Device and method for compensating wedge-shaped error in wafer bonding
A wedge-shaped error and wafer bonding technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the bonding accuracy error of the upper and lower wafers, the non-parallel of the upper and lower wafers, wedge error, etc. problem, to achieve the effect of improving the accuracy
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[0037] Example 1:
[0038] Embodiments of the present invention provide a device for compensating wedge errors in wafer bonding, such as figure 1 As shown, the device includes an upper stage 100 and a lower stage 200, wherein:
[0039] The lower bearing platform 200 is provided with a first adsorption device, the upper surface of the lower bearing platform 200 is provided with a gasket 201, the gasket 201 is connected with a gasket driving device, and the lower surface of the lower bearing platform 200 is provided with a lifting and angle adjusting device 202.
[0040] The upper bearing platform 100 includes an inner frame 101 and an outer frame 102, the edge area of the inner frame 101 is located above the outer frame 102, and the inner frame 101 is floatingly connected to the outer frame 102 through the gravity balance device 103, so that the inner frame of the upper bearing platform floats on the upper bearing platform. On the outer frame of the stage, a plurality of cap...
Example Embodiment
[0054] Example 2:
[0055] An embodiment of the present invention provides a method for compensating wedge error in wafer bonding. The method is based on the device for compensating wedge error in wafer bonding described in Embodiment 1, and the method includes:
[0056] S1: The lower wafer is adsorbed on the upper surface of the lower carrier by the first adsorption device, and the upper wafer is adsorbed on the lower surface of the inner frame of the upper carrier by the second adsorption device, such as figure 2 shown.
[0057] S2: The shims on the lower stage are advanced to the edge area of the upper surface of the lower wafer by the shim drive device, such as image 3 shown.
[0058] S3: The gravity balance device performs gravity balance on the inner frame of the upper bearing platform, such as Figure 4 shown.
[0059] S4: The lower carrier is driven up by the lifting and angle adjustment device until it comes into contact with the upper wafer. The inner frame o...
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