40results about How to "Realize automatic bonding" patented technology

The invention relates to an adhesive tape sticking device. The adhesive tape sticking device comprises a machine frame, an adhesive tape paying-off device, an adhesive tape driving device, an adhesive tape cutting deice, an adhesive tape adsorption device, a press wheel device and a conveying device, wherein the adhesive tape paying-off p device and the conveying device are arranged on the machine frame, the adhesive tape paying-off device comprises an adhesive tape paying-off mechanism and an adhesive tape conveying mechanism, the conveying device comprises a first installation plate and a first movement mechanism, a second installation plate is arranged on the first installation plate, the adhesive tape driving device is fixed to the second installation plate, and the adhesive tape adsorption device and the press wheel device are fixedly arranged on the rear side of the adhesive tape driving device sequentially. The adhesive tape cutting device is arranged between a seventh idler wheel and a ninth idler wheel and comprises a fourth air cylinder, a cutter connecting plate, a cutter and a guide seat. The adhesive tape sticking device can automatically stick adhesive tape to a welding strip of a battery piece, and improve the conversion efficiency of a battery string.

The invention discloses an automatic monocrystal silicon bonding machine. The automatic monocrystal silicon bonding machine comprises a monocrystal silicon feeding system, a monocrystal silicon fixture feeding system, a resin feeding system and an operating system matching with the monocrystal silicon feeding system, the monocrystal silicon fixture feeding system and the resin feeding system. The monocrystal silicon feeding system comprises a first conveying device, and the monocrystal silicon fixture feeding system comprises a second conveying device. The automatic monocrystal silicon bonding machine is capable of achieving automatic bonding of monocrystal silicon fixtures, resin and monocrystal silicon, so that large-scale production of silicon wafers is achieved.

The invention relates to the technical field of wafer packaging, and particularly discloses packaging equipment. A first feeding device automatically supplies a material box carrying a plurality of frames, and a second feeding device automatically supplies a plurality of stacked frames; a first feeding unit of the double-layer material rolling device is used for transferring the frame transferredby the material supply device; a pneumatic dispensing device conducts pneumatic dispensing on the frame borne by the first feeding unit. An electric gluing device is used for carrying out electric dispensing on the frame borne by the first feeding unit; a wafer expanding device is used for carrying out wafer expanding treatment on the wafer assembly, a bonding head device is used for bonding the wafer element subjected to wafer expanding treatment by the wafer expanding device to the dispensed frame, and a second feeding unit is used for moving the frame bonded with the wafer element; automatic bonding packaging of the crystal element and the frame is realized, and the packaging efficiency of the crystal element and the frame is improved; two dispensing processing modes of pneumatic dispensing and electric gluing, and two feeding modes of material box feeding and material piece feeding are adopted, so that the compatibility of packaging equipment is improved.

The invention relates to an automatic magnetic steel bonding device for a quick-action switch. The automatic magnetic steel bonding device comprises a working groove (1) of a long-striped structure with the U-shaped cross section, a positioning component is arranged in the working groove (1) in the length direction, and a glue dispensing component and a magnetic steel assembling component are arranged on one side of the working groove (1). The automatic magnetic steel bonding device for the quick-action switch has the advantage that the problem that an existing magnetic steel bonding device cannot carry out bonding on small magnetic steel is solved. Bonding assembling of small magnetic steel of the quick-action switch can be achieved through cooperation of the positioning component, the glue dispensing component and the magnetic steel assembling component. Glue dispensing cylinders are provided with pressure regulating valves so that the glue dispensing amount can be controlled by regulating air pressure, and quality uniformity of the product can be ensured; glue adding can be prompted in time through early-warning devices on the outer walls of the glue dispensing cylinders. The magnetic poles of magnetic steel fixed by a magnetic steel base in advance can be distinguished, and production efficiency is improved. In addition, the device can achieve automatic bonding of magnetic steel by controlling air cylinders to work with a PLC and a solenoid valve.

The invention discloses automatic boxing and packaging equipment for blocky products. The equipment comprises a product feeding device, a packaging box forming device and a product boxing device. Products on a feeding conveying belt are arranged through an arranging mechanism and then sequentially transferred to an arranging conveying belt; the packaging box forming device is used for forming flattened box paper; and the product boxing device is used for loading the arranged products into formed packaging boxes and performing cover sealing on the packaging boxes. By the adoption of the automatic boxing and packaging equipment, automatic arrangement of the products, automatic forming of the box paper, automatic boxing of the products and final automatic cover sealing of the packaging boxes can be effectively achieved, efficiency is improved, and the packaging effect is also guaranteed.

A monocrystalline silicon automatic bonding method is disclosed by the invention, and comprises the following steps: S1. feeding for a monocrystalline silicon feeding system, a crystal silicon clamp feeding system and a resin feeding system of a monocrystalline silicon automatic bonding machine; S2. opening a dispensing system and spraying a binder on the crystal silicon clamp; S3. moving a machinery hand to grab a sheet of resin and place on the crystal silicon clamp; S4. opening the dispensing system and spraying the binder on the resin; S5. moving the machinery hand to grab a sheet of monocrystalline silicon on the resine; S6. deliverying the crystal silicon clamp, the resin and monocrystalline silicon which are bonded together to a discharge end of the monocrystalline silicon automatic bonding machine. Compared with the prior art, the monocrystalline silicon automatic bonding method of the invention can help to achieve an automatic bonding of the crystal silicon clamp, the resin and the monocrystalline silicon.

