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FPC automatic pasting machine

An automatic bonding and bonding technology, which is applied in the direction of connecting components, mechanical equipment, and material gluing, can solve the problems of low bonding precision, large influence of human factors on the bonding process, and difficulty in ensuring positional accuracy. The effect of connection accuracy

Active Publication Date: 2020-03-17
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

FPC on electronic products has disadvantages such as small size, narrow installation space, human factors in the bonding process, and difficulty in ensuring positional accuracy.
[0004] Therefore, it is necessary to propose an FPC automatic bonding machine to solve the problem of low bonding accuracy

Method used

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Examples

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Embodiment Construction

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0032] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0033] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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PUM

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Abstract

The invention provides an FPC automatic pasting machine. The FPC automatic pasting machine comprises a bearing device, an overturning device, a pasting device, a transferring device and a positioningdevice. The bearing device is configured to bear FPCs and products. The overturning device comprises a first receiving mechanism, an overturning mechanism and a first drive mechanism, the first receiving mechanism is configured to bear the FPCs, the first receiving mechanism is arranged on the overturning mechanism, the first drive mechanism is connected with the overturning mechanism, the first drive mechanism is configured to drive the overturning mechanism to be overturned, and the pasting surfaces of the FPCs are opposite to the to-be-pasted surfaces of the products. The pasting device isconfigured to paste the FPCs on the products. The transferring device is configured to transfer the FPCs on the bearing device to the overturning device and transferring the FPCs on the overturning device to the pasting device. The positioning device comprises a position acquisition mechanism and a deviation correction mechanism. The position acquisition mechanism is configured to acquire positioninformation of the FPCs and the products, and the deviation correction mechanism corrects the positions of the FPCs and the products according to the position information. The FPCs can be automatically pasted through the overturning mechanism, and the pasting precision of the FPCs can be improved through the positioning device.

Description

technical field [0001] The invention relates to the technical field of circuit board assembly, and more specifically, the invention relates to an FPC automatic bonding machine. Background technique [0002] As an electrical component, FPC has high bending flexibility. Users can change its shape according to the installation space, and its signal transmission function will not be affected after bending. Moreover, FPC also has the characteristics of anti-static interference and high and low temperature resistance, so it is widely used in various electronic devices such as mobile phones, bracelets, earphones, and tablet computers. In the assembly process of electronic products, it is often necessary to bond the FPC to the surface of the fixed shell or cavity, and the assembly requires high precision. [0003] In the prior art, the bent and shaped FPC is generally bonded to the surface of the fixed shell or cavity by manual means. FPCs on electronic products have disadvantage...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 董丙玺祝青松王新江丁策李建坤
Owner GOERTEK INC
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