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Wedge-shaped chopper structure for improving lead bonding precision

A wire bonding and wedge-shaped technology, which is applied in manufacturing tools, non-electric welding equipment, circuits, etc., can solve problems that do not involve the improvement of wedge-shaped rivet bonding accuracy, and achieve the effect of improving bonding accuracy and avoiding wire jamming

Active Publication Date: 2021-12-14
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned improvements in the structure and performance of the rivet have improved the life of the rivet and the welding effect compared with the existing technology, but none of them involve the improvement of the bonding accuracy of the wedge-shaped rivet.

Method used

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  • Wedge-shaped chopper structure for improving lead bonding precision
  • Wedge-shaped chopper structure for improving lead bonding precision
  • Wedge-shaped chopper structure for improving lead bonding precision

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Embodiment Construction

[0024] In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be directly connected or indirectly connected through an intermediary, it can be the internal communication of two elements or the interaction relationship between two elements. The "first", "second" and similar words mentioned in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Likewise, words like "a" or "one" do not denote a limitation in number, but indicate that there is at least one. In the implementation of this application, "and / or" describes the association relationship of associated objects, indicating that there may be three types of relationships, for example, A and / or B, which may mean: A exists alone, A and B e...

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Abstract

The invention relates to the technical field of microelectronic packaging, and particularly discloses a wedge-shaped chopper structure for improving lead bonding precision. The wedge-shaped chopper structure for improving lead bonding precision comprises a chopper handle and a chopper head connected with one end of the cutter handle; the chopper head is provided with a bonding lead via hole; and the bonding lead via hole comprises a guide hole and an elliptical through hole, wherein the guide hole is formed in the side surface of the chopper head and an elliptical through hole communicating with the guide hole. According to the wedge-shaped chopper structure for improving the lead bonding precision, the movable range of the bonding lead in the horizontal direction is effectively limited, and the bonding lead is prevented from deviating in the bonding lead via hole; the bonding lead can be always located in the center of the end face of the chopper head in the bonding process; and the bonding precision of the bonding lead is effectively improved.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging, and more specifically, relates to a wedge-shaped capillary structure for improving the precision of wire bonding. Background technique [0002] In the field of microelectronic packaging, wire bonding is usually used to realize electrical interconnection between unpackaged integrated circuit chips and chips, and chips and peripheral circuits. The wedge welding process has high welding density, small solder joint size, and low arc. It is one of the commonly used bonding wire bonding methods due to its characteristics of interconnection, deep cavity welding, and small parasitic effects. The wedge rivet is an important tool in the wedge bonding process, which directly determines the density of the bonding wire and the quality of the bonding product. [0003] A wedge-shaped rivet is used for bonding. In order to ensure the bonding accuracy and bonding quality, the bonding wire shoul...

Claims

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Application Information

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IPC IPC(8): B23K20/10B23K20/26H01L23/00
CPCH01L24/78B23K20/10B23K20/26H01L2224/78313H01L2224/78314
Inventor 贾斌王辉庞婷文泽海张平升董东李慧李悦徐榕青毛小红董江伍泽亮
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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