36results about How to "Poor bonding" patented technology

A method for fabricating germanium-on-insulator (GOI) substrate materials, the GOI substrate materials produced by the method and various structures that can include at least the GOI substrate materials of the present invention are provided. The GOI substrate material include at least a substrate, a buried insulator layer located atop the substrate, and a Ge-containing layer, preferably pure Ge, located atop the buried insulator layer. In the GOI substrate materials of the present invention, the Ge-containing layer may also be referred to as the GOI film. The GOI film is the layer of the inventive substrate material in which devices can be formed.

A microfluidic device preferably made of a thermoplastic polymer that includes a channel or a multiplicity of channels whose surfaces are modified by photografting. The device further includes a porous polymer monolith prepared via UV initiated polymerization within the channel, and functionalization of the pore surface of the monolith using photografting. Processes for making such surface modifications of thermoplastic polymers and porous polymer monoliths are set forth.

The present invention provides a method and facility for preventing crumbling and powderization of green pellets when producing high strength green pellets using a powder feedstock and using the pellets in a rotary hearth reducing furnace and for efficiently reducing the same. It comprises kneading by a kneader 5 a feedstock of a powder of a fine particle size (20 to 80 wt % having size of not more than 10 mum) including a metal oxide and carbon-bearing powder fed from a feed storage tank 1 and producing green pellets by a pan type pelletized 7. The green pellets are screened by a pellet screen 9, then dried by a pellet dryer 11 and reduced by firing in a rotary hearth reducing furnace 13. At that time, the green pellets are continuously conveyed to prevent crumbling.

A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bonding pads and one of the metal studs corresponding to the bonding pad form a T-shaped structure. Therefore, bonding force between the metal studs and the first encapsulant is enhanced such that delamination is avoided. Die mounting, wire-bonding and molding processes are performed subsequently. Since the half-etched grooves are filled with the first encapsulant, the drawback of having pliable metallic carrier that makes transportation difficult to carry out as encountered in prior techniques is overcome, and the manufacturing cost is educed by not requiring the use of costly metals as an etching resist layer.

A method of providing adhesion to a fluorinated polymer including exposing at least a portion of the surface of the fluorinated polymer to plasma discharge in an atmosphere containing an organic amine.

A range of carbon materials can be produced using lignin in combination with synthetic phenolic resins or naturally occurring lingo-cellulosic materials. The lignin, which is essentially a naturally occurring phenolic resin, has a carbon yield on pyrolysis similar to that of the synthetic resins, which aids processing. The lignin can be used as a binder phase for synthetic resin or lignocellulosic materials allowing the production of monolithic carbons from a wide range of precursors, as the primary structural material where the thermal processing is modified by the addition of small quantities of synthetic resin materials or as structure modified in the production of meso/macro porous carbons in either bead, granular or monolithic form. A carbonised monolith is provided comprising mesoporous and/or macroporous carbon particles dispersed in a matrix of microporous carbon particles with voids between the particles defining paths for fluid to flow into and through the structure. The monolith may take the form of a shaped body having walls defining a multiplicity of internal transport channels for fluid flow, the transport channels being directed along the extrusion direction. The monolith may be made by carbonising a shaped phenolic body based on phenolic resin precursors. In a method for producing such a carbonisable shaped resin body solid particles of a first phenolic resin are provided which is partially cured so that the particles are sinterable but do not melt on carbonisation. The particles of the first phenolic resin are mixed with particles of a second phenolic resin that has a greater degree of cure than said first phenolic resin and has a mesoporous and/or macroporous microstructure that is preserved on carbonisation. The resulting mixture is formed into a dough e.g. by mixing the resin particles with methyl cellulose, PEO and water, after which the dough is extruded to form a shaped product and stabilising in its shape by sintering.

An organopolysiloxane composition for bonding to magnesium alloys comprises (A) 100 parts by weight of an organopolysiloxane of the following general formula (1) and/or (2)

wherein R may be the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of at least 10, X represents an oxygen atom or an alkylene group having 2 to 5 carbon atoms, and m independently represents an integer of 0 or 1, (B) 0.1 to 50 parts by weight of an organosilicon compound having at least three hydrolyzable groups bonded to silicon atoms in one molecule and/or a partial hydrolyzate thereof, and (C) 0.1 to 15 parts by weight of an acidic silane coupling agent.

