A bonding mold and bonding method for tapered surface friction material of synchronizer inner ring
A friction material and synchronizer technology, which is applied to the bonding mold of the inner ring cone friction material of the automobile synchronizer and its bonding field, can solve the problems of high energy consumption in the production process, long production cycle, low production efficiency, etc., and achieve increased Friction area, increased friction torque, and improved discharge efficiency
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Embodiment 1
[0062] Embodiment 1 Synchronizer inner ring outer cone surface friction material bonding mold
[0063] Such as Figure 4 to Figure 6 As shown, the mold for bonding the friction material of the inner ring of the synchronizer provided in this embodiment includes a lower mold 1 and an upper mold 2 that cooperate with each other and a heating mechanism.
[0064] The heating mechanism mainly consists of an upper heating plate 31, a lower heating plate 32, a heating rod 33 and a wire 34;
[0065] Lower mold 1 comprises the first lower mold bottom plate 11a, the first ring gauge 15a, the first ejector plate 12a and the first ejector rod 13a, and two cylindrical pins a 16a on the position along the circumference pass through the first ring gauge 15a, The installation hole of the first lower mold bottom plate 11a is fixed in the lower heating plate 32 installation holes, and the first ring gauge 15a and the first lower mold bottom plate 11a are fixedly connected together by three scre...
Embodiment 2
[0079] Example 2 Bonding mold for inner and outer cone friction material of synchronizer inner ring
[0080] Such as Figure 7 to Figure 9 As shown, the mold for bonding the friction material of the inner ring of the synchronizer provided in this embodiment includes a lower mold 1 and an upper mold 2 that cooperate with each other and a heating mechanism.
[0081] The heating mechanism mainly consists of an upper heating plate 31, a lower heating plate 32, a heating rod 33 and a wire 34;
[0082] Lower mold 1 comprises the second lower mold bottom plate 11b, the limit base 12b and the expansion core 13b and the second ejector plate 14b, support block 15b, second ejector rod 16b coaxially connected; the second lower mold bottom plate 11b, limiter The position base 12b and the expansion core 13b are positioned by the cylindrical pin c110b, and fixedly connected by a plurality of screws f 19b, and the screws f 19b extend into the lower heating plate 32, and the second lower mold...
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