Semiconductor structure and manufacturing method thereof

A technology of semiconductors and wires, applied in the field of semiconductor structures and their manufacturing, can solve problems affecting process yield, electronic component offset, etc., and achieve the effect of reducing resistance and facilitating heat dissipation

Pending Publication Date: 2021-10-15
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, when electronic components are embedded, the accuracy of the Pick&Place Machine (Pick&Place Machine) will cause electronic components to shift, tilt or rotate, which will affect the follow-up circuits or other processes. Yield

Method used

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  • Semiconductor structure and manufacturing method thereof
  • Semiconductor structure and manufacturing method thereof
  • Semiconductor structure and manufacturing method thereof

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Embodiment Construction

[0031] The specific implementation manners of the present disclosure will be described below in conjunction with the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by the present disclosure and the technical effects produced through the contents recorded in this specification. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. In addition, for the convenience of description, only the parts related to the related invention are shown in the drawings.

[0032] It should be noted that the structures, proportions, sizes, etc. shown in the accompanying drawings of the specification are only used to match the content recorded in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present disclosure. There are limited conditions, so it has...

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Abstract

According to a semiconductor structure and a manufacturing method thereof provided by the invention, the electrical connection between the electronic component and the substrate is realized through wire bonding, and the characteristics of the bonding start point and the bonding end point are determined in real time by using wire bonding, so that the deviation caused by the precision of die bonding is compensated in a maximum allowable range, moreover, the subsequent fabrication of the fan out layer only needs to align the circuit on the substrate, and does not need to align the electronic assembly, thereby improving the yield.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductors, in particular to semiconductor structures and manufacturing methods thereof. Background technique [0002] At present, when electronic components are embedded, the accuracy of the Pick&Place Machine (Pick&Place Machine) will cause electronic components to shift, tilt or rotate (rotate), which will affect the follow-up circuits or other processes. yield. In addition to improving the machine capabilities of Pick and Place, it is also possible to correct the alignment of electronic components through some different manufacturing methods. Contents of the invention [0003] The present disclosure provides semiconductor structures and methods of fabricating the same. [0004] In a first aspect, the present disclosure provides a semiconductor structure, which includes: a substrate; a first electronic component electrically connected to the substrate; an insulating connection layer di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/498H01L23/367H01L21/50H01L21/60
CPCH01L23/488H01L23/49838H01L23/367H01L21/50H01L24/85H01L2224/8512
Inventor 吕文隆
Owner ADVANCED SEMICON ENG INC
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