Display device and bonding method thereof, and display equipment

A display device and display panel technology, applied in the direction of identification devices, instruments, etc., can solve problems affecting the accuracy of bonding equipment, and achieve the effects of improving bonding accuracy and correcting differences in expansion

Pending Publication Date: 2021-11-30
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in COF (Chip on Film) products, the thermal expansion coefficients of the pins on the panel and the pins on the COF are different, which affects the accuracy of the bonding equipment

Method used

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  • Display device and bonding method thereof, and display equipment
  • Display device and bonding method thereof, and display equipment
  • Display device and bonding method thereof, and display equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] display panel

[0071] Please refer to figure 1 , the display panel is provided with a plurality of mutually independent first pins arranged along the first direction X, and the plurality of first pins include a first center pin located on the center line of the display panel and a first pin located on the first A number of first side pins on both sides of the central pin, the axes of the first side pins are set at an angle with the center line of the display panel; wherein, the arrangement direction from the first central pin to both sides Above, the first spacing between adjacent sides of two adjacent first pins is equal, and the width of the first pins increases sequentially.

[0072] When specifically setting the shape of the first pin, the first pin (which may also be referred to as a panel pin in the following description) can be arranged axisymmetrically with respect to the axis of the first pin, and when specifically setting the first pin In addition, the sh...

Embodiment 2

[0088] drive carrier

[0089] Please refer to figure 2 , the driving carrier is provided with a plurality of second pins corresponding to each of the first pins one by one, and the plurality of second pins include a second center pin located on the center line of the display panel and a second pin located on the center line of the display panel. A number of second side pins on both sides of the second central pin, the axes of the second side pins are set at an angle with the center line of the display panel; wherein, from the second central pin to the two sides In the arrangement direction, the widths of the second pins are equal, and the second spacing between adjacent sides of two adjacent second pins increases sequentially.

[0090] Such as figure 2 As shown, in the embodiment of the present application, it is assumed that the width of the second central pin is a, and the distance between the second central pin and the adjacent second side pin is b. It should be note...

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PUM

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Abstract

The invention discloses a display device and a bonding method thereof, and display equipment. The display device comprises a display panel and a driving carrier bonded with the display panel, wherein first pins on the display panel are arranged in the arrangement direction from a first center pin to two sides, first distances between adjacent edges of every two adjacent first pins are equal, and the widths of the first pins are sequentially increased; and second pins on the driving carrier are arranged in a direction from a second center pin to two sides, the widths of the second pins are equal, and second distances between the adjacent edges of every two adjacent second pins are sequentially increased. According to the display device provided by an embodiment of the invention, the distances between the pins on the display panel is not changed, the width of the pins is gradually increased from center to edge, the width of the pins on the driving carrier is not changed, the distance between the pins is gradually increased from center to edge, poor products caused by swelling amount difference are corrected, and bonding precision is improved.

Description

technical field [0001] The present application generally relates to the field of display technology, and specifically relates to a display device, a bonding method thereof, and a display device. Background technique [0002] The display panel needs to be bonded during preparation, which is mainly to connect the panel with COF (chip-on-chip film) and FPC (flexible circuit board) through gold fingers, so that the panel has functions such as power supply, display, and touch. [0003] In the bonding process, a layer of ACF (Anisotropic Conductive Film, Anisotropic Conductive Film) is covered on the bonding structure, and then the control circuit board and the display substrate are aligned, vacuum adsorbed, and connected through the connection ends of the two The joint is solidified by pressing and heating, so as to realize the connection. [0004] However, in COF (Chip on Film) products, the thermal expansion coefficients of the pins on the panel and the pins on the COF are dif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/35
CPCG09F9/35
Inventor 蔡婷于立柱邵连柱
Owner BOE TECH GRP CO LTD
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