A chip bonding device and method

A chip bonding and bonding device technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as low accuracy and yield, and achieve the effects of improving yield, saving operating time, and saving plant area.
CN108511353BActive Publication Date: 2020-02-21SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
Publication Date
2020-02-21

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Abstract

The invention discloses a chip bonding device and method. The chip bonding device comprises a chip supply unit, a chip pickup unit, a chip measurement unit, a chip temporary load-bearing unit and a chip bonding unit which are correspondingly arranged in sequence, wherein the chip temporary load-bearing unit comprises a load-bearing rotary table and bonding hands distributed on the load-bearing rotary table along the circumferential direction, the chip pickup unit picks up a chip on the chip supply unit, the chip is subjected to alignment through the chip measurement unit and then transferred to the bonding hand, and the bonding hand receives the chip and transfers the chip to a substrate borne on the chip bonding unit for bonding. The chip bonding device is applicable to a chip mounting mode with the chip facing upwards and a chip mounting mode with the chip facing downwards, and expands the application range of the equipment; the bonding hands are driven to transmit the chips throughthe load-bearing rotary table so as to save the transmission time, and the plurality of bonding hands operate simultaneously so as to improve the production rate; and the chip is aligned through the chip measurement unit, and the chip supply unit is provided with a separation detection system, so that the position of the chip is aligned, and the bonding accuracy is improved.
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Description

technical field

[0001] The invention relates to the technical field of chip bonding, in particular to a chip bonding device and method. Background technique

[0002] The flip chip bonding process is a form of interconnection formed by connecting a chip to a carrier. Due to the development trend of electronic products towards lightness, thinness and miniaturization, the application of chip bonding technology is increasing. Combining chip bonding technology with wafer-level packaging technology can produce smaller package size and higher performance. In addition, if the chip bonding process is combined with the TSV (Through Silicon Vias, through-silicon via) process, a chip structure with more competitive cost and performance can be produced. There are currently three fan-out (fan-out) bonding processes on the market, among which the chip-first-based fan-out bonding process is the mainstream process form that is widely used. The chip First process includes die-up (chip mark ...

Claims

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