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Apparatus and method for compensating wedge errors in wafer bonding

A wedge error and wafer bonding technology, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve the bonding accuracy error, wedge error, and parallelism of two wafers on the upper and lower wafers Failure to meet the requirements and other problems, to achieve the effect of improving accuracy and reducing accuracy errors

Active Publication Date: 2022-04-26
BEIJING U PRECISION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] When the wafers are aligned for pre-bonding, it often happens that the parallelism of the two wafers does not meet the requirements. There is a bonding accuracy error in the circle

Method used

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  • Apparatus and method for compensating wedge errors in wafer bonding
  • Apparatus and method for compensating wedge errors in wafer bonding
  • Apparatus and method for compensating wedge errors in wafer bonding

Examples

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Embodiment 1

[0038] Embodiments of the present invention provide a device for compensating wedge errors in wafer bonding, such as figure 1 As shown, the device includes an upper loading platform 100 and a lower loading platform 200, wherein:

[0039] The lower platform 200 is provided with a first adsorption device, the upper surface of the lower platform 200 is provided with a gasket 201, the gasket 201 is connected with a gasket driving device, and the lower surface of the lower platform 200 is provided with a lifting and angle adjustment device 202.

[0040] The upper stage 100 includes an inner frame 101 and an outer frame 102. The edge area of ​​the inner frame 101 is located above the outer frame 102. The inner frame 101 is floatingly connected to the outer frame 102 through a gravity balance device 103, so that the inner frame of the upper stage floats on the upper carrier. On the outer frame of the table, a plurality of capacitive sensors 104 are arranged on the edge area of ​​the ...

Embodiment 2

[0055] An embodiment of the present invention provides a method for compensating wedge errors in wafer bonding, the method is based on the device for compensating wedge errors in wafer bonding described in Embodiment 1, and the method includes:

[0056] S1: The lower wafer is adsorbed on the upper surface of the lower carrier by the first adsorption device, and the upper wafer is adsorbed on the lower surface of the inner frame of the upper carrier by the second adsorption device, such as figure 2 shown.

[0057] S2: The gasket on the lower carrier is pushed to the edge area of ​​the upper surface of the lower wafer through the gasket driving device, such as image 3 shown.

[0058] S3: The gravity balance device performs gravity balance on the inner frame of the upper bearing platform, such as Figure 4 shown.

[0059] S4: The lower carrier is driven up by the lifting and angle adjustment device until it comes into contact with the upper wafer. The inner frame of the uppe...

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Abstract

The invention discloses a device and a method for compensating wedge-shaped errors in wafer bonding, belonging to the field of semiconductor wafer processing. The device includes an upper bearing platform and a lower bearing platform, the lower bearing platform is provided with a first adsorption device, the upper surface of the lower bearing platform is provided with a gasket, and the gasket is connected with a gasket driving device, and the The lower surface of the lower bearing platform is provided with a lifting and angle adjustment device; the upper bearing platform includes an inner frame and an outer frame, the edge area of ​​the inner frame is located above the outer frame, and the inner frame is connected to the outer frame through a gravity balance device. The outer frame is floatingly connected, a plurality of capacitive sensors are arranged on the edge area of ​​the inner frame, and a second adsorption device is arranged on the inner frame. The invention adopts the method of wedge error compensation to eliminate the wedge error between the upper and lower wafers, so that two non-parallel wafers can achieve three-dimensional parallelism, and finally achieve the effect of improving wafer bonding precision.

Description

technical field [0001] The invention relates to the field of semiconductor wafer processing, in particular to a device and method for compensating wedge errors in wafer bonding. Background technique [0002] A variety of semiconductor processes are involved in the IC manufacturing process. These processes require different equipment and methods. With the development of semiconductor processes from the micron level to the deep submicron and nanometer levels, there are precise work requirements for each subsystem of the IC manufacturing process. Higher and higher. [0003] As a key component of IC manufacturing equipment is the wafer alignment pre-bonding device, the accuracy and validity of this device will directly affect the success of wafer bonding. In the manufacturing process of the wafer alignment pre-bonding process, the first prerequisite to be met is to accurately align the two wafers, that is, after the surface treatment of the two wafers, the precise optical syste...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/18H01L21/66H01L21/68
CPCH01L21/187H01L22/12H01L22/26H01L21/68H01L22/32
Inventor 司伟杨光
Owner BEIJING U PRECISION TECH
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