bonding error and reduced wafer quality after bonding.
Owner:YINGUAN SEMICON TECH CO LTD
Bonding device and method and storage medium
PendingCN119446976AImprove bonding accuracySemiconductor/solid-state device manufacturingStatic/dynamic balance measurementMechanical engineeringPhysics
The invention provides a bonding device and method and a storage medium. The bonding device comprises a bonding head used for adsorbing a to-be-bonded piece and bonding the to-be-bonded piece to a corresponding target position; the sensing mechanism is used for sensing coordinate information and / or angle information of at least three bonding positions on the to-be-bonded first surface of the to-be-bonded part in the process of bonding the to-be-bonded part; the controller is configured to determine the mass center of the to-be-bonded piece and the normal vector of the first surface according to the coordinate information and / or angle information of the at least three bonding positions; and determining the inclination angle of the first surface according to the mass center and the normal vector.
Owner:PIOTECH (HAINING) SEMICON EQUIP CO LTD