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Vacuum apparatus, substrate alignment apparatus, and method of forming pre-bonded wafer

A technology for aligning equipment and substrates, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficult implementation and complex sealing modules, and achieve the effect of improving bonding accuracy

Active Publication Date: 2018-06-05
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, the sealing modules in each embodiment are relatively complicated and difficult to realize

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  • Vacuum apparatus, substrate alignment apparatus, and method of forming pre-bonded wafer
  • Vacuum apparatus, substrate alignment apparatus, and method of forming pre-bonded wafer
  • Vacuum apparatus, substrate alignment apparatus, and method of forming pre-bonded wafer

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Embodiment Construction

[0061] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar extensions without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0062] In the following, specific embodiments of the present invention will be described in conjunction with the accompanying drawings. see Figure 1-6 As shown, the present invention provides a vacuum device, a substrate alignment device and a method for forming a pre-bonded wafer.

[0063] figure 2 A schematic diagram is shown when a substrate alignment device including a vacuum device transports a substrate according to an embodiment of the present invention. The vacuum device includes: an upper fixing module, a lower fi...

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Abstract

The invention provides a vacuum apparatus, a substrate alignment apparatus, and a method of forming a pre-bonded wafer. The vacuum apparatus includes an upper fixing module, a lower fixing module, anda vacuum module. The vacuum module is configured to form a vacuum cavity between the upper fixing module and the lower fixing module after an upper substrate is aligned with a lower substrate. The vacuum module includes a housing, a sealing module, and a vacuum interface. The housing has an opening and is configured to sleeve the outer sides of the upper fixing module and the lower fixing modulein a manner that the opening is arranged upwards. The sealing module is disposed between the upper fixing module and the housing to seal the upper fixing module and the housing to form a sealed cavity. The vacuum interface penetrates through the sidewall of the housing and provides a vacuum input for the sealed cavity to form a vacuum cavity. The vacuum apparatus eliminates a spacer structure between two substrates and avoids a series of alignment and bonding errors introduced by the spacer.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a vacuum device in wafer production process equipment, substrate alignment equipment and a method for forming pre-bonded sheets. Background technique [0002] At present, the main bonding process used in the industry is heating, pressing, or heating and pressing in a vacuum environment. In order to effectively bond the marks on the two substrates to be bonded within a certain range of alignment accuracy, that is, the two substrates need to complete an alignment operation with a certain accuracy before realizing the bonding action of the two substrates. The substrate alignment technology is a key technology in the substrate bonding process, which realizes the function of aligning two substrates before the bonding process, and satisfies a certain alignment accuracy. The realization of the alignment function requires the application of a microscope, and the usua...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/68
CPCH01L21/67092H01L21/67126H01L21/68
Inventor 高玉英魏巍霍志军
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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