Clamping device for precalibration of COG chip

Abstract

The invention discloses a clamping device for precalibration of a COG chip, which comprises a base, a first motor and a fixing device, wherein the first motor is fixed on the base; the first motor is connected with a first rotating wheel fixed with a first rotating shaft through a first transmission belt; the first rotating shaft is connected with the base; a first cam is arranged on the first rotating shaft; a first transmission rod which is in close contact with the first cam is arranged outside the first cam; the first transmission rod which is provided with a first calibration block is connected with the base slidably; a first spring is arranged between the first transmission rod and the base; the first transmission rod is connected with a first sliding block through a first transmission piece; the first sliding block is matched with a first guide rod on the base slidably; a second calibration block is arranged on the first sliding block; and the second calibration block and the first calibration block are oppositely arranged and are respectively positioned at two sides of the fixing device. The clamping device for precalibration of the COG chip can calibrate the position of the bonded chip to improve the bonding accuracy of the chip.

Description

technical field [0001] The invention relates to a chip pre-calibration clamping device for chip COG bonding process on a glass display substrate. Background technique [0002] COG uses anisotropic conductive film ACF and thermocompression welding technology to mount the integrated circuit chip on the glass substrate of the display screen, thereby reducing the product volume, increasing the assembly density, reducing costs, and realizing large-scale production. COG technology is widely used in various flat-panel displays and personal mobile products, and is currently the highest packaging form of packaging. [0003] During the chip bonding process, the bonded chip needs to be taken out of the material box and transferred to the bonding position of the glass substrate to realize the precise positioning of the chip and the glass plate. When the existing chip is taken out, because the position in the material box of the chip is not fixed, that is, the positions and directions o...

AI Technical Summary

Problems solved by technology

When the existing chip is taken out, because the position in the material box of the chip is not fixed, that is, the positions and directions of multiple chips may not be all different, so when the chip is taken out, the direction and position of each chip are also different. When the chip is in place, the position of the chip is not fixed, which affects the chip bonding accuracy

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