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A fpc automatic bonding machine

An automatic bonding and bonding technology, applied in the direction of connecting components, mechanical equipment, material gluing, etc., can solve the problems of low bonding accuracy, the bonding process is greatly affected by human factors, and the size of FPC is small, so as to improve the bonding Accuracy, achieve the effect of automatic bonding

Active Publication Date: 2021-07-27
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

FPC on electronic products has disadvantages such as small size, narrow installation space, human factors in the bonding process, and difficulty in ensuring positional accuracy.
[0004] Therefore, it is necessary to propose an FPC automatic bonding machine to solve the problem of low bonding accuracy

Method used

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  • A fpc automatic bonding machine
  • A fpc automatic bonding machine
  • A fpc automatic bonding machine

Examples

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Embodiment Construction

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0032] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0033] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The present invention provides an FPC automatic bonding machine, comprising: a carrying device configured to carry FPC and products; a turning device including a first feeding mechanism, a turning mechanism and a first driving mechanism, and the first feeding mechanism is configured as The FPC is carried, the first feeding mechanism is arranged on the flipping mechanism, the first driving mechanism is connected with the flipping mechanism, and the first driving mechanism is configured to drive the flipping mechanism to flip, so that the bonding surface of the FPC is opposite to the surface to be bonded of the product; a connecting device configured to bond the FPC to the product; a transferring device configured to transfer the FPC on the carrier device to the flipping device and the FPC on the flipping device to the bonding device; the positioning device, including position acquisition A mechanism and a deviation correction mechanism; the position acquisition mechanism is configured to acquire position information of the FPC and the product, and the deviation correction mechanism corrects the position of the FPC and the product according to the position information. The turning mechanism can realize automatic bonding of FPC, and the positioning device can improve the bonding accuracy of FPC.

Description

technical field [0001] The invention relates to the technical field of circuit board assembly, and more specifically, the invention relates to an FPC automatic bonding machine. Background technique [0002] As an electrical component, FPC has high bending flexibility. Users can change its shape according to the installation space, and its signal transmission function will not be affected after bending. Moreover, FPC also has the characteristics of anti-static interference and high and low temperature resistance, so it is widely used in various electronic devices such as mobile phones, bracelets, earphones, and tablet computers. In the assembly process of electronic products, it is often necessary to bond the FPC to the surface of the fixed shell or cavity, and the assembly requires high precision. [0003] In the prior art, the bent and shaped FPC is generally bonded to the surface of the fixed shell or cavity by manual means. FPCs on electronic products have disadvantage...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 董丙玺祝青松王新江丁策李建坤
Owner GOERTEK INC
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