The invention discloses a wine box base shell bonding device comprising a base plate. The top face of the base plate is provided with a push plate, a pressing plate and a discharge outlet sequentially. The push plate does reciprocating motion facing or back on to the pressing plate along the top face of the base plate. A top plate is fixed above the base plate. The pressing plate does vertical reciprocating motion between the top plate and the base plate and perpendicular to the top face of the base plate. The pressing plate is matched with an inner opening of a wine box base shell. A discharge conveying belt is arranged below the base plate and at the discharge outlet. Known from the above structure, through the wine box base shell bonding device, automatic bonding of the wine box base shell is achieved, manual bonding is not needed, bonding efficiency is improved, labor intensity of operators is lowered, and bonding quality is ensured.

The invention relates to automatic adhesive tape pasting equipment which comprises an electrical cabinet, two pasting mechanisms are arranged in the electrical cabinet from left to right, each pasting mechanism comprises a black band moulding bed, an adhesive tape moulding bed is arranged at the bottom of the black band moulding bed, a plurality of pressure sensors are arranged at the bottom of the adhesive tape moulding bed, and the pressure sensors are connected with the adhesive tape moulding bed. A white film detector and an in-place sensor are arranged on the top of the rubber belt forming die, and the in-place sensor is arranged on one side of the white film detector. According to the automatic bonding device, automatic bonding of the 3M adhesive tape is achieved, the bonding accuracy rate of 98% or above is achieved, the manual operation time and the rework rate of parts are reduced, and automatic production is achieved.

The invention provides automatic adhesive tape bonding equipment for bonding adhesive tape to a product located on a production line and advancing along with the production line. The bonding equipmentcomprises a supply mechanism for outwards outputting the adhesive tape, a rack arranged along the production line, a following mechanism which is arranged on the rack and can follow the product, a robot connected to the following mechanism, and a bonding mechanism connected to the robot for adhesive tape bonding. According to the automatic adhesive tape bonding equipment, automatic adhesive tapesupply can be achieved through the supply mechanism, and synchronous advancing of the bonding part and the product can be achieved through the following mechanism; and through the bonding mechanism driven through the robot, the adhesive tape can be automatically bonded to the product, automatic bonding of the adhesive tape on products such as automobile skylight can be achieved, and good practicability is achieved.

The invention relates to a semi-automatic material receiver. The semi-automatic material receiver comprises an upper material plate and a lower material plate. Multiple vertical guide rails are fixedly connected to the lower material plate. Through holes matched with the guide rails are correspondingly formed in the upper material plate. Each guide rail is sleeved with a reset spring. The reset springs are located between the upper material plate and the lower material plate. The lower side face of the upper material plate is provided with a containing cavity used for containing metal clasps. The containing cavity is located on the front portion of the upper material plate. The lower side face of the upper material plate is further provided with a sliding groove arranged in the front-back direction. The sliding groove is communicated with the containing cavity. The upper side face of the lower material plate is provided with supporting blocks, wherein the supporting blocks correspond to the containing cavity and are used for fixing a material strap. The semi-automatic material receiver has the advantages that operation is simple, the working efficiency and the automation degree are high, and more materials of the metal clasps are saved.

The invention relates to the technical field of metal handicraft processing, in particular to a metal handicraft fixing and bonding device which comprises a first gear, a caterpillar band, a second gear, a first sliding plate, a channel, a glue box, a second sliding plate, a sliding rolling shaft, a plastic film and a rotating rod. The first gear is connected with the second gear through the caterpillar band, and the first sliding plate is connected to the left side of the second gear; the channel is connected to the left side of the first sliding plate; a channel sliding rolling shaft is arranged in the channel; the glue box is mounted on the side surface of the channel; the second sliding plate is arranged on the left side of the glue box; and the first gear is connected to one side of the second sliding plate and is connected with the second gear through the caterpillar band. By means of the metal handicraft fixing and bonding device, the effects of automatic bonding, automatic fixing and batch operation can be achieved.

The invention relates to an automatic door plate feeding and discharging device. The device comprises a first conveying belt, an automatic feeding device is arranged at the feeding end of the first conveying belt, and an automatic discharging device is arranged at the discharging end of the first conveying belt; a second conveying belt and a top plate feeding device are arranged at one side of the first conveying belt, and an automatic glue spraying device is arranged above the position, located between the automatic feeding device and the second conveying belt, of the first conveying belt; and the automatic feeding device comprises a box body with a support, a horizontal containing plate located in the box body, a horizontal pushing air cylinder fixedly connected to the side wall of the box body and a plurality of first jacking air cylinders vertically arranged under the box body. By arranging the automatic feeding device, the top plate feeding device and the automatic discharging device, automatic feeding and discharging of a door plate are achieved in the machining process of the door plate, operation is easy, and more time and labor are saved.