Clamping device for precalibration of COG chip

A technology for clamping devices and chips, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to solve problems such as affecting chip bonding accuracy, different chip directions and positions, and unstable chip positions.

Inactive Publication Date: 2010-05-19
SUNEAST ELECTRONICS TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the existing chip is taken out, because the position in the material box of the chip is not fixed, that is, the positions and directions of multiple chips may not be all different, so wh

Method used

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  • Clamping device for precalibration of COG chip
  • Clamping device for precalibration of COG chip
  • Clamping device for precalibration of COG chip

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0022] Such as figure 1 and figure 2 As shown, the present invention provides an embodiment of a COG chip pre-calibration clamping device.

[0023] The COG chip pre-calibration clamping device includes: a base 1, a first motor 2 fixed on the base 1 and a fixing device 3 for placing the calibration chip, and the first motor 2 passes through the first transmission belt 4. Connect with the first rotating wheel 19 fixed on the first rotating shaft (not shown in the drawings), the first rotating shaft is fixed to the base 1, the first rotating shaft is provided with a first cam 5, and the first cam The outer side of the 5 is provided with a first transmission rod 6 in close contact, the first transmission rod 6 provided with the first correction block 7 is slidably connected to the base 1, and the first transmission rod 6 and the base 1 are provided with a There is a first spring 22, the first transmission rod 6 is connected with the first slider 9 through the first transmission...

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Abstract

The invention discloses a clamping device for precalibration of a COG chip, which comprises a base, a first motor and a fixing device, wherein the first motor is fixed on the base; the first motor is connected with a first rotating wheel fixed with a first rotating shaft through a first transmission belt; the first rotating shaft is connected with the base; a first cam is arranged on the first rotating shaft; a first transmission rod which is in close contact with the first cam is arranged outside the first cam; the first transmission rod which is provided with a first calibration block is connected with the base slidably; a first spring is arranged between the first transmission rod and the base; the first transmission rod is connected with a first sliding block through a first transmission piece; the first sliding block is matched with a first guide rod on the base slidably; a second calibration block is arranged on the first sliding block; and the second calibration block and the first calibration block are oppositely arranged and are respectively positioned at two sides of the fixing device. The clamping device for precalibration of the COG chip can calibrate the position of the bonded chip to improve the bonding accuracy of the chip.

Description

technical field [0001] The invention relates to a chip pre-calibration clamping device for chip COG bonding process on a glass display substrate. Background technique [0002] COG uses anisotropic conductive film ACF and thermocompression welding technology to mount the integrated circuit chip on the glass substrate of the display screen, thereby reducing the product volume, increasing the assembly density, reducing costs, and realizing large-scale production. COG technology is widely used in various flat-panel displays and personal mobile products, and is currently the highest packaging form of packaging. [0003] During the chip bonding process, the bonded chip needs to be taken out of the material box and transferred to the bonding position of the glass substrate to realize the precise positioning of the chip and the glass plate. When the existing chip is taken out, because the position in the material box of the chip is not fixed, that is, the positions and directions o...

Claims

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Application Information

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IPC IPC(8): H01L21/68
Inventor 区大公张志能孔繁松李克天陈新度欧阳祥波
Owner SUNEAST ELECTRONICS TECH SHENZHEN
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