5results about How to "High bonding precision" patented technology

A kind of bonding method suitable for 8 inch semiconductor crystal bar, S1, using crystal orientation equipment according to the deviation of crystal orientation to determine the angle α and β that 8 inch crystal bar needs to be deflected for bonding, then 8 inch crystal bar is rotated around its axis to make its Notch rotate β angle, and it is horizontally placed on the stick bar device;S2, the crystal holder with resin plate is placed on the stick bar device, and after rotating the crystal holder to make its rotation angle α, it is fixed on the stick bar device;S3, raise the crystal holder to make the crystal bar and the arc top surface of resin plate fit and compress tightly, until the glue between resin plate and crystal bar is initially cured;S4, take out the initially cured crystal bar to recheck, if the crystal bar bonding is qualified, continue to cure the glue of crystal bar and resin plate until bonding is completed, otherwise, adjust the deflection angle of crystal bar and crystal holder until the crystal bar bonding is qualified;In S4, the crystal bar crystal orientation rechecking instrument is used to detect the initially cured crystal bar to obtain Z, calculate to obtain the actual horizontal crystal orientation X of crystal bar 实 And actual vertical crystal orientation Y 实 , improve accuracy.

This utility model relates to a rod positioning and bonding fixture for processing hemispherical resonators, including a fixture base. The fixture base is equipped with a side frame, a rod support assembly, and an automatic glue applicator. The side frame has a clamping member for holding a reference rod. The rod support assembly supports the molten quartz rod and has a drive mechanism for aligning the end of the molten quartz rod with the end of the reference rod. The automatic glue applicator is located between the clamping member and the rod support assembly and is used to apply glue to the end of the reference rod. In this utility model, the clamping member on the side frame fixes the reference rod to provide a stable processing reference; the rod support assembly supports the molten quartz rod and achieves precise alignment with the reference rod through the drive mechanism, ensuring coaxiality and contact accuracy between the two; the automatic glue applicator, located between the two, can accurately apply glue to the end of the reference rod, ensuring reliable and consistent bonding.

The utility model discloses a kind of ITO conductive film glass, its structure includes: positioning structure, glass main body, sputtering layer, ITO conductive film, positioning structure is adhered to the lower edge position of glass main body by optical cement and glass main body is covered by upper end sputtering layer to let ITO conductive film;The utility model is based on the positioning structure being set in the lower end edge of glass main body, using the frame of positioning structure combines optical cement to let bonding layer be fixed in the lower edge of glass main body, then cavity according to the normal light transmission use of permeability state without affecting glass main body, subsequently when being connected with electronic component, positioning block can be embedded first and be clamped in the inside of electronic component, ensure that glass main body center point can be coincident with electronic component center point, replaced original direct placement and then the center point of optical cement generation is constantly displaced and reduced the practicality of ITO conductive glass, further improve the bonding accuracy of ITO conductive glass.