Wire bonding method and apparatus

A wire bonding and bonding technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, non-electric welding equipment, etc., can solve problems such as increased idle time, limited accuracy, and PR positioning errors
CN101026111AActive Publication Date: 2007-08-29ASM ASSEMBLY AUTOMATION LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
ASM ASSEMBLY AUTOMATION LTD
Publication Date
2007-08-29

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Abstract

A wire bonding method and apparatus are provided for electronic components to enable PR processing and wire bonding to be carried out substantially concurrently. The apparatus comprises a bond head carrying a bonding tool for performing wire bonding and a rotary motor coupled to the bond head that is configured to change an angular orientation of the bonding tool relative to an electronic component to be bonded. There are first and second carriers for respectively mounting electronic components for wire bonding, and an optical system is arranged and configured to view bonding points on an electronic component mounted on the first carrier when the bonding tool is located over an electronic component mounted on the second carrier to perform wire bonding.
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Description

technical field

[0001] The present invention relates to wire bonding apparatus, and more particularly to a wire bonding apparatus for effecting wire connections between electronic components after the wire bonding points have been determined by visual inspection of the electronic components. Background technique

[0002] Wire bonding is used in the semiconductor packaging industry to make electrical connections between electronic components, such as between a die and a substrate on which the die is mounted or between a die and another die. Generally, such wire bonding devices are classified into two types: ball bonding devices, in which solder balls are formed at the ends of wires to be bonded; wedge wire bonding devices, in which The wire is deformed during bonding. Wedge wire bonding setups take full advantage of wedge-shaped bonding tools.

[0003] Ball bonding devices only require the bond head to move on three axes along the X, Y, and Z directions. But in the case of...

Claims

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