A thin film transistor (TFT) array panel structure and a fabrication method thereof are provided. The method includes the following steps. An insulating substrate is provided, on which a first metal layer is deposited to form a plurality of gate electrodes, a plurality of lower electrodes of storage capacitors, a plurality of scan lines, and a plurality of scan line pads with a first mask process. A TFT island region is formed with a second mask process. Drain electrodes and source electrodes of the TFT, upper electrodes of storage capacitors, pixel electrodes, data lines and data line pads are formed, and a plurality of pixel display regions is defined with a third mask process. The pattern of a passivation layer is defined with a fourth mask. A second metal layer in the pixel display region is removed by selective etching.

An optical fiber manufacturing apparatus for manufacturing an optical fiber by drawing a optical fiber preform, including: a drawing furnace having therein a muffle tube into which the optical fiber preform is inserted and heating the optical fiber preform; and a first seal member which is disposed at an insert side of the drawing furnace so as to be coaxial with the drawing furnace and which seals the optical fiber preform inserted into an opening formed at the center thereof, wherein the first seal member includes a plurality of inner-circumference slits formed in the inner circumference thereof and a plurality of outer-circumference slits formed in the outer circumference thereof.

A transmission line device includes first and second transmission lines. The first transmission line includes a first electrode pad that is electrically connected to a first signal conductor pattern, and a second electrode pad and a third electrode pad that are portions of a first ground conductor pattern. The second transmission line includes a fourth electrode pad that is electrically connected to a second signal conductor pattern, and a fifth electrode pad and a sixth electrode pad that are portions of a second ground conductor pattern. The first electrode pad is between the second electrode pad and the third electrode pad, and the fourth electrode pad is between the fifth electrode pad and the sixth electrode pad. The second electrode pad and the third electrode pad are larger than the first electrode pad, and the fifth electrode pad and the sixth electrode pad are larger than the fourth electrode pad.

A method for preparing a metal coating on the surface of a magnesium alloy, the method comprising the following steps: (1) performing pretreatment on the surface of the magnesium alloy; (2) performing pre-electroless nickel plating on the surface of the pre-treated magnesium alloy; The surface of the magnesium alloy after electroless nickel plating is thickened by electroless nickel plating or electroplated with other metals. The method of the present invention improves the bonding force between the pre-plating layer and the magnesium alloy substrate, and is tested by standard methods, and the bonding force between the pre-plating nickel layer and the substrate is good, reaching the national standard; further thickening the electroless nickel plating or electroplating on the pre-nickel layer For other metals, a metal decorative protective coating with strong bonding force and high corrosion resistance can be obtained.

The invention provides an array substrate and chip bonding method, the array substrate comprising: an active area, and a bonding area located around the active area, wherein the bonding area is provided with an input terminal group, a first output terminal group and a second output terminal a group; the first output terminal group is located at a side of the input terminal group away from the active area, and the second output terminal group is located between the first output terminal group and the input terminal group; when bonding chips, the first output terminal group or the second output terminal group is selected to cooperate with the input terminal group for chip bonding according to the chip type. By simultaneously providing the first and second output terminal groups, the bonding of the second type chip increases the distance between the chip and the edge of the array substrate.

The present application provides a gas-generating aqueous fluid containing a gas-generating compound like an azo compound, and an organic amine like a primary, secondary or tertiary amine, a hydrazine, a hydrazide, or a semicarbazide. The aqueous fluid may also a viscosifler, and a foaming surfactant. The present application also provides a method of using the gas-generating composition to modulate density of a wellbore fluid for use in downhole applications. The method optionally includes adding an oxidizer to the wellbore fluid.

The invention relates to the field of shoe part bonding, and discloses a training shoe gluing device. The device comprises a rack and an air cylinder fixed to the rack, a piston rod of the air cylinder is coaxially connected with a wedge-shaped block which is in horizontal sliding connection with the rack, the rack is fixedly provided with a glue box and a workbench located below the glue box, andthe glue box is located on the lower side of the wedge-shaped block; a first piston plate is vertically and slidably connected with the interior of the glue box, and a wedge-shaped rod which is vertically and slidably connected with the rack is arranged between the first piston plate and the wedge-shaped block; the wedge-shaped rod is in sliding fit with the glue box, and an elastic piece is arranged between the upper surface of the first piston plate and the top wall of the inner side of the glue box; a glue outlet is formed in the bottom of the glue box, and a pressure valve is arranged atthe glue outlet; the rack is rotationally connected with a fixed pulley set, and the fixed pulley set comprises a first fixed pulley, a second fixed pulley and a pull rope; the rack is transversely and slidably connected with a roller between the glue box and the workbench, and the two ends of the pull rope are fixedly connected with the wedge-shaped rod and the roller respectively. According to the scheme, the device is used for gluing training shoes, and waste of glue can be reduced.