10results about How to "High bonding precision" patented technology

A kind of bonding method suitable for 8 inch semiconductor crystal bar, S1, using crystal orientation equipment according to the deviation of crystal orientation to determine the angle α and β that 8 inch crystal bar needs to be deflected for bonding, then 8 inch crystal bar is rotated around its axis to make its Notch rotate β angle, and it is horizontally placed on the stick bar device;S2, the crystal holder with resin plate is placed on the stick bar device, and after rotating the crystal holder to make its rotation angle α, it is fixed on the stick bar device;S3, raise the crystal holder to make the crystal bar and the arc top surface of resin plate fit and compress tightly, until the glue between resin plate and crystal bar is initially cured;S4, take out the initially cured crystal bar to recheck, if the crystal bar bonding is qualified, continue to cure the glue of crystal bar and resin plate until bonding is completed, otherwise, adjust the deflection angle of crystal bar and crystal holder until the crystal bar bonding is qualified;In S4, the crystal bar crystal orientation rechecking instrument is used to detect the initially cured crystal bar to obtain Z, calculate to obtain the actual horizontal crystal orientation X of crystal bar 实 And actual vertical crystal orientation Y 实 , improve accuracy.

This utility model relates to a rod positioning and bonding fixture for processing hemispherical resonators, including a fixture base. The fixture base is equipped with a side frame, a rod support assembly, and an automatic glue applicator. The side frame has a clamping member for holding a reference rod. The rod support assembly supports the molten quartz rod and has a drive mechanism for aligning the end of the molten quartz rod with the end of the reference rod. The automatic glue applicator is located between the clamping member and the rod support assembly and is used to apply glue to the end of the reference rod. In this utility model, the clamping member on the side frame fixes the reference rod to provide a stable processing reference; the rod support assembly supports the molten quartz rod and achieves precise alignment with the reference rod through the drive mechanism, ensuring coaxiality and contact accuracy between the two; the automatic glue applicator, located between the two, can accurately apply glue to the end of the reference rod, ensuring reliable and consistent bonding.

The invention discloses a magnetic type guide plate for position transfer of an oral digital indirect bonding bracket, and belongs to the technical field of position transfer of orthodontic indirect bonding brackets. The problems of low bracket positioning efficiency and poor positioning precision caused by difficult dislocation of the guide plate and the bracket in the prior art are solved. The biteplate is provided with a bracket guide plate body, the bracket guide plate body is provided with a baffle and two opposite side plates, the baffle is located between the two side plates, the baffle is provided with a through hole, the diameter of the inner end of the through hole is smaller than that of the outer end of the through hole, and a magnet matched with the through hole is arranged in the through hole. The magnetic type guide plate for the position transfer of the oral digital indirect bonding bracket is used for indirect bonding transfer of the bracket in the orthodontic process, the magnet in the through hole adsorbs and fixes the bracket in the transfer process, and the magnet is taken out for dislocation after the bracket is transferred and fixed, so that the bracket transfer efficiency is improved, and the bracket bonding positioning efficiency is improved; the bracket position is fixed in the transferring process, the bracket positioning precision is improved, and the orthodontic effect is improved.

The invention provides a high-frequency heating full-automatic plate sticking machine which comprises a feeding mechanism, a high-frequency heating mechanism, a waste plate removing mechanism, a cooling mechanism, a gluing mechanism, a resin plate feeding mechanism and a curing warehouse which are sequentially arranged in the conveying direction of a material base and further comprises a conveying mechanism, and the conveying mechanism comprises a conveying line and a carrying mechanism. According to the invention, the processes of heating and separation of the material base and the waste resin plate, material base residual glue treatment, material base cooling, material base gluing, new resin plate bonding, curing, storage and the like are realized, manpower reduction and automation are realized, the production efficiency is improved, and the labor intensity and the production cost are reduced.

The utility model discloses a kind of ITO conductive film glass, its structure includes: positioning structure, glass main body, sputtering layer, ITO conductive film, positioning structure is adhered to the lower edge position of glass main body by optical cement and glass main body is covered by upper end sputtering layer to let ITO conductive film;The utility model is based on the positioning structure being set in the lower end edge of glass main body, using the frame of positioning structure combines optical cement to let bonding layer be fixed in the lower edge of glass main body, then cavity according to the normal light transmission use of permeability state without affecting glass main body, subsequently when being connected with electronic component, positioning block can be embedded first and be clamped in the inside of electronic component, ensure that glass main body center point can be coincident with electronic component center point, replaced original direct placement and then the center point of optical cement generation is constantly displaced and reduced the practicality of ITO conductive glass, further improve the bonding accuracy of ITO conductive glass.

The utility model relates to the technical field of silicon rod processing, and particularly discloses a resin plate fixing device. The resin plate fixing device comprises a base, a jacking mechanism, a positioning mechanism, a counterweight assembly and a taking and placing mechanism. The jacking mechanism can jack up the crystal support located on the conveying line and the resin plate located on the face, coated with glue, of the crystal support. The positioning mechanism can position the resin plate; the counterweight assembly can enable the resin plate and the crystal support to be pressed and bonded; the taking and placing mechanism can move the counterweight assembly onto the resin plate and take away the counterweight assembly from the resin plate. The resin plate fixing device can effectively prevent the resin plate from deviating and improve the bonding precision of the resin plate and the crystal support.

The utility model relates to a thermal expansion matched alloy and ceramic bonding mechanism which comprises a launching die body and further comprises two launching die cavities symmetrically arranged on the two sides of the launching die body. The poly-fluorine block is movably connected to the upper part of the emission mold main body; the number of the limiting cushion blocks is two, and the limiting cushion blocks are arranged on the corresponding emission mold cavities; the number of the limiting strips is two, and the limiting strips are movably connected to the corresponding emission mold cavities. The beneficial effects of the utility model lie in that: through the movable connection of launching mould cavity and launching mould main part, this device can be adjusted according to different guide vane specifications and can realize quick dissembling, through the spacing cushion block and the spacing block can limit the multilayer guide vane, make the position more accurate in the bonding process of multilayer guide vane, and the production efficiency is improved. And compared with traditional bonding equipment, the bonding precision and the use convenience can be greatly improved.

The invention relates to a novel wind power boosting rotor outer cylinder reinforcing rib positioning tool and a positioning method thereof.The novel wind power boosting rotor outer cylinder reinforcing rib positioning tool comprises a hanging plate, a frame, a mounting support, a mounting carrier, a locking mechanism and a positioning mechanism; a reinforcing rib and a counterweight reinforcing rib on the wind power boosting rotor outer cylinder are mounted on the mounting bracket and the mounting carrier through a positioning mechanism, and the mounting bracket and the mounting carrier are mounted on the frame through a locking mechanism; during installation, only the reinforcing ribs need to be installed on the four sets of installation supports, then the balance weight reinforcing ribs are installed on the installation carrying frame, the four sets of installation supports and the installation carrying frame are installed on the five sets of installation rods of the square-frame-shaped truss, and then the frame is hoisted to a half wind power boosting rotor through a crane. Compared with the previous bonding operation of a single reinforcing rib or a counterweight reinforcing rib, the novel wind power boosting rotor outer cylinder reinforcing rib positioning tool and the positioning method thereof have the advantage that the working efficiency is higher.