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Packaging equipment

A technology of packaging equipment and feeding device, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve the problems of single frame feeding method, inability to meet actual production capacity, and low installation efficiency of crystal components and frames.

Pending Publication Date: 2020-03-27
深圳市意沨科技有限公司
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AI Technical Summary

Problems solved by technology

[0002] During the packaging process of the crystal element, the crystal element needs to be installed on the frame. The installation efficiency of the crystal element and the frame in the prior art is low and cannot meet the demand of actual production capacity.
In addition, in the prior art, the processing method of dispensing glue on the frame is single, and the feeding method of the frame is single, which cannot meet the actual needs of most manufacturers, and is extremely inconvenient to use

Method used

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Embodiment Construction

[0043] The present invention will be further described below in conjunction with the embodiments and drawings.

[0044] Reference figure 1 , The packaging equipment of the present invention includes a first feeding device 1, a second feeding device 2, a double-layer rolling device 3, a pneumatic dispensing device 4, an electric glue device 5, a crystal expansion device 6 and a bonding head Device 7; the first feeding device 1 is used to automatically supply a cassette carrying multiple frames, and the second feeding device 2 is used to automatically supply multiple stacked frames. Of course, according to actual needs, the manufacturer can choose to use only the first feeding device 1 or only the second feeding device 2.

[0045] The double-layer rolling device 3 has a first feeding unit and a second feeding unit. The first feeding unit is located above the second feeding unit. The first feeding unit is used to transfer the frame transferred by the feeding device; the pneumatic disp...

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Abstract

The invention relates to the technical field of wafer packaging, and particularly discloses packaging equipment. A first feeding device automatically supplies a material box carrying a plurality of frames, and a second feeding device automatically supplies a plurality of stacked frames; a first feeding unit of the double-layer material rolling device is used for transferring the frame transferredby the material supply device; a pneumatic dispensing device conducts pneumatic dispensing on the frame borne by the first feeding unit. An electric gluing device is used for carrying out electric dispensing on the frame borne by the first feeding unit; a wafer expanding device is used for carrying out wafer expanding treatment on the wafer assembly, a bonding head device is used for bonding the wafer element subjected to wafer expanding treatment by the wafer expanding device to the dispensed frame, and a second feeding unit is used for moving the frame bonded with the wafer element; automatic bonding packaging of the crystal element and the frame is realized, and the packaging efficiency of the crystal element and the frame is improved; two dispensing processing modes of pneumatic dispensing and electric gluing, and two feeding modes of material box feeding and material piece feeding are adopted, so that the compatibility of packaging equipment is improved.

Description

Technical field [0001] The invention relates to the technical field of wafer packaging, and in particular discloses a packaging device. Background technique [0002] During the packaging process of the crystal element, the crystal element needs to be installed on the frame. In the prior art, the installation efficiency of the crystal element and the frame is low, and cannot meet the actual production demand. In addition, in the prior art, the processing method of dispensing glue on the frame is single, and the feeding method of the frame is single, which cannot meet the actual needs of most manufacturers and is extremely inconvenient to use. Summary of the invention [0003] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a packaging device to realize the automatic bonding and packaging of the crystal element and the frame, and improve the packaging efficiency of the two; pneumatic dispensing and electric ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 刘子玉陈勇伶
Owner 深圳市意沨科技有限公司
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