Display device and bonding method thereof, and display equipment

A display device and display panel technology, applied in the direction of identification devices, instruments, etc., can solve problems affecting the accuracy of bonding equipment, and achieve the effects of improving bonding accuracy and correcting differences in expansion
CN113724618APending Publication Date: 2021-11-30BOE TECH GRP CO LTD +1
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
BOE TECH GRP CO LTD
Publication Date
2021-11-30

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Abstract

The invention discloses a display device and a bonding method thereof, and display equipment. The display device comprises a display panel and a driving carrier bonded with the display panel, wherein first pins on the display panel are arranged in the arrangement direction from a first center pin to two sides, first distances between adjacent edges of every two adjacent first pins are equal, and the widths of the first pins are sequentially increased; and second pins on the driving carrier are arranged in a direction from a second center pin to two sides, the widths of the second pins are equal, and second distances between the adjacent edges of every two adjacent second pins are sequentially increased. According to the display device provided by an embodiment of the invention, the distances between the pins on the display panel is not changed, the width of the pins is gradually increased from center to edge, the width of the pins on the driving carrier is not changed, the distance between the pins is gradually increased from center to edge, poor products caused by swelling amount difference are corrected, and bonding precision is improved.
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Description

technical field

[0001] The present application generally relates to the field of display technology, and specifically relates to a display device, a bonding method thereof, and a display device. Background technique

[0002] The display panel needs to be bonded during preparation, which is mainly to connect the panel with COF (chip-on-chip film) and FPC (flexible circuit board) through gold fingers, so that the panel has functions such as power supply, display, and touch.

[0003] In the bonding process, a layer of ACF (Anisotropic Conductive Film, Anisotropic Conductive Film) is covered on the bonding structure, and then the control circuit board and the display substrate are aligned, vacuum adsorbed, and connected through the connection ends of the two The joint is solidified by pressing and heating, so as to realize the connection.

[0004] However, in COF (Chip on Film) products, the thermal expansion coefficients of the pins on the panel and the pins on the COF are dif...

Claims